Patents by Inventor Sang-Yong Tak

Sang-Yong Tak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9034971
    Abstract: A composite sheet of the present invention comprises an oxetane-epoxy-based compound, represented by chemical formula 1, as a binder.
    Type: Grant
    Filed: May 7, 2012
    Date of Patent: May 19, 2015
    Assignees: Cheil Industries Inc., Korea Institute of Industrial Technology
    Inventors: Young Kwon Kim, Sang Keol Lee, Sung Han Im, Seok Won Choi, Sung Kook Kim, Hyun Ae Jeon, Yun Joo Kim, Sang Yong Tak, Suk Yeon Park, Kyung Nam Kang, So Young Kang
  • Publication number: 20150105493
    Abstract: The present invention relates to an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, low CTE and high glass transition temperature and not requiring a coupling agent, a composition including the same, a cured product formed of the composition, a use of the cured product, and a method of preparing the epoxy compound having alkoxysilyl group. An epoxy compound having an epoxy group and an alkoxysilyl group, a composition including the epoxy compound, a curing agent, a filler and/or a reaction catalyst, a cured product of the composition, and a use of the composition including an electronic part are provided. In a composite and/or cured product, the epoxy composition forms chemical bonds and exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less. The cured product exhibits good flame retardant property by the introduction of the alkoxysilyl group.
    Type: Application
    Filed: March 14, 2013
    Publication date: April 16, 2015
    Inventors: Hyun-Aee Chun, Yun-Ju Kim, Su-Jin Park, Sook-Yeon Park, Sung-Hwan Park, Sang-Yong Tak
  • Publication number: 20150051316
    Abstract: The present invention relates to an alkoxysilylated epoxy compound, a composite exhibiting good heat resistance properties, low CTE and high glass transition temperature and not requiring a coupling agent, a composition including the same, a cured product formed of the composition, a use of the cured product, and a method of preparing the epoxy compound having alkoxysilyl group. An epoxy compound having an epoxy group and an alkoxysilyl group, a composition including the epoxy compound, a curing agent, a filler and/or a reaction catalyst, a cured product of the composition, and a use of the composition including an electronic part are provided. In a composite and/or cured product, the epoxy composition exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg-less. The cured product exhibits good flame retardant properties by the introduction of the alkoxysilyl group.
    Type: Application
    Filed: April 2, 2013
    Publication date: February 19, 2015
    Inventors: Hyun-Aee Chun, Su-Jin Park, Sang-Yong Tak, Yun-Ju Kim, Sook-Yeon Park, Sung-Hwan Park
  • Publication number: 20140308527
    Abstract: Disclosed are an alkoxysilylated isocyanurate epoxy compound, a composite of which exhibiting low CTE and high glass transition temperature or Tg-less and/or a cured product of which exhibiting good flame retardant property, a method of preparing the same, a composition including the same, a cured product formed of the composition, and a use of the composition. An isocyanurate epoxy compound having an alkoxysilyl group and an epoxy group in a core; a method of manufacturing the epoxy compound by the epoxidation and alkoxysilylation of a starting material; an epoxy composition including the epoxy compound; and a cured product and a use thereof, are provided. A composite of the epoxy composition has improved bonding efficiency between alkoxysilyl group and filler and between alkoxysilyl groups, and has good heat resistance, low CTE, and high glass transition temperature or Tg-less. A cured product formed of the epoxy composition has good flame retardant property.
    Type: Application
    Filed: November 1, 2012
    Publication date: October 16, 2014
    Inventors: Hyun-Aee Chun, Sang-Yong Tak, Su-Jin Park, Yun-Ju Kim, Sung-Hwan Park, Sook-Yeon Park
  • Publication number: 20140187111
    Abstract: A composite sheet of the present invention comprises an oxetane-(meth)acrylate compound, represented by chemical formula I, as a binder.
    Type: Application
    Filed: May 8, 2012
    Publication date: July 3, 2014
    Inventors: Young Kwon Kim, Sang Keol Lee, Eun Hwan Jeong, Sung Kook Kim, Hyun Ae Jeon, Yun Joo Kim, Sang Yong Tak, Suk Yeon Park, Kyung Nam Kang, So Young Kang
  • Publication number: 20140179836
    Abstract: Disclosed are an epoxy compound having an alkoxysilyl group, a composite of which exhibits good heat resistant properties and/or a cured product of which exhibits good flame retardant properties, a method of preparing the same, a composition comprising the same, and a cured product and a use of the composition. An alkoxysilylated epoxy compound comprising at least one of Chemical Formula S1 substituent and at least two epoxy groups in a core, a method of preparing the epoxy compound by an allylation, a claisen rearrangement, an epoxidation and an alkoxysilylation, an epoxy composition comprising the epoxy compound, and a cured product and a use of the composition are provided. The composite of the disclosed exhibits improved chemical bonding, good heat resistant properties, a low CTE, a high glass transition temperature or Tg-less The cured product of the composition exhibits good flame retardant properties.
    Type: Application
    Filed: February 25, 2014
    Publication date: June 26, 2014
    Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee CHUN, Sang-Yong TAK, Su-Jin PARK, Yun-Ju KIM, Sung-Hwan PARK
  • Publication number: 20140142248
    Abstract: A composite sheet of the present invention comprises an oxetane-epoxy-based compound, represented by chemical formula 1, as a binder.
    Type: Application
    Filed: May 7, 2012
    Publication date: May 22, 2014
    Inventors: Young Kwon Kim, Sang Keol Lee, Sung Han Im, Seok Won Choi, Sung Kook Kim, Hyun Ae Jeon, Sang Yong Tak, Yun Joo Kim, Suk Yeon Park, Kyung Nam Kang, So Young Kang
  • Publication number: 20120289108
    Abstract: An oxetane-cyclic epoxy compound represented by Formula 1: where R1 is hydrogen, a methyl group or an ethyl group.
    Type: Application
    Filed: April 27, 2012
    Publication date: November 15, 2012
    Inventors: Young Kwon KIM, Sang Keol Lee, Tae Ho Kim, Woo Jin Lee, Sung Kook Kim, Hyun Ae Jeon, Yun Joo Kim, Sang Yong Tak, Suk Yeon Park, Kyung Nam Kang
  • Publication number: 20120041102
    Abstract: The present invention relates to a novel epoxy resin having improved heat-resistance, thermal expansion properties and processability, and to a thermosetting resin composition comprising the same. To this end, the present invention provides an epoxy resin of Chemical Formula 1 as disclosed in the Description, an epoxy resin composition comprising the same, and a packaging, substrate and transistor formed thereof. When a composition that contains an epoxy resin with a specific side functional group according to the present invention and/or an epoxy resin with a specific core structure is cured, a filler forms a strong chemical bond with the epoxy resin, thereby maximizing filling effects of the filler for the epoxy resin. Moreover, with the specific core structure, heat resistance and heat expansion properties of a cured product are substantially improved (CTE is reduced), and enhanced glass transition properties, strength and processability are demonstrated.
    Type: Application
    Filed: April 23, 2010
    Publication date: February 16, 2012
    Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee Chun, Seung-Han Shin, Hyun-Ah Kim, Chang-Ho Oh, Yun-Ju Kim, Sang-Yong Tak, Myong-Hoon Lee, Tae-Yun Kang