Patents by Inventor Sang-Yong Tak

Sang-Yong Tak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10689482
    Abstract: The present invention relates to an alkoxysilylated epoxy compound, a composite exhibiting good heat resistance properties, low CTE and high glass transition temperature and not requiring a coupling agent, a composition including the same, a cured product formed of the composition, a use of the cured product, and a method of preparing the epoxy compound having alkoxysilyl group. An epoxy compound having an epoxy group and an alkoxysilyl group, a composition including the epoxy compound, a curing agent, a filler and/or a reaction catalyst, a cured product of the composition, and a use of the composition including an electronic part are provided. In a composite and/or cured product, the epoxy composition exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg-less. The cured product exhibits good flame retardant properties by the introduction of the alkoxysilyl group.
    Type: Grant
    Filed: April 2, 2013
    Date of Patent: June 23, 2020
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee Chun, Su-Jin Park, Sang-Yong Tak, Yun-Ju Kim, Sook-Yeon Park, Sung-Hwan Park
  • Patent number: 10597412
    Abstract: The present invention relates to a novel epoxy compound, a method for preparing same, a composition and cured product comprising same, and use thereof, wherein the compound shows excellent heat-resistant properties—specifically, a low thermal expansion property and a high glass transition temperature (including Tg-less which does not show a glass transition temperature), a flame retardant property and processability—specifically, a viscosity-control property, does not require a separate silane coupling agent, and has improved brittleness in a composite. According to one aspect of the present invention, provided are: an epoxy compound having at least one non-reactive silyl group, alkenyl group or combination thereof together with at least two epoxy groups and at least one alkoxysilyl group; a method for preparing the epoxy compound through alkoxysilylation and alkylsilylation; an epoxy composition comprising same; and a cured product.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: March 24, 2020
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Sang-Yong Tak, Hyun-Aee Chun, Yun-Ju Kim, Sung-Hwan Park, Su-Jin Park, Sook-Yeon Park, Hak-Jun Lee
  • Patent number: 10519274
    Abstract: A new novolac curing agent with an alkoxysilyl group exhibiting excellent heat resistance such as a low CTE and an high Tg when a composite is formed, a preparing method of the same, a composition including the same, a cured article, and an use thereof, are provided. The new novolac curing agent having an alkoxysilyl group of Formulae I-1 to I-4, a preparing method of the new novolac curing agent by alkenylation and alkoxysilylation of the novolac curing agent, a preparing method of the new novolac curing agent by alkoxysilylation of a novolac curing agent, a composition including a novolac curing agent having an alkoxysilyl group of Formulae I-1 to I-4, a cured article and a use thereof, are provided. A composite including a novel novolac curing agent having an alkoxysilyl group exhibits a low CTE and a high glass transition temperature.
    Type: Grant
    Filed: January 9, 2015
    Date of Patent: December 31, 2019
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee Chun, Yun-Ju Kim, Su-Jin Park, Sook-Yeon Park, Sang-Yong Tak, Sung-Hwan Park
  • Patent number: 10428176
    Abstract: The present invention relates to: a thermosetting alkoxysilyl compound (hereinafter, referred to as “alkoxysilyl compound”) having two or more alkoxysilyl groups showing excellent heat-resistance characteristics in a composite; a composition and a cured product comprising the same; a use thereof; and a method for preparing an alkoxysilyl compound. The composition of an alkoxysilyl compound, comprising a novel alkoxysilyl compound according to the present invention shows, in a composite, improved heat-resistance characteristics, i.e., an effect of decreasing the CTE of the composition of an alkoxysilyl compound and not showing a glass transition temperature (hereinafter, referred to as “Tg-less”). Further, the cured product comprising an alkoxysilyl compound according to the present invention shows excellent flame retardant properties due to the alkoxysilyl groups.
    Type: Grant
    Filed: December 9, 2014
    Date of Patent: October 1, 2019
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee Chun, Sung-Hwan Park, Yun-Ju Kim, Su-Jin Park, Sook-Yeon Park, Sang-Yong Tak
  • Publication number: 20180155370
    Abstract: The present invention relates to: a thermosetting alkoxysilyl compound (hereinafter, referred to as “alkoxysilyl compound”)having two or more alkoxysilyl groups showing excellent heat-resistance characteristics in a composite; a composition and a cured product comprising the same; a use thereof; and a method for preparing an alkoxysilyl compound. The composition of an alkoxysilyl compound, comprising a novel alkoxysilyl compound according to the present invention shows, in a composite, improved heat-resistance characteristics, i.e., an effect of decreasing the CTE of the composition of an alkoxysilyl compound and not showing a glass transition temperature (hereinafter, referred to as “Tg-less”). Further, the cured product comprising an alkoxysilyl compound according to the present invention shows excellent flame retardant properties due to the alkoxysilyl groups.
