Patents by Inventor Sarah K. CZAPLEWSKI-CAMPBELL

Sarah K. CZAPLEWSKI-CAMPBELL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11968780
    Abstract: An electronic printed circuit board structure for mitigating conductive anodic filament growth. The structure includes at least two conductive layers and a dielectric layer sandwiched between the conductive layers. At least one hole extends through the dielectric layer, and a layer of nonconductive material covers the at least one hole, wherein the nonconductive material is glass-free. A conductive plate layer is disposed over the nonconductive material layer to form a via connection in the structure.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: April 23, 2024
    Assignee: International Business Machines Corporation
    Inventors: Kyle Indukummar Giesen, Sarah K. Czaplewski-Campbell, Roger S. Krabbenhoft
  • Patent number: 11912830
    Abstract: A composition, method, and article of manufacture are disclosed. The composition is formed by polymerizing monomers, and includes at least one flame-retardant bis(triketone) monomer and at least one amine monomer. The method includes obtaining at least one flame-retardant bis(triketone) monomer, obtaining at least one amine monomer, and polymerizing the monomers to form a flame-retardant polydiketoenamine. The article of manufacture includes a polymer formed by polymerizing at least one flame-retardant bis(triketone) monomer and at least one amine monomer.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: February 27, 2024
    Assignee: International Business Machines Corporation
    Inventors: Brandon M. Kobilka, Jason T. Wertz, Sarah K. Czaplewski-Campbell, Eric J. Campbell
  • Publication number: 20240008208
    Abstract: Disclosed herein is a method for producing a land grid array (LGA) socket connector assembly and the resultant assembly. The method comprises providing a carrier having a first carrier thickness with an array of vias, each having a first diameter, providing pockets around top surfaces of the vias, each having a second diameter and creating a portion of the pockets having a second carrier thickness that is less than the first carrier thickness, providing socket contact springs, each comprising a hole support structure that supports the socket contact spring within the via, and a contact beam configured to contact a conductor of an integrated circuit to be placed within the socket connector assembly, wherein a portion of carrier having a first carrier thickness is configured to prevent the contact beam from inelastically deforming when bent under load. Alternately, a contact feature may be used to prevent the inelastic deformation.
    Type: Application
    Filed: June 29, 2022
    Publication date: January 4, 2024
    Inventors: Mark K. Hoffmeyer, Sarah K. Czaplewski-Campbell, Brian Beaman, Yuet-Ying Yu
  • Publication number: 20230391904
    Abstract: A process, a composition, and an article of manufacture are disclosed. The process includes generating a cyclic monoterpene derivative. The generating includes oxidizing a cyclic monoterpene to generate a ketone derivative and oxidizing the ketone derivative to form a lactone derivative. The composition and the article of manufacture include a polymer having monomer repeat units derived from a lactone derivative of a cyclic monoterpene.
    Type: Application
    Filed: June 7, 2022
    Publication date: December 7, 2023
    Inventors: Brandon M. Kobilka, Jason T. Wertz, Sarah K. Czaplewski-Campbell, Eric J. Campbell
  • Publication number: 20230397331
    Abstract: An electronic printed circuit board structure for mitigating conductive anodic filament growth. The structure includes at least two conductive layers and a dielectric layer sandwiched between the conductive layers. At least one hole extends through the dielectric layer, and a layer of nonconductive material covers the at least one hole, wherein the nonconductive material is glass-free. A conductive plate layer is disposed over the nonconductive material layer to form a via connection in the structure.
