Abstract: A cigarette filter which includes lyocell tow made of a plurality of lyocell fibers and a binder configured to bond the lyocell fibers to each other and has a hardness of 85% or higher is provided. According to one embodiment of the present disclosure, the cigarette filter has a hardness of 80% or higher even 5 minutes after 20 parts by weight to 25 parts by weight of water is added thereto based on 100 parts by weight of the lyocell tow. According to one embodiment of the present disclosure, the cigarette filter has a degree of collapse due to moisture of 7% or lower. According to one embodiment of the present disclosure, the cigarette filter overcomes existing, material-related problems of lyocell tow and has a high hardness and a low degree of collapse due to moisture.

Abstract: A semiconductor device includes a via pattern in a first interlayer insulating film, and a wiring pattern that extends in a first direction and is on the first interlayer insulating film and the via pattern. The wiring pattern includes a lower wiring line and an upper wiring line on the lower wiring line, where the lower wiring line and the upper wiring line are stacked in a second direction, where the lower wiring line is between the via pattern and the upper wiring line and is on an upper surface of the via pattern, where a first portion of the lower wiring line is on the upper surface of the via pattern and has a first thickness, and where a second portion of the lower wiring line is on an upper surface of the first interlayer insulating film and has a second thickness.

Abstract: A method of providing a video stream based on machine learning in an electronic device according to various example embodiments may include receiving a source video stream which is streamed from a first device to at least one other device, confirming whether an event is detected on the source video stream using a learning model trained through machine learning on the basis of at least one frame of the source video stream, and determining whether to restrict streaming of the source video stream from the first device on the basis of the event detection. In addition to the method, other example embodiments are possible.

Abstract: A slurry supply device includes a slurry tank for storing slurry; a temperature controller for supplying hot or cold water to the slurry tank to control the temperature of the slurry; and a double pipe for supplying the slurry to the slurry tank while being connected to the slurry tank and for allowing hot or cold water to move to control the temperature of the slurry.

Abstract: Disclosed is a substrate processing apparatus in which weight of a buffer module may be reduced compared to the apparatus in the related art.

Abstract: Provided is a stack molding machine including an upper mold having formed therein a first runner and a first gate serving as a path of a resin material, a first intermediate plate provided under and combined with the upper mold, and having formed therein a first molding connected to the first gate to mold at least a portion on a first substrate placed under the first intermediate plate, a dummy plate provided under and spaced a certain distance apart from the first intermediate plate, a second intermediate plate provided under the dummy plate, and having formed therein a second molding connected to a second gate to mold at least a portion under a second substrate placed under the dummy plate, and a lower mold having formed therein a second runner and the second gate serving as a path of the resin material, and combined with the second intermediate plate.

Abstract: A lithium ion secondary battery system includes a chamber to accommodate a lithium ion secondary battery, a charging/discharging device for electrically charging and discharging the lithium ion secondary battery, a pressure plate disposed in the chamber and configured to press the lithium ion secondary battery when the lithium ion secondary battery is electrically charged, a pointed portion disposed in the chamber and configured to bore a hole in a pouch of the lithium ion secondary battery to enable gas generated during the electrical charging of the lithium ion secondary battery to be removed from the pouch, and a sealer configured to seal the pouch after the gas is removed.

Abstract: A femtosecond laser source according to an embodiment of the present invention includes: a pulse generator that converts a continuous wave laser into an optical pulse train; a burst generator that separates the optical pulse train into a plurality of burst pulses; a pulse amplification and spectral broadening unit that expands the spectrum by amplifying a plurality of burst pulses; and a pulse compressor that compresses a plurality of amplified burst pulses to generate a femtosecond laser with a pulse width of 1 picosecond (10?12 s) or less.

Abstract: A method of controlling the sensor cleaning system includes detecting contamination of an environmental sensor, determining a contamination source of the contamination when contamination of the environmental sensor is detected, and adjusting operation of an air cleaning system of the sensor cleaning system based on the determined contamination source.

Abstract: An apparatus for analyzing a substance of an object in a non-invasive manner is provided. The apparatus for analyzing a substance of an object includes: a sensor part including an image sensor, and a plurality of light sources disposed around the image sensor; and a processor configured to drive the plurality of light sources to obtain absorbance of each pixel of the image sensor based on an intensity of light received by each pixel, to correct the absorbance of each pixel based on a distance between the plurality of light sources and each pixel, and to analyze a substance of an object based on the corrected absorbance of each pixel.

Abstract: Integrated circuit devices including a via and methods of forming the same are provided. The methods may include forming a conductive wire structure on a substrate. The conductive wire structure may include a first insulating layer and a conductive wire stack in the first insulating layer, and the conductive wire stack may include a conductive wire and a mask layer stacked on the substrate. The method may also include forming a recess in the first insulating layer by removing the mask layer, the recess exposing the conductive wire, forming an etch stop layer and then a second insulating layer on the first insulating layer and in the recess of the first insulating layer, and forming a conductive via extending through the second insulating layer and the etch stop layer and contacting the conductive wire.

