Abstract: Disclosed is a test pattern for a reliability measurement of a copper interconnection line having a moisture window and a method for manufacturing the same. The method includes the steps of: a first inter-layer insulation layer formed on the substrate; a plurality of bottom copper interconnection lines buried in the first inter-layer insulation layer; a second inter-layer insulation layer on the plurality of bottom copper interconnection lines and the first inter-layer insulation layer; a plurality of top copper interconnection lines filled in the second inter-layer insulation layer and connected to the plurality of bottom copper interconnection lines through the plurality of via contacts; and a passivation layer covering the plurality of top copper interconnection lines and having a plurality of moisture windows in which moistures are flown during an electro migration (EM) test.

Abstract: A method and associated algorithms for identifying and distinguishing geometric feature signals from defect signals in the NDE of longitudinal structures. The method includes the steps of collecting an interrogation signal (including reflected components) from a longitudinal structure under evaluation and comparing it with a selected reference signal from a known geometric feature maintained in a database. The comparison involves a determination of the signals phase. Same phase signals identify the source as a geometric feature, while opposite phase signals identify the source as a defect. The comparison involves the steps of gating each of the signals and creating an array of correlation values between points on each. The correlation values are analyzed and a determination (based on comparing maximum and minimum correlation values) is made of the signal phases. A reliability factor may be determined by comparison of the correlation values and the maximum and minimum thereof.

Abstract: Traveling equipment for a cleaner comprises: a traveling motor mounted to a cleaner head part and for generating a normal torque and a reverse torque; a traveling shaft penetrated and coupled to the traveling motor and supplied with the torque of the traveling motor; traveling wheels coupled to both sides of the traveling shaft; an operation mode selection means for selectively regulating the automatic back and forth operation function and manual function; a control means for outputting a control signal upon receiving a signal selected by the operation mode selection means; and a driving means for driving the traveling motor upon receiving the control signal of the control means. By this, the user's convenience is raised and the simplicity of the components is acquired.

Abstract: A vacuum cleaner set includes a vacuum cleaner and a cleaner mount. The vacuum cleaner includes a main body that is detachably mounted on a mount having a cord reel, a motor and a battery that are provided in the main body, an AC power source that is provided in the main body and connected to a power outlet by the cord reel, a charging device receiving power from the AC power source and charging the battery, and a control unit selecting one of power output from the battery and power output from the AC power source.

Abstract: A cleaner that can have the sufficient capability of collecting pollutant particles by a battery voltage as well as a AC voltage. The cleaner uses a switched reluctance motor to rotate a collecting fan. The switched reluctance motor is driven by a motor driver in one of a PWM mode or a pulse trigger mode. The motor driver drives the switched reluctance motor using one of the battery voltage and a DC voltage converted from the AC voltage, depending on whether the AC voltage is received. The PWM mode and the trigger mode are switched depending on whether the AC voltage is received. Accordingly, the cleaner makes it possible to reduce the time taken to clean up pollutant particles using the battery voltage to the time taken to clean up the pollutant particles using the AC voltage.

Abstract: A cleaner that can automatically respond to a change in an AC voltage and a voltage of a battery. In the motor, a motor for rotating a collecting fan is driven by a motor driver. The motor driver drives the motor using a voltage from a voltage selector. The voltage selector switches between a low-level voltage of the battery and a high-level voltage derived from the AC voltage to be supplied to the motor driver.

Abstract: Disclosed herein is a method for determining a frequency of a power brush in a vacuum cleaner. According to the method of the present invention, a mechanical oscillation frequency of a driving unit, which includes a brush body reciprocated within a range of prescribed angles, and a torsion bar for providing a prescribed elastic force to angular rotation of the brush body, is set equally to a driving frequency of a power supply unit, which drives the driving unit, or is set a prescribed percentage higher or lower than the driving frequency of the power supply unit, so that the driving unit can resonate. A large amount of movement is obtained using a small amount of power by means of the resonance.

