Abstract: An apparatus for increasing sharpness is provided. The apparatus according to an exemplary embodiment of the present disclosure can improve sharpness of an image by applying different sharpness gains to a center of the image and to a periphery of the image.

Abstract: A chip stack embedded package includes a first dielectric layer having a multistep cavity therein, a first plurality of semiconductor chips disposed in a first level of the multistep cavity, a second plurality of semiconductor chips disposed in a second level of the multistep cavity, and a second dielectric layer filling the multistep cavity to cover the first and second pluralities of semiconductor chips.

Abstract: The stack package includes a substrate body layer having a top surface and a bottom surface, first circuit patterns disposed on the bottom surface of the substrate body layer, second circuit patterns disposed on the top surface of the substrate body layer, a first semiconductor chip including first bumps, and a second semiconductor chip including second bumps. The first bumps extend through the substrate body layer to be electrically coupled to the first circuit patterns, and the second bumps extend past sidewalls of the first semiconductor chip to be electrically coupled to the second circuit patterns. The second semiconductor chip is stacked on the first semiconductor chip.

Abstract: A chip stack embedded package includes a first dielectric layer having a multistep cavity therein, a first plurality of semiconductor chips disposed in a first level of the multistep cavity, a second plurality of semiconductor chips disposed in a second level of the multistep cavity, and a second dielectric layer filling the multistep cavity to cover the first and second pluralities of semiconductor chips.

Abstract: An embedded package in which active elements, such as semiconductor chips, are embedded within a package substrate. The semiconductor chips, embedded within a dielectric layer, are coupled with circuit wires to ensure electrical and signal continuity. When connections between the semiconductor chip and the package substrate are performed in different directions, there is a reduction in overall interconnection area, connection reliability is improved, leakage currents are reduced, and higher device yields can be realized.

Abstract: The present invention relates to a programmable location control encoder, wherein the encoder has a new function of combining a sequential control function to conventional rotary encoders. The present invention comprises: a rotary disk having an absolute location code indicative of each location, that is, an address code formed by a combination of binary numbers; an optical sensor for detecting said binary address code; a signal amplification unit for amplifying an output signal of the optical sensor; and a control circuit board for outputting a digital signal by using a signal outputted from the signal amplification unit. According to the present invention, it is possible to convert a partition angle or a location control code by configuring a software resolution, and to maximize work efficiency by combining a sequential control function to conventional rotary encoders.

Abstract: The purpose of the present invention is to provide a cutting insert which can minimize friction with a chip and maximize heat-radiating performance. To this end, the present invention provides a cutting insert comprising: an upper surface; a lower surface; a plurality of lateral surfaces for connecting the upper surface with the lower surface; a main cutting edge formed between the lateral surface and the upper surface; and a main cutting edge land and a main cutting edge incline formed in series between the main cutting edge and the upper surface, wherein the main cutting edge incline has a first wavy shape in which two or more incline convex parts and two or more incline concave parts are repeated from the main cutting edge land toward the upper surface.

Abstract: An embedded package includes a first semiconductor chip embedded in a package substrate, a second semiconductor chip disposed over a first surface of the package substrate, and a group of external connection joints disposed on the first surface of the package substrate and between a sidewall of the second semiconductor chip and an edge of the embedded package. Related memory cards and related electronic systems are also provided.

Abstract: The present invention relates to a cutting insert. The cutting insert, according to one embodiment of the present invention, comprises: a top surface; a bottom surface; side surfaces which connect the top surface and the bottom surface to each other; a hole which penetrates the top surface and the bottom surface; and cutting edges which are defined by the top surface and the side surfaces, wherein a main cutting edge side surface among the side surfaces is provided with a first relief surface, a transition surface extending from the first relief surface, and a second relief surface extending from the transition surface, the first relief surface is formed such that the relief angle or the relief surface width varies along the cutting edge, and the transition surface is provided with a plurality of ridges in order to reinforce the rigidity of the cutting edge.

Abstract: Provided are a solar cell and a method of manufacturing the same. The method of manufacturing the solar cell includes stacking a solar cell device layer containing GaN on a sacrificial substrate, etching the solar cell device layer to expose the sacrificial substrate, thereby forming one or more solar cell devices comprising the solar cell device layer, anisotropically etching the exposed sacrificial substrate, contacting the solar cell devices to a stamping processor to remove the solar cell devices from the sacrificial substrate, and transferring the solar cell devices onto a receiving substrate. A high temperature semiconductor process may be performed on a substrate such as a silicon substrate to transfer the solar cell devices onto the substrate, thereby manufacturing flexible solar cells. Also, a large number of solar cells may be excellently aligned on a large area. In addition, economical solar cells may be manufactured.

