Abstract: A seal assembly for a rotary machine. The seal assembly includes a rotor and a stator. The rotor is rotatable about a rotational axis and has a rotor seal face. The stator has a stator seal face. The stator seal face is positioned opposite the rotor seal face and faces the rotor seal face with a gap therebetween. A portion of one of the rotor and the stator is formed of (i) a shape memory alloy or (ii) a first metal and a second metal with the second metal having a coefficient of thermal expansion different from the first metal. The seal assembly is characterized by a seal clearance compliance ratio (SCCR) from 20% to 90%.

Abstract: A circuit structure includes an enhancement mode transistor and a turn-off slew rate controller for automatically adding drain-source capacitance to the transistor when the transistor is transitioning to an off state. The added drain-source capacitance slows the turn-off slew rate (dV/dt_off) of the transistor without also increasing the turn-off energy loss (E_off). The slew rate controller can include: sensors connected to the drain region for sensing both the drain voltage and the slew rate, respectively; a logic circuit for generating and outputting an enable signal based on output voltages from the sensors; and a capacitance adder for adding to the drain-source capacitance only when the logic value of the enable signal indicates that the drain voltage is at or above a predetermined positive drain voltage level and the slew rate is positive.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to high electron mobility transistors and methods of manufacture. The structure includes: a gate structure; a first barrier layer under and adjacent to the gate structure; and a second barrier layer over the first barrier layer and which is adjacent to the gate structure.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a high-electron-mobility transistor and methods of manufacture. The structure includes: a semiconductor substrate; at least one insulator film over the semiconductor substrate, the at least one insulator film including a recess; and a field plate extending into the at least one recess and over the at least one insulator film.

Abstract: A structure according to the disclosure includes a dielectric layer over a substrate and horizontally between a gate terminal and a source/drain (S/D) terminal. The dielectric layer has a first surface proximal to the substrate and a second surface opposite the first surface. The dielectric layer has a plurality of recesses in the second surface. At least some of the plurality of recesses have different depths. A conductive field plate includes a metal layer on the second surface and within the plurality of recesses. The conductive field plate is electrically isolated from the gate terminal and the S/D terminal.

Abstract: Disclosed circuit structure embodiments include an enhancement mode transistor and a turn-off slew rate controller for automatically adding drain-source capacitance to the transistors when the transistor is transitioning to an off state. The added drain-source capacitance slows the turn-off slew rate (dV/dt_off) of the transistor without also increasing the turn-off energy loss (E_off). In some embodiments, the slew rate controller includes: sensors connected to the drain region for sensing both the drain voltage and the slew rate, respectively; a logic circuit for generating and outputting an enable signal based on output voltages from the sensors; and a capacitance adder for adding to the drain-source capacitance only when the logic value of the enable signal indicates that the drain voltage is at or above a predetermined positive drain voltage level and the slew rate is positive.

Abstract: A compound having formula (I) and a process for preparing the compound of formula (I) are provided. R1, R2, R3, R5, R6, R7, R8, R9, X, Z1, and Z2 are as defined in the detailed description. A composition and a combination containing novel fused bicyclic pyridine carboxamide compounds and method for combating phytopathogenic fungi using the same are also described.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a high-electron-mobility transistor and methods of manufacture. The structure includes: a gate structure; a first field plate on a first side of the gate structure; and a second field plate on a second side of the gate structure, independent from the first field plate.

Abstract: An electronic device includes a semiconductor substrate and a bidirectional transistor switch formed on the substrate, the bidirectional switch including a first source node, a second source node and a common drain node. A first transistor is formed on the substrate and includes a first source terminal, a first drain terminal and a first gate terminal, wherein the first source terminal is connected to the substrate, the first drain terminal is connected to the first source node and the first gate terminal is connected to the second source node. A second transistor is formed on the substrate and includes a second source terminal, a second drain terminal and a second gate terminal, wherein the second source terminal is connected to the substrate, the second drain terminal is connected to the second source node and the second gate terminal is connected to the first source node.

Abstract: An integrated circuit (IC) having a high voltage semiconductor device with a plurality of field plates between the gate and drain. The IC further includes a biasing circuit electrically coupled to each of the plurality of field plates, the biasing circuit including a plurality of high voltage depletion mode transistors, each having a pinch off voltage. The high voltage depletion mode transistors may have different pinch off voltages, and each of the field plates are each independently biased by a different one of the high voltage depletion mode transistors.

Abstract: The present disclosure relates to a circuit and, more particularly, to comparator circuits used with a depletion mode device and methods of operation. The circuit includes: a comparator, a transistor connected to an output of the comparator; and a depletion mode device connected to ground and comprising a control gate connected to the transistor.