Abstract: Disclosed is an apparatus and method for driving a 2-phase SRM capable of individually performing an initial driving by an initializing sensor and a normal driving by a driving sensor, and capable of controlling a rotation speed of the SRM by delaying a phase signal by a half period and then generating a pulse width modulation signal based on the period. The apparatus comprises: a driving sensor which detects a position of a rotor thus to generate a driving sensor signal based on a result of the detection; a microprocessor which generates a 1-phase signal and a 2-phase signal based on a rising time and a falling time of the driving sensor signal at the time of a normal driving; an oscillator which generates first and second pulse width modulation signals delayed by a preset time; and a multiplying unit which multiplies the 1-phase and 2-phase signals with the first and second pulse width modulation signals, and generates 1-phase and 2-phase driving signals based on a result of the multiplication.

Abstract: The present invention relates to a transformed Agrobacterium tumefaciens BNQ-pGPRX11 (Accession No. KCCM-10554) harboring a recombinant expression vector (pGPRX11). Further, the present invention also provides a fermentation method for maximum production of coenzyme Q10 using a transformed Agrobacterium tumefaciens deposited to Korean Culture Center of Microorganism with accession number KCCM-10554 comprising the steps of: i) constructing the recombinant expression vector pGPRX11 containing decaprenyl diphosphate synthase gene and 1-deoxy-D-xylulose 5-phosphate synthase gene (SEQ ID NO: 1); ii) preparing a transformed Agrobacterium tumefaciens (KCCM-10554) by harboring said recombinant expression vector pGPRX11 to the host of Agrobacterium tumefaciens BNQ 0605 (KCCM-10413); iii) growing the transformed cells on growth medium comprising 50 g/L of sucrose, 15 g/L of yeast extract, 15 g/L of peptone and 7.

Abstract: The present invention provides a newly isolated mutant culture of Actinoplanes teichomyceticus BNG 2315. This culture is capable of producing teicoplanin more than 60 times productivity than those reported before (e.g., Actinoplanes teichomyceticus nov. sp. ATCC 31121). The present invention also provides a fermentation process for the production of teicoplanin in an aerobic condition using the mutant strain Actinoplanes teichomyceticus BNG 2315 in a culture-medium comprising carbon sources, nitrogen sources and mineral salts.

Abstract: Disclosed herein is an upright vacuum cleaner with a swing brush. The upright vacuum cleaner comprises an upright cleaner body having a suction nozzle, a drive unit mounted in the cleaner body for moving the cleaner body forward or rearward, a grip unit slidably mounted to the upper end of the cleaner body, the grip unit having a sensor for sensing a sliding direction of the grip unit, a control unit for controlling the drive unit to be operated, such that the cleaner body is moved forward or rearward, based on information sensed by the sensor, a movement converting unit for converting a rotating movement of the drive unit to an angular reciprocating movement, and a swing brush connected to the movement converting unit for performing the angular reciprocating movement. The swing brush is mounted in a suction nozzle of the cleaner body while being in contact with the floor.

Abstract: The present invention provides a process for preparing vancomycin hydrochloride using a mutant strain of Amycolatopsis orientalis (accession No. KCCM-10836P) comprising the steps of i) mutating and isolating a strain of Amycolatopsis orientalis (accession No. KCCM-10836P) for producing vancomycin from mother strain of Amycolatopsis orientalis (accession No. ATCC-19795) using NTG(N-methyl-N?-nitro-N-nitrosoguanidine) in the selection medium; ii) seed culturing the isolated mutant strain of Amycolatopsis orientalis (accession No. KCCM-10836P); iii) cultivating and fermenting said mutant strain of Amycolatopsis orientalis in the fermentation medium consisting of 12˜18 (w/v) % of dextrin, 2.2˜3.8 (w/v) % of bean powder, 1.9˜2.9 (w/v) % of potato protein, 0.10˜0.

Abstract: Provided is a stack package using an anisotropic conductive film (ACF) for reducing thermal stresses exerted on chip scale packages (CSPs) during the initial manufacture of stack packages from a plurality of CSPs and for facilitating the repair and/or rework of stack packages incorporating CSPs while reducing the likelihood of damage to the CSPs. In the stack package including a plurality of CSPs stacked using an ACF, each CSP will typically include a circuit board, a semiconductor chip mounted on and electrically connected to the circuit board, and solder balls or other conductive structures arranged the semiconductor chip on the peripheral regions of the circuit board. Also provided are methods for the initial production of such stack packages and supplemental methods for the repair and rework of such stack packages.

