Abstract: A method for forming an audio device includes receiving a first wafer with upper and lower portions and having a first cavity, disposing a second wafer upon the first, wherein the second wafer comprises a material having a first and second side, wherein a portion of material is disposed above the first cavity, forming a contact between the material and the first wafer, disposing a third wafer on the second wafer via an adhesive material, wherein a second cavity is formed therebetween with a height approximately equal to the thickness of the adhesive material, wherein the second cavity is disposed above the portion of material, and wherein the portion comprises a diaphragm for the MEMS audio device configured to move out of plane relative to the material and within the first and the second cavity.

Abstract: The present invention provides a micro-speaker device. The device has a movable diaphragm device comprising a thickness of material which has a first surface and a second surface opposite of the first surface. In an example, the device has a shaft device having a first end and a second end, where the first end coupled to the second surface. In an example, the device has an actuator device coupled to the second end and configured to drive the shaft device in a piston action to pull and push the movable diaphragm. The device has a housing enclosing the movable diaphragm device, the shaft device, and the actuator device. The device has a vented enclosure opposite of the movable diaphragm to allow air to move in and out of the one or more vent openings to generate a sound pressure signal.

Abstract: A MEMS audio device includes a first wafer having a top with a first cavity and a bottom with a vent hole coupled to the first cavity, wherein the bottom having first contacts, a second wafer disposed upon the first wafer having a flexible material layer disposed above the first cavity, a third wafer disposed upon the second wafer having physical contacts coupled to the second wafer, wherein the third wafer includes a second cavity disposed above the flexible material layer, a wiring wafer disposed below the first wafer having a second vent hole coupled to the first cavity, wherein the wiring wafer having second contacts coupled to the first contacts, and wherein the flexible material layer forms a diaphragm for the MEMS audio device.

Abstract: A MEMS audio device includes a first substrate having a first surface, a cavity, and a first vent hole formed through the first substrate, a device layer disposed upon the first substrate comprising a semiconductor material sandwiched between a first and second oxides, wherein a portion of the semiconductor material is substantially free of oxide, wherein the first oxide is disposed against the first surface, and wherein the device layer comprises first contacts, a substrate disposed upon the device layer, including a first vent hole formed through the second substrate, and second electrical contacts coupled to the first electrical contacts, wherein the portion of the semiconductor material forms a diaphragm for the MEMS audio device and wherein the diaphragm is configured to move within the first cavity.

Abstract: The present invention provides a micro-speaker device. The device has a movable diaphragm device comprising a thickness of material which has a first surface and a second surface opposite of the first surface. In an example, the device has a shaft device having a first end and a second end, where the first end coupled to the second surface. In an example, the device has an actuator device coupled to the second end and configured to drive the shaft device in a piston action to pull and push the movable diaphragm. The device has a housing enclosing the movable diaphragm device, the shaft device, and the actuator device. The device has a vented enclosure opposite of the movable diaphragm to allow air to move in and out of the one or more vent openings to generate a sound pressure signal.

Abstract: The present invention provides a micro-speaker device. The device has a movable diaphragm device comprising a thickness of material which has a first surface and a second surface opposite of the first surface. In an example, the device has a shaft device having a first end and a second end, where the first end coupled to the second surface. In an example, the device has an actuator device coupled to the second end and configured to drive the shaft device in a piston action to pull and push the movable diaphragm. The device has a housing enclosing the movable diaphragm device, the shaft device, and the actuator device. The device has a vented enclosure opposite of the movable diaphragm to allow air to move in and out of the one or more vent openings to generate a sound pressure signal.

Abstract: In an example, the present invention provides a micro-speaker device. The device has a movable diaphragm device comprising a thickness of silicon or graphene material which has a first surface and a second surface opposite of the first surface. The device has a housing enclosing the movable diaphragm device, the electrode device and an encapsulation device. The electrode device can be part of a CMOS device with electronics integrated on to the device. The device has a vented enclosure opposite of the movable diaphragm to allow air to move in and out of the one or more vent openings to generate a sound pressure signal. The diaphragm can be electrostatically actuated from one or more surfaces that include the electrode device and the encapsulation device.

Abstract: The present invention provides a micro-speaker device. The device has a movable diaphragm device comprising a thickness of material which has a first surface and a second surface opposite of the first surface. In an example, the device has a shaft device having a first end and a second end, where the first end coupled to the second surface. In an example, the device has an actuator device coupled to the second end and configured to drive the shaft device in a piston action to pull and push the movable diaphragm. The device has a housing enclosing the movable diaphragm device, the shaft device, and the actuator device. The device has a vented enclosure opposite of the movable diaphragm to allow air to move in and out of the one or more vent openings to generate a sound pressure signal.

Abstract: A MEMS device includes a first MEMS sensor associated with a first spatial plane and a second MEMS sensor is associated with a spatial second plane not co-planar with the first spatial plane, wherein the first MEMS sensor is configured to provide a first interrupt and a first data in response to a physical perturbation, wherein the second MEMS sensor is configured to provide a second interrupt and second data in response to the physical perturbation, and a controller configured to receive the first interrupt at a first time and the second interrupt at a second time different from the first time, wherein the controller is configured to determine a latency between the first time and the second time, and wherein the controller is configured to determine motion data in response to the first data, to the second data, and to the latency.

Abstract: A MEMS device includes a first MEMS sensor associated with a first spatial plane and a second MEMS sensor is associated with a spatial second plane not co-planar with the first spatial plane, wherein the first MEMS sensor is configured to provide a first interrupt and a first data in response to a physical perturbation, wherein the second MEMS sensor is configured to provide a second interrupt and second data in response to the physical perturbation, and a controller configured to receive the first interrupt at a first time and the second interrupt at a second time different from the first time, wherein the controller is configured to determine a latency between the first time and the second time, and wherein the controller is configured to determine motion data in response to the first data, to the second data, and to the latency.