    Type: Application
    Filed: June 2, 2022
    Publication date: December 7, 2023
    Inventors: Kyle Indukummar Giesen, Sarah K. Czaplewski-Campbell, Roger S. Krabbenhoft
  • Patent number: 11794177
    Abstract: A composition, method, and article of manufacture are disclosed. The composition includes a silica particle with light upconversion molecules bound to its surface. The method includes obtaining silica particles and light upconversion molecules having sidechains with reactive functional groups. The method further includes binding the light upconversion molecules to surfaces of the silica particles. The article of manufacture includes the composition.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: October 24, 2023
    Assignee: International Business Machines Corporation
    Inventors: Jason T. Wertz, Brandon M. Kobilka, Sarah K. Czaplewski-Campbell, Eric J. Campbell
  • Patent number: 11779916
    Abstract: A thermo-gravimetric analysis system includes a chamber having an interior; and a sample crucible connected to and inside of the chamber, the sample crucible configured to hold a sample material. The system further includes a reference crucible connected to and inside of the chamber; and a metal organic framework (MOF) crucible connected to and inside of the chamber, separate from the sample crucible, the MOF crucible including an MOF material.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: October 10, 2023
    Assignee: International Business Machines Corporation
    Inventors: Eric J. Campbell, Sarah K. Czaplewski-Campbell, Brandon M. Kobilka, Scott B. King
  • Patent number: 11703922
    Abstract: A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: July 18, 2023
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Mark K. Hoffmeyer, Christopher M. Marroquin, Eric J. Campbell, Sarah K. Czaplewski-Campbell, Phillip V. Mann
  • Patent number: 11617519
    Abstract: A device includes a syringe, which has a tip, plunger, and barrel containing a fluid. The device also includes a needle electrode coupled to the tip of the syringe, a release component, and a control component configured to receive electrical measurements made by the needle electrode, determine impedance values from the electrical measurements, and identify a target tissue based on the impedance values. In response to the identification, the control component generates instructions to reposition a release component. A method includes receiving electrical measurements from a needle electrode, determining impedance values based on the electrical measurements. A target tissue is identified based on the impedance values, and a release component is repositioned in response.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: April 4, 2023
    Assignee: International Business Machines Corporation
    Inventors: Sarah K. Czaplewski-Campbell, Eric J. Campbell, Jennifer I. Bennett, Elin F. LaBreck, Christopher Steffen
  • Patent number: 11572503
    Abstract: A composition, method, and article of manufacture are disclosed. The microcapsule includes a polymer shell encapsulating a core component. The polymer shell includes light upconversion molecules. The article of manufacture includes the microcapsule. The method includes obtaining light upconversion molecules having sidechains with reactive functional groups, and forming a microcapsule. The microcapsule includes a polymer shell encapsulating a core component. The polymer shell includes light upconversion molecules. The article of manufacture includes the microcapsule.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: February 7, 2023
    Assignee: International Business Machines Corporation
    Inventors: Brandon M. Kobilka, Jason T. Wertz, Sarah K. Czaplewski-Campbell, Eric J. Campbell
  • Patent number: 11562725
    Abstract: Acoustic dampeners, methods of making acoustic dampener, and uses thereof are described. The acoustic dampener includes a polymer foam article; and a metal-organic framework portion. The metal-organic framework portion comprises a metal-organic framework in a polymer matrix. The metal-organic framework portion is adhered to, or otherwise coupled to or included with, the polymer foam article. Such an acoustic dampener can be used in a computer equipment cabinet.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: January 24, 2023
    Assignee: International Business Machines Corporation
    Inventors: Joseph Kuczynski, Rebecca Morones, Sarah K. Czaplewski-Campbell, Melissa K. Miller
  • Patent number: 11558964
    Abstract: Embodiments of the present invention are directed to an in-situ warpage monitoring system and method for preventing head-in-pillow (HIP) or other potential defect escapes during a solder reflow process. In a non-limiting embodiment of the invention, a product is passed through a reflow oven. The product can include a printed circuit board (PCB). An amount of warpage of the product is measured at one or more monitoring devices positioned along the reflow oven. Each measured amount of warpage is compared to a predetermined warpage limit. The product is sorted into one of a plurality of designated lots based on the comparison. The lots can include a pass lot, a fail lot, and a marginal pass lot.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: January 17, 2023
    Assignee: International Business Machines Corporation
    Inventors: Jennifer I. Bennett, Steven Chandler Borrillo, Sarah K. Czaplewski-Campbell, Eric J. Campbell
  • Patent number: 11517072
    Abstract: A shoe may include an upper sole and an outer sole. In one state of the shoe, the upper sole is conductively connected to the outer sole. In another state of the shoe, the upper sole is electrically insulated from the outer sole. The shoe may be changed between these states.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: December 6, 2022
    Assignee: International Business Machines Corporation
    Inventors: Steven Chandler Borrillo, Eric J. Campbell, Jennifer I. Bennett, Sarah K. Czaplewski-Campbell
  • Publication number: 20220334625
    Abstract: A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.