Abstract: Provided is a method of bonding a wire of a semiconductor package, by which a loop height may be reduced and/or a bonding reliability may be enhanced. In the method, a ball bump may be formed on a bonding pad on a semiconductor chip using a capillary through which a wire may be supplied. The wire may then be cut from the ball bump using the capillary. Subsequently, the capillary may be moved to an interconnection corresponding to the bonding pad of the semiconductor chip to perform stitch bonding of the wire supplied through the capillary on the interconnection. The capillary may again be moved to the ball bump formed on the bonding pad to bond the wire on the ball bump.

Abstract: In example embodiments of the present invention, a structure of a BGA semiconductor chip package includes a substrate having first and second surfaces, a semiconductor chip having a plurality of bonding pads, and mounted on the first surface of the substrate, and plurality of in/out (I/O) solder balls and dummy solder balls provided on the second surface of the substrate, wherein the I/O solder balls are electrically connected to the semiconductor chip and the dummy solder balls are electrically isolated from the semiconductor chip, and the I/O solder balls and the dummy solder balls have the same ball size and ball pitch and are uniformly provided over the second surface of the substrate.

Abstract: A power control apparatus for a motor is disclosed. The power control apparatus includes: a moisture sensor for detecting moisture soaking into a housing including the motor; and a switching unit which is switched by an output signal of the moisture sensor, and switches on or off an AC power-supply signal applied to a driver circuit for providing the motor with a drive power-supply signal. Therefore, if moisture soaks into the suction apparatus including the motor, the AC power-supply signal applied to the driver circuit is blocked due to the moisture, such that a user can be protected from electric shock.

Abstract: Provided is a stack package using an anisotropic conductive film (ACF) for reducing thermal stresses exerted on chip scale packages (CSPs) during the initial manufacture of stack packages from a plurality of CSPs and for facilitating the repair and/or rework of stack packages incorporating CSPs while reducing the likelihood of damage to the CSPs. In the stack package including a plurality of CSPs stacked using an ACF, each CSP will typically include a circuit board, a semiconductor chip mounted on and electrically connected to the circuit board, and solder balls or other conductive structures arranged the semiconductor chip on the peripheral regions of the circuit board. Also provided are methods for the initial production of such stack packages and supplemental methods for the repair and rework of such stack packages.

Abstract: Provided is a stack package using an anisotropic conductive film (ACF) for reducing thermal stresses exerted on chip scale packages (CSPs) during the initial manufacture of stack packages from a plurality of CSPs and for facilitating the repair and/or rework of stack packages incorporating CSPs while reducing the likelihood of damage to the CSPs. In the stack package including a plurality of CSPs stacked using an ACF, each CSP will typically include a circuit board, a semiconductor chip mounted on and electrically connected to the circuit board, and solder balls or other conductive structures arranged the semiconductor chip on the peripheral regions of the circuit board. Also provided are methods for the initial production of such stack packages and supplemental methods for the repair and rework of such stack packages.

Abstract: A method for manufacturing a semiconductor chip package may include screen printing an adhesive on a substrate using a screen printing mask. The adhesive may be heated during a first curing process. A semiconductor chip may be attached to the adhesive on the substrate. The adhesive may be heated during a second curing process. The physical property of the adhesive may be transformed before and after a screen printing process to improve the operational performance and/or quality of the adhesive.

Abstract: A method and system for implementing magnetostrictive sensor techniques for the nondestructive evaluation of pipeline structures. The system consists of a magnetostrictive sensor instrument unit, a data storage unit, and a plurality of magnetostrictive sensor probes are positioned on an in-line inspection vehicle. The instrumentation unit includes electronics for transmitting excitation pulses to a transmitting magnetostrictive sensor probe as well as electronics for amplifying and conditioning the signals detected by a receiving magnetostrictive sensor probe. The magnetostrictive sensor probes include both plate magnetostrictive sensors and permanent magnets which provide a DC bias magnetic field necessary for magnetostrictive sensor operation. The transmitting and receiving probes are attached to the in-line inspection vehicle by way of mechanical arms on opposing sides of the vehicle.