    Type: Application
    Filed: December 9, 2014
    Publication date: June 7, 2018
    Inventors: Hyun-Aee CHUN, Sung-Hwan PARK, Yun-Ju KIM, Su-Jin PARK, Sook-Yeon PARK, Sang-Yong TAK
  • Patent number: 9902803
    Abstract: The present invention relates to an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, low CTE and high glass transition temperature and not requiring a coupling agent, a composition including the same, a cured product formed of the composition, a use of the cured product, and a method of preparing the epoxy compound having alkoxysilyl group. An epoxy compound having an epoxy group and an alkoxysilyl group, a composition including the epoxy compound, a curing agent, a filler and/or a reaction catalyst, a cured product of the composition, and a use of the composition including an electronic part are provided. In a composite and/or cured product, the epoxy composition forms chemical bonds and exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less. The cured product exhibits good flame retardant property by the introduction of the alkoxysilyl group.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: February 27, 2018
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee Chun, Yun-Ju Kim, Su-Jin Park, Sook-Yeon Park, Sung-Hwan Park, Sang-Yong Tak
  • Patent number: 9896535
    Abstract: Disclosed are an epoxy compound having an alkoxysilyl group, a composite of which exhibits good heat resistant properties and/or a cured product of which exhibits good flame retardant properties, a method of preparing the same, a composition comprising the same, and a cured product and a use of the composition. An alkoxysilylated epoxy compound comprising at least one of Chemical Formula S1 substituent and at least two epoxy groups in a core, a method of preparing the epoxy compound by an allylation, a claisen rearrangement, an epoxidation and an alkoxysilylation, an epoxy composition comprising the epoxy compound, and a cured product and a use of the composition are provided. The composite of the disclosed exhibits improved chemical bonding, good heat resistant properties, a low CTE, a high glass transition temperature or Tg-less. The cured product of the composition exhibits good flame retardant properties.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: February 20, 2018
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee Chun, Sang-Yong Tak, Su-Jin Park, Yun-Ju Kim, Sung-Hwan Park
  • Patent number: 9732182
    Abstract: Provided are alkoxysilylated epoxy compounds, a composite of which exhibits good heat resistance properties, low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy without requiring separate coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including an epoxy group and at least one alkoxysilyl group of an S1 substituent selected from Formulae S11 to S15 or an S2 substituent selected from Formulae S21 to S25; a method for preparing the same by epoxy ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition, are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: August 15, 2017
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee Chun, Sung-Hwan Park, Yun-Ju Kim, Su-Jin Park, Sook-Yeon Park, Sang-Yong Tak
  • Patent number: 9725590
    Abstract: Provided are an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, particularly low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy and composition of which does not require additional silane coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including at least one alkoxysilyl group and at least two epoxy groups, a method for preparing the same by epoxide ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved. Thus, the composite exhibits good heat resistance properties and the cured product exhibits good flame retardancy.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: August 8, 2017
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee Chun, Yun-Ju Kim, Su-Jin Park, Sang-Yong Tak, Sung-Hwan Park, Kyung-Nam Kang, Sook-Yeon Park
  • Patent number: 9670309
    Abstract: A novolac epoxy compound having an alkoxysilyl group of which composite has low CTE and increase of glass transition temperature, and requiring no coupling agent, a production method thereof, an epoxy composition including the same and a cured article thereof, are provided. A novolac epoxy compound having an alkoxysilyl group of Formulae I-1 to I-4, a production method of the novolac epoxy compound having an alkoxysilyl group by the epoxidation, alkenylation and alkoxysilylation of a novolac epoxy compound, a production method of the novolac epoxy compound having an alkoxysilyl group by the epoxidation and alkoxysilylation of a novolac epoxy compound, an epoxy composition including the novolac epoxy compound having an alkoxysilyl group, and a cured article, are provided. The cured article, i.e., the composite of the epoxy composition has improved chemical bonding efficiency due to alkoxysilyl groups. Low CTE and high glass transition temperature are exhibited.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: June 6, 2017
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee Chun, Yun-Ju Kim, Sang-Yong Tak, Su-Jin Park, Sung-Hwan Park
  • Publication number: 20170066789
    Abstract: The present invention relates to a novel epoxy compound, a method for preparing same, a composition and cured product comprising same, and use thereof, wherein the compound shows excellent heat-resistant properties—specifically, a low thermal expansion property and a high glass transition temperature (including Tg-less which does not show a glass transition temperature), a flame retardant property and processability—specifically, a viscosity-control property, does not require a separate silane coupling agent, and has improved brittleness in a composite. According to one aspect of the present invention, provided are: an epoxy compound having at least one non-reactive silyl group, alkenyl group or combination thereof together with at least two epoxy groups and at least one alkoxysilyl group; a method for preparing the epoxy compound through alkoxysilylation and alkylsilylation; an epoxy composition comprising same; and a cured product.