    Type: Application
    Filed: June 29, 2022
    Publication date: October 20, 2022
    Inventors: MARK K. HOFFMEYER, CHRISTOPHER M. MARROQUIN, ERIC J. CAMPBELL, SARAH K. CZAPLEWSKI-CAMPBELL, PHILLIP V. MANN
  • Patent number: 11474040
    Abstract: A process of utilizing a water-sensitive fluorophore for moisture content evaluation in a hygroscopic polymer includes forming a blend that includes a hygroscopic polymer resin and a water-sensitive fluorophore. The process includes forming pellets having a particular geometry from the blend, determining fluorescence properties of at least one of the pellets, and determining moisture content of at least one of the pellets. The process also includes generating a calibration curve for the particular pellet geometry by correlating the fluorescence properties with the moisture content. The process further includes providing the calibration curve for non-destructive moisture content evaluation of a material derived from the pellets.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: October 18, 2022
    Assignee: International Business Machines Corporation
    Inventors: Eric J. Campbell, Sarah K. Czaplewski-Campbell, Joseph Kuczynski, Timothy J. Tofil
  • Patent number: 11452805
    Abstract: A process includes removing air bubbles from extracorporeal blood via chemical entrapment of nitrogen (N2) gas.
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: September 27, 2022
    Assignee: International Business Machines Corporation
    Inventors: Sarah K. Czaplewski-Campbell, Joseph Kuczynski, Jason T. Wertz, Jing Zhang
  • Patent number: 11416045
    Abstract: A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.
    Type: Grant
    Filed: April 13, 2020
    Date of Patent: August 16, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Mark K. Hoffmeyer, Christopher M. Marroquin, Eric J. Campbell, Sarah K. Czaplewski-Campbell, Phillip V. Mann
  • Publication number: 20220212282
    Abstract: A system and method for making vias in a laminated printed circuit board (PCB). A drill having both a mechanical drill and a laser drill is used to make the via. The mechanical drill is moved over a location in the PCB where a blind via is desired. The mechanical drill drills to a point where a tip of a bit of the mechanical drill is a predetermined distance above a target interconnect layer. Then the drill is moved such that the laser drill is located over the via where the mechanical drill had drilled the via. The laser drill then ablates the resin remaining above the target interconnect layer.
    Type: Application
    Filed: January 6, 2021
    Publication date: July 7, 2022
    Inventors: Sarah K. Czaplewski-Campbell, Eric J. Campbell, Jennifer I. Bennett, Steven Chandler Borrillo
  • Publication number: 20220195126
    Abstract: A composition, method, and article of manufacture are disclosed. The composition is formed by polymerizing monomers, and includes at least one flame-retardant bis(triketone) monomer and at least one amine monomer. The method includes obtaining at least one flame-retardant bis(triketone) monomer, obtaining at least one amine monomer, and polymerizing the monomers to form a flame-retardant polydiketoenamine. The article of manufacture includes a polymer formed by polymerizing at least one flame-retardant bis(triketone) monomer and at least one amine monomer.
    Type: Application
    Filed: December 18, 2020
    Publication date: June 23, 2022
    Inventors: Brandon M. Kobilka, Jason T. Wertz, Sarah K. Czaplewski-Campbell, Eric J. Campbell
  • Patent number: 11359975
    Abstract: Method, apparatus, and computer program product are provided for determining a maximum temperature to which a perishable good or other temperature sensitive item was exposed. In some embodiments, a capacitance of a circuit provided on a substrate is measured. The circuit includes capacitor(s) each having first and second plates separated from each other by an ionic liquid (IL) in a solid state. The IL melts at a predetermined temperature and flows away from the first and second plates into a void. In some embodiments, the predetermined temperature at which the IL melts is different for each capacitor. For example, each capacitor in the circuit may employ a different N-alkyl bezothiazolium salt. A maximum temperature of exposure is determined based on the measured capacitance. In some embodiments, a decision of whether to discard the perishable good or other temperature sensitive item may be based on the determined maximum temperature.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: June 14, 2022
    Assignee: International Business Machines Corporation
    Inventors: Sarah K. Czaplewski-Campbell, Joseph Kuczynski, Eric J. Campbell, Timothy J. Tofil