Abstract: A fuel cell system includes: an oxygen concentration module to produce oxygen-enriched air by separating nitrogen from air, and a first air supply line connected to the oxygen concentration module to supply air to the oxygen concentration module. The fuel cell system further includes: a heating unit provided in the first air supply line to selectively heat air by using waste heat discharged from an external heat source provided outside a fuel cell stack, a second air supply line connected to the oxygen concentration module and configured to supply air to the oxygen concentration module independently of the first air supply line, a cooling unit provided in the second air supply line and configured to selectively cool air by using outside cold energy, and a stack connection line which connects the oxygen concentration module and the fuel cell stack and supplies the oxygen-enriched air to the fuel cell stack.

Abstract: There is provided a semiconductor device capable of improving the performance and reliability of a device. The semiconductor device may include a first interlayer insulating film containing therein a plurality of pores, a first line structure in the first interlayer insulating film, an inserted insulating film extending along and on a upper surface of the first interlayer insulating film and in contact with the first interlayer insulating film, a barrier insulating film in contact with the inserted insulating film and extending along an upper surface of the inserted insulating film and an upper surface of the first line structure, a second interlayer insulating film on the barrier insulating film and a second line structure disposed in the second interlayer insulating film and connected to the first line structure.

Abstract: A femtosecond laser source according to an embodiment of the present invention includes: a pulse generator that converts a continuous wave laser into an optical pulse train; a burst generator that separates the optical pulse train into a plurality of burst pulses; a pulse amplification and spectral broadening unit that expands the spectrum by amplifying a plurality of burst pulses; and a pulse compressor that compresses a plurality of amplified burst pulses to generate a femtosecond laser with a pulse width of 1 picosecond (10?12 s) or less.

Abstract: Integrated circuit devices including a via and methods of forming the same are provided. The methods may include forming a conductive wire structure on a substrate. The conductive wire structure may include a first insulating layer and a conductive wire stack in the first insulating layer, and the conductive wire stack may include a conductive wire and a mask layer stacked on the substrate. The method may also include forming a recess in the first insulating layer by removing the mask layer, the recess exposing the conductive wire, forming an etch stop layer and then a second insulating layer on the first insulating layer and in the recess of the first insulating layer, and forming a conductive via extending through the second insulating layer and the etch stop layer and contacting the conductive wire.

Abstract: An integrated circuit device includes a metal film and a complex capping layer covering a top surface of the metal film. The metal film includes a first metal, and penetrates at least a portion of an insulating film formed over a substrate. The complex capping layer includes a conductive alloy capping layer covering the top surface of the metal film, and an insulating capping layer covering a top surface of the conductive alloy capping layer and a top surface of the insulating film. The conductive alloy capping layer includes a semiconductor element and a second metal different from the first metal. The insulating capping layer includes a third metal.

Abstract: A semiconductor may include a first inter metal dielectric (IMD) layer, a first blocking layer on the first IMD layer, a metal wiring and a second blocking layer. The first inter metal dielectric (IMD) layer may be formed on a substrate, the first IMD layer may include a low-k material having a dielectric constant lower than a dielectric constant of silicon oxide. The first blocking layer may be formed on the first IMD layer. The first blocking layer may include an oxide having a dielectric constant higher than the dielectric constant of the first IMD layer. The metal wiring may be through the first IMD layer and the first blocking layer. The second blocking layer may be formed on the metal wiring and the first blocking layer. The second blocking layer may include a nitride. The first and second blocking layers may reduce or prevent from the out gassing, so that a semiconductor device may have good characteristics.

Abstract: Provided is a stack molding machine including an upper mold having formed therein a first runner and a first gate serving as a path of a resin material, a first intermediate plate provided under and combined with the upper mold, and having formed therein a first molding connected to the first gate to mold at least a portion on a first substrate placed under the first intermediate plate, a dummy plate provided under and spaced a certain distance apart from the first intermediate plate, a second intermediate plate provided under the dummy plate, and having formed therein a second molding connected to a second gate to mold at least a portion under a second substrate placed under the dummy plate, and a lower mold having formed therein a second runner and the second gate serving as a path of the resin material, and combined with the second intermediate plate.

Abstract: Provided is a method of fabricating a battery protection circuit package, the method including preparing a complex package substrate obtained by connecting a flexible printed circuit board (PCB) including at least one external connection terminal for connection to an external device, to a rigid PCB for mounting components thereon, mounting the complex package substrate on a lead frame including at least one metal tab for connection to a battery cell, and encapsulating at least portions of the complex package substrate and the lead frame with a molded part while exposing the at least one metal tab and the at least one external connection terminal.

Abstract: Provided is a method of fabricating a battery protection circuit package, the method including preparing a complex package substrate obtained by connecting a flexible printed circuit board (PCB) including at least one external connection terminal for connection to an external device, to a rigid PCB for mounting components thereon, mounting the complex package substrate on a lead frame including at least one metal tab for connection to a battery cell, and encapsulating at least portions of the complex package substrate and the lead frame with a molded part while exposing the at least one metal tab and the at least one external connection terminal.