Abstract: A MEMS device includes a first MEMS sensor associated with a first spatial plane and a second MEMS sensor is associated with a spatial second plane not co-planar with the first spatial plane, wherein the first MEMS sensor is configured to provide a first interrupt and a first data in response to a physical perturbation, wherein the second MEMS sensor is configured to provide a second interrupt and second data in response to the physical perturbation, and a controller configured to receive the first interrupt at a first time and the second interrupt at a second time different from the first time, wherein the controller is configured to determine a latency between the first time and the second time, and wherein the controller is configured to determine motion data in response to the first data, to the second data, and to the latency.

Abstract: A controller for a MEMS gyroscope includes a first portion for generating a drive signal in response to an output from drive capacitors of the MEMS gyroscope, wherein the output signal has a resonant frequency and a phase, a second portion for determining a sampling signal in response to the output, wherein the sampling signal has a frequency that is a multiple of the resonant frequency, and has the phase, a multiplexer for outputting a multiplexed data comprising first data signals from first capacitors and second capacitors of the MEMS gyroscope multiplexed in response to the sampling signal, and a processing portion for reducing the resonant frequency from the multiplexed data.

Abstract: A portable computing device includes a housing having a region with a plurality of physical features configured to be swiped by a user during a first period, a first accelerometer configured to determine first perturbations during the first period, a second accelerometer configured to determine second perturbations during the first period of time, and a processor coupled to the first and second accelerometer and configured to determine whether the user has swiped the region during the first period of time in response to the first perturbations and the second perturbations.

Abstract: A method for a system includes applying power to a MEMS device while inhibiting applying power to a processor, thereafter determining first sensed data with the MEMS device in response to first event data, when the first sensed data exceeds a first threshold, determining second sensed data with a second MEMS device in response to second event data, when the second sensed data exceeds a second threshold, applying power to the processor, determining with the processor whether a seismic event is occurring in response to the first and the second sensed data, directing with the processor, an electronically-controllable mechanism to shut-off a utility supply, in response to the seismic event being determined.

Abstract: A wearable user device includes a first hearing aid configured to be disposed within a first ear of a user comprising a first MEMS accelerometer, a first magnetometer, and a first power source, wherein the first MEMS accelerometer is configured to determine a first plurality of movement data in response to a first head motion of the user, wherein the first magnetometer configured to determine a second plurality of movement data in response to the first head motion of the user; and wherein the first power source is configured to provide operating power to the first hearing aid, the first MEMS accelerometer, and to the first magnetometer, and a processor coupled to the first hearing aid, wherein the processor is configured to determine a first plurality of rotation data associated with the user in response to the first plurality of movement data and the second plurality of movement data.

Abstract: A method for operating an electronic device comprising a first and second MEMS device and a semiconductor substrate disposed upon a mounting substrate includes subjecting the first MEMS device and the second MEMS device to physical perturbations, wherein the physical perturbations comprise first physical perturbations associated with the first MEMS device and second physical perturbations associated with the second MEMS device, wherein the first physical perturbations and the second physical perturbations are substantially contemporaneous, determining in a plurality of CMOS circuitry formed within the one or more semiconductor substrates, first physical perturbation data from the first MEMS device in response to the first physical perturbations and second physical perturbation data from the second MEMS device in response to the second physical perturbations, determining output data in response to the first physical perturbation data and to the second physical perturbation data, and outputting the output data.

Abstract: In an embodiment of the disclosed principles, a strap down integration (SDI) system includes a gyroscope that provides gyroscope data samples and an accelerometer that provides accelerometer data samples. A timing capture module associates a timestamp in a common time-base to data samples, and an SDI module linked to the timing capture module processes the timestamped data samples to produce orientation and velocity increments. In an embodiment, the SDI system also includes a priority buffer for storing the data stream produced by the timing capture module prior to provision of the data stream to the SDI module. The SDI module may output SDI motion increments at a time specified in an output request via an output request sample placed in the incoming data stream and having a timestamp in the common time-base.

Abstract: An integrated MEMS inertial sensing device can include a MEMS inertial sensor with a drive loop configuration overlying a CMOS IC substrate. The CMOS IC substrate can include an AGC loop circuit coupled to the MEMS inertial sensor. The AGC loop acts in a way such that generated desired signal amplitude out of the drive signal maintains MEMS resonator velocity at a desired frequency and amplitude. A benefit of the AGC loop is that the charge pump of the HV driver inherently includes a ‘time constant’ for charging up of its output voltage. This incorporates the Low pass functionality in to the AGC loop without requiring additional circuitry.

Abstract: A hand-held processor system for processing data from an integrated MEMS device disposed within a hand-held computer system and method. A dynamic offset correction (DOC) process computes 3-axis accelerometer biases without needing to know the orientation of the device. Arbitrary output biases can be corrected to ensure consistent performance A system of linear equations is formed using basic observations of gravity measurements by an acceleration measuring device, conditioned upon constraints in data quality, degree of sensed motion, duration, and time separation. This system of equations is modified and solved when appropriate geometric diversity conditions are met.

Abstract: A method for a MEMS device comprises determining in a computer system, a first driving signal for the MEMS device in response to a first time delay and to a base driving signal, applying the first driving signal to the MEMS device to induce the MEMS device to operate at a first frequency, determining a second driving signal for the MEMS device in response to a second time delay and to the base driving signal, applying the second driving signal to the MEMS device to induce the MEMS device to operate at a second frequency, determining a first quality factor associated with the MEMS device in response to the first frequency and the second frequency, determining a quality factor associated with the MEMS device in response to the first quality factor, and determining whether the quality factor associated with the MEMS device, exceeds a threshold quality factor.