    Type: Application
    Filed: February 17, 2015
    Publication date: March 9, 2017
    Inventors: Sang-Yong TAK, Hyun-Aee CHUN, Yun-Ju KIM, Sung-Hwan PARK, Su-Jin PARK, Sook-Yeon PARK, Hak-Jun LEE
  • Patent number: 9534075
    Abstract: Disclosed are an alkoxysilylated isocyanurate epoxy compound, a composite of which exhibiting low CTE and high glass transition temperature or Tg-less and/or a cured product of which exhibiting good flame retardant property, a method of preparing the same, a composition including the same, a cured product formed of the composition, and a use of the composition. An isocyanurate epoxy compound having an alkoxysilyl group and an epoxy group in a core; a method of manufacturing the epoxy compound by the epoxidation and alkoxysilylation of a starting material; an epoxy composition including the epoxy compound; and a cured product and a use thereof, are provided. A composite of the epoxy composition has improved bonding efficiency between alkoxysilyl group and filler and between alkoxysilyl groups, and has good heat resistance, low CTE, and high glass transition temperature or Tg-less. A cured product formed of the epoxy composition has good flame retardant property.
    Type: Grant
    Filed: November 1, 2012
    Date of Patent: January 3, 2017
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee Chun, Sang-Yong Tak, Su-Jin Park, Yun-Ju Kim, Sung-Hwan Park, Sook-Yeon Park
  • Publication number: 20160326299
    Abstract: A new novolac curing agent with an alkoxysilyl group exhibiting excellent heat resistance such as a low CTE and an high Tg when a composite is formed, a preparing method of the same, a composition including the same, a cured article, and an use thereof, are provided. The new novolac curing agent having an alkoxysilyl group of Formulae I-1 to I-4, a preparing method of the new novolac curing agent by alkenylation and alkoxysilylation of the novolac curing agent, a preparing method of the new novolac curing agent by alkoxysilylation of a novolac curing agent, a composition including a novolac curing agent having an alkoxysilyl group of Formulae I-1 to I-4, a cured article and a use thereof, are provided. A composite including a novel novolac curing agent having an alkoxysilyl group exhibits a low CTE and a high glass transition temperature.
    Type: Application
    Filed: January 9, 2015
    Publication date: November 10, 2016
    Inventors: Hyun-Aee CHUN, Yun-Ju KIM, Su-Jin PARK, Sook-Yeon PARK, Sang-Yong TAK, Sung-Hwan PARK
  • Publication number: 20160229948
    Abstract: Disclosed are an epoxy compound having an alkoxysilyl group, a composite of which exhibits good heat resistant properties and/or a cured product of which exhibits good flame retardant properties, a method of preparing the same, a composition comprising the same, and a cured product and a use of the composition. An alkoxysilylated epoxy compound comprising at least one of Chemical Formula S1 substituent and at least two epoxy groups in a core, a method of preparing the epoxy compound by an allylation, a claisen rearrangement, an epoxidation and an alkoxysilylation, an epoxy composition comprising the epoxy compound, and a cured product and a use of the composition are provided. The composite of the disclosed exhibits improved chemical bonding, good heat resistant properties, a low CTE, a high glass transition temperature or Tg-less. The cured product of the composition exhibits good flame retardant properties.
    Type: Application
    Filed: July 21, 2015
    Publication date: August 11, 2016
    Inventors: Hyun-Aee CHUN, Sang-Yong TAK, Su-Jin PARK, Yun-Ju KIM, Sung-Hwan PARK
  • Patent number: 9249126
    Abstract: An oxetane-cyclic epoxy compound represented by Formula 1: where R1 is hydrogen, a methyl group or an ethyl group.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: February 2, 2016
    Assignees: CHEIL INDUSTRIES, INC., KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Young Kwon Kim, Sang Keol Lee, Tae Ho Kim, Woo Jin Lee, Sung Kook Kim, Hyun Ae Jeon, Yun Joo Kim, Sang Yong Tak, Suk Yeon Park, Kyung Nam Kang
  • Publication number: 20150361211
    Abstract: Provided are alkoxysilylated epoxy compounds, a composite of which exhibits good heat resistance properties, low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy without requiring separate coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including an epoxy group and at least one alkoxysilyl group of an S1 substituent selected from Formulae S11 to S15 or an S2 substituent selected from Formulae S21 to S25; a method for preparing the same by epoxy ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition, are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved.