Abstract: Disclosed are circuits for controlling slew rate of a transistor during switching. Each circuit includes a first transistor (e.g., a gallium nitride (GaN)-based high electron mobility transistor (HEMT) or metal-insulator-semiconductor HEMT (MISHEMT)), a capacitor, and a second transistor. The first transistor includes a first gate connected to a pad for receiving a pulse-width modulation (PWM) signal, a first drain region connected to a first plate of the capacitor, and a first source region. The second transistor includes a second gate connected to a second plate of the capacitor, a second drain region, and a second source region and is connected to both the pad and the first transistor. The connection between the first and second transistors varies depending on whether the first transistor is an enhancement or depletion mode device and on whether the slew rate control is employed for on state or off state switching.

Abstract: A driver circuit is disclosed. The driver circuit is configured to generate a drive voltage for driving a bootstrap transistor. The driver circuit includes an input node and an output node, a first circuit including a plurality of switches, a first capacitor and a second capacitor, and a pass gate switch coupled between the output node and the first capacitor. In one aspect, the first circuit, the first and second capacitors and the pass gate switch are arranged to cause an output voltage at the output node to change from a first output voltage to a second output voltage. In another aspect, a resistor is connected between the first capacitor and the second capacitor, and a feedback switch is connected in parallel to the resistor. The feedback switch is turned on in response to a feedback signal, thereby reducing an impedance value of the resistor.

Abstract: The present disclosure relates to a circuit and, more particularly, to comparator circuits used with a depletion mode device and methods of operation. The circuit includes: a comparator; a transistor connected to an output of the comparator; and a depletion mode device connected to ground and comprising a control gate connected to the transistor.

Abstract: A GaN logic circuit may include an input node receiving an input voltage, a first pull up transistor pulling up an output voltage in response to the input voltage, and a first depletion mode transistor having a first gate to which a first gate voltage is applied and a second gate to which a second gate voltage is applied. The first depletion mode transistor may control the first pull up transistor in response to a gate voltage difference between the first gate voltage and the second gate voltage. The logic device may further include a capacitor having a first end coupled to the first depletion mode transistor and a second end coupled to the first pull up transistor.

Abstract: An electronic device includes a semiconductor substrate and a bidirectional transistor switch formed on the substrate, the bidirectional switch including a first source node, a second source node and a common drain node. A first transistor is formed on the substrate and includes a first source terminal, a first drain terminal and a first gate terminal, wherein the first source terminal is connected to the substrate, the first drain terminal is connected to the first source node and the first gate terminal is connected to the second source node. A second transistor is formed on the substrate and includes a second source terminal, a second drain terminal and a second gate terminal, wherein the second source terminal is connected to the substrate, the second drain terminal is connected to the second source node and the second gate terminal is connected to the first source node.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to seal ring structures and methods of manufacture. The structure includes: a semiconductor substrate; a channel layer above the semiconductor substrate; a trench within the channel layer, extending to the semiconductor substrate; and a moisture barrier layer lining sidewalls and a bottom surface of the trench.

Abstract: Disclosed is a structure including a substrate and a transistor on the substrate. The transistor includes a barrier layer above the substrate and a multi-gate structure on the barrier layer. The multi-gate structure includes a primary gate and a secondary gate. The secondary gate has opposing sidewalls, opposing end walls and a top surface. The primary gate includes essentially vertically-oriented first portions on the barrier layer positioned laterally adjacent to opposing sidewalls, respectively, of the secondary gate. Optionally, the primary gate also includes an essentially horizontally-oriented second portion on the top surface of the secondary gate and/or essentially vertically-oriented third portions on the opposing end walls, respectively. The secondary gate can be a floating gate. Also disclosed is a method of forming the structure.

Abstract: Circuits and methods that control a rate of change of a drain voltage as a function of time in a transistor are disclosed. In one aspect, the circuit includes a transistor having a gate terminal that controls operation of the transistor, and a control circuit coupled to the gate terminal and arranged to change a voltage at the gate terminal at a first rate of voltage with respect to time from a first voltage to a first intermediate voltage, and further arranged to change the voltage at the gate terminal at a second rate of voltage with respect to time from the first intermediate voltage to a second intermediate voltage, where the first rate is different than the second rate.

Abstract: An integrated circuit (IC) having a high voltage semiconductor device with a plurality of field plates between the gate and drain. The IC further includes a biasing circuit electrically coupled to each of the plurality of field plates, the biasing circuit including a plurality of high voltage depletion mode transistors, each having a pinch off voltage. The high voltage depletion mode transistors may have different pinch off voltages, and each of the field plates are each independently biased by a different one of the high voltage depletion mode transistors.