Abstract: Provided are methods and compositions for use in therapy, and in particular for treating cancer, preferably drug-resistant cancer, and/or radiation resistant cancer. The compounds may be used for reducing tumor size in a mammalian subject and for inducing apoptosis in a tumor cell. The methods are effective on tumor cells that are resistant to drugs such as temozolomide, doxorubicin, and geldanamycin, as well as non-resistant tumor cells. Further provided are barbiturate and thiobarbiturates diene compounds for use in treating cancer, and uses, methods and compositions relating to these compounds.

Abstract: An electronic device package includes a bump having a post disposed on a contact portion of a semiconductor chip and an enlarged portion laterally protruded from an upper portion of the post; an interconnection portion having a locking portion that substantially surrounds the enlarged portion and an upper sidewall of the post; and a dielectric layer substantially surrounding the bump and the locking portion to separate the interconnection portion from the semiconductor chip.

Abstract: A structure to connect a refrigerant pipe and an air conditioner having the same, the connecting structure enabling a refrigerant pipe to be easily connected to an indoor unit or an outdoor unit of an air conditioner and including a refrigerant pipe through which refrigerant flows, a socket part connected to one end of the refrigerant pipe, and a coupling nut coupled to an outer circumferential surface of the socket part, wherein, a socket part is provided with a grip-ring allowing the refrigerant pipe to move in a first direction in which the refrigerant pipe is coupled to the socket part and preventing the refrigerant pipe from moving in a second direction in which the refrigerant pipe is separated from the socket part, and at least one O-ring configured to prevent refrigerant from leaking at the socket part.

Abstract: A system for detecting and diagnosing a faultive state of an airplane engine, including: at least one vibration sensor attached to an airplane; a reference model database construction unit; and a fault detection and diagnosis unit which estimates a parameter of a model, obtains a test variable and a numerator coefficient value difference of a transfer function between the models, and the covariance of parameter estimation error, and diagnoses the faultive state and the faultive cause of the airplane engine. Accordingly, the present invention can determine the faultive state and the detective cause of the airplane engine using the vibration data of the airplane engine.

Abstract: Embedded packages are provided. The embedded package includes a chip attached to a first surface of a core layer, a plurality of bumps on a surface of the chip opposite to the core layer, and a first insulation layer surrounding the core layer, the chip and the plurality of bumps. The first insulation layer has a trench disposed in a portion of the first insulation layer to expose the plurality of bumps.

Abstract: An electronic device package includes a bump having a post disposed on a contact portion of a semiconductor chip and an enlarged portion laterally protruded from an upper portion of the post; an interconnection portion having a locking portion that substantially surrounds the enlarged portion and an upper sidewall of the post; and a dielectric layer substantially surrounding the bump and the locking portion to separate the interconnection portion from the semiconductor chip.

Abstract: Disclosed are a method for inducing a prediction motion vector and an apparatus using the same. An image decoding method can include: a step of determining the information related to a plurality of spatial candidate prediction motion vectors from peripheral predicted blocks of a predicted target block; and a step of determining the information related to temporal candidate prediction motion vectors on the basis of the information related to the plurality of spatial candidate prediction motion vectors. Accordingly, the present invention can reduce complexity and can enhance coding efficiency when inducing the optimum prediction motion vector.

Abstract: Disclosed are an intra prediction mode encoding and decoding method, an image decoding device, and an image encoding device. The intra prediction mode decoding method comprises the steps of: deriving most probable modes (MPMs) from surrounding prediction units adjacent to a current prediction unit; and deriving an intra prediction mode of the current prediction unit on the basis of an MPM flag indicating whether an MPM having the same prediction mode as the intra prediction mode of the current prediction unit exists among the derived MPMs.

Abstract: An apparatus for generating/decoding an animated image code, and a method thereof. The animated image code frame includes an image code frame which is divided into code cells expressing minimum unit data, and in which the minimum unit data is expressed in an area located inside the code cells and is formed by combining one or more color, gradation, and patterns; and a design layer which is formed by combining color or gradation used in the image code frame and color or gradation distinguishable on the basis of a threshold value, and which is displayed by overlapping the frame image. By utilizing changes in respective animated frames, an animated image code can be generated and decoded in which motion can be expressed by using a display medium.

Abstract: A cutting insert, and more particularly, an improved double-sided cutting insert is provided, which provides improved machinability obtained due to increased rake angle, without compromising coupling state. The double-sided cutting insert includes a top surface, a bottom surface, a plurality of lateral relief surfaces connecting the top and bottom surfaces, and a cutting edge formed by the top and bottom surfaces and the plurality of lateral relief surfaces, in which one or more lateral relief surfaces of the plurality of lateral relief surfaces are formed into three stages in sequence which are a first positive surface, a negative surface and a second positive surface in a direction from the top surface to the bottom surface.