    Type: Application
    Filed: August 24, 2015
    Publication date: December 17, 2015
    Inventors: Hyun-Aee CHUN, Sung-Hwan PARK, Yun-Ju KIM, Su-Jin PARK, Sook-Yeon PARK, Sang-Yong TAK
  • Patent number: 9150686
    Abstract: Disclosed are an epoxy compound having an alkoxysilyl group, a composite of which exhibits good heat resistant properties and/or a cured product of which exhibits good flame retardant properties, a method of preparing the same, a composition comprising the same, and a cured product and a use of the composition. An alkoxysilylated epoxy compound comprising at least one of Chemical Formula S1 substituent and at least two epoxy groups in a core, a method of preparing the epoxy compound by an allylation, a claisen rearrangement, an epoxidation and an alkoxysilylation, an epoxy composition comprising the epoxy compound, and a cured product and a use of the composition are provided. The composite of the disclosed exhibits improved chemical bonding, good heat resistant properties, a low CTE, a high glass transition temperature or Tg-less. The cured product of the composition exhibits good flame retardant properties.
    Type: Grant
    Filed: February 25, 2014
    Date of Patent: October 6, 2015
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee Chun, Sang-Yong Tak, Su-Jin Park, Yun-Ju Kim, Sung-Hwan Park
  • Publication number: 20150247033
    Abstract: Provided are an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, particularly low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy and composition of which does not require additional silane coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including at least one alkoxysilyl group and at least two epoxy groups, a method for preparing the same by epoxide ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved. Thus, the composite exhibits good heat resistance properties and the cured product exhibits good flame retardancy.
    Type: Application
    Filed: September 17, 2013
    Publication date: September 3, 2015
    Inventors: Hyun-Aee Chun, Yun-Ju Kim, Su-Jin Park, Sang-Yong Tak, Sung-Hwan Park, Kyung-Nam Kang, Sook-Yeon Park
  • Publication number: 20150203626
    Abstract: A novolac epoxy compound having an alkoxysilyl group of which composite has low CTE and increase of glass transition temperature, and requiring no coupling agent, a production method thereof, an epoxy composition including the same and a cured article thereof, are provided. A novolac epoxy compound having an alkoxysilyl group of Formulae I-1 to I-4, a production method of the novolac epoxy compound having an alkoxysilyl group by the epoxidation, alkenylation and alkoxysilylation of a novolac epoxy compound, a production method of the novolac epoxy compound having an alkoxysilyl group by the epoxidation and alkoxysilylation of a novolac epoxy compound, an epoxy composition including the novolac epoxy compound having an alkoxysilyl group, and a cured article, are provided. The cured article, i.e., the composite of the epoxy composition has improved chemical bonding efficiency due to alkoxysilyl groups.
    Type: Application
    Filed: July 5, 2013
    Publication date: July 23, 2015
    Inventors: Hyun-Aee Chun, Yun-Ju Kim, Sang-Yong Tak, Su-Jin Park, Sung-Hwan Park
  • Publication number: 20150148452
    Abstract: There is provided a composition including an alkoxysilylated epoxy compound, a composition of which exhibits good heat resistance properties, low CTE and high glass transition temperature or Tg-less and not requiring a separate coupling agent, and inorganic particles, a cured product formed of the composition, and a use of the cured product. An epoxy composition including an alkoxysilylated epoxy compound and inorganic particles, an epoxy composition including an epoxy compound, inorganic particles and a curing agent, a cured product of the composition, and a use of the composition are provided. Since chemical bonds may be formed between the alkoxysilyl group and the inorganic particles and between the alkoxysilyl groups, a composition of the composition including the alkoxysilylated epoxy compound and the inorganic particles exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less.
    Type: Application
    Filed: February 15, 2013
    Publication date: May 28, 2015
    Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee Chun, Su-Jin Park, Sook-Yeon Park, Yun-Ju Kim, Sang-Yong Tak, Sung-Hwan Park, Kyung-Nam Kang