Abstract: Described herein are techniques for reducing resin squeeze-out including a method comprising receiving a first component and a second component, where the first component is configured to be joined to the second component at an overlap area using an adhesive layer to form a structure having a ledge. The method further comprises applying the adhesive layer to the overlap area on the first component. The method further comprises selectively curing a portion of the adhesive layer adjacent to the ledge. The method further comprises forming the structure by combining the first component, the second component, and the adhesive layer and curing a remainder of the adhesive layer.

Abstract: A method, composition, and article of manufacture. The method can include depositing a layer, which includes a set of particles and a set of microcapsules encapsulating polymerizing agents. The method can also include fusing particles in selected areas of the layer with a laser, and rupturing at least a portion of microcapsules using at least one energy source selected from the laser, an ultraviolet (UV) radiation source, and a heat source. The composition can include a set of particles and a set of microcapsules, each containing a polymerizing agent encapsulated by a degradable shell. The article of manufacture can include fused layers that include fused particles and pores sealed in reactions with polymerizing agents released from degradable microcapsules.

Abstract: A microcapsule, method, and article of manufacture are disclosed. The microcapsule includes an outer shell, a molecular sensitizer, a molecular annihilator, and an inner shell separating the molecular sensitizer from the molecular annihilator. The method includes forming microcapsules, each microcapsule having an outer shell, a molecular sensitizer, a molecular annihilator, and an inner shell separating the molecular sensitizer from the molecular annihilator. The article of manufacture includes at least one of the microcapsules.

Abstract: A composition, method, and article of manufacture are disclosed. The microcapsule includes a polymer shell encapsulating a core component. The polymer shell includes light upconversion molecules. The article of manufacture includes the microcapsule. The method includes obtaining light upconversion molecules having sidechains with reactive functional groups, and forming a microcapsule. The microcapsule includes a polymer shell encapsulating a core component. The polymer shell includes light upconversion molecules. The article of manufacture includes the microcapsule.

Abstract: A composition, method, and article of manufacture are disclosed. The composition and the article of manufacture include a silica particle and light upconversion molecules incorporated into the silica particle. The method includes obtaining sidechain-modified light upconversion molecules, and incorporating the sidechain-modified light upconversion molecules into a silica particle to form a light upconversion particle.

Abstract: A microcapsule, method, and article of manufacture are disclosed. The microcapsule includes an outer shell, a molecular sensitizer, a molecular annihilator, and an inner shell separating the molecular sensitizer from the molecular annihilator. The method includes forming microcapsules, each microcapsule having an outer shell, a molecular sensitizer, a molecular annihilator, and an inner shell separating the molecular sensitizer from the molecular annihilator. The article of manufacture includes at least one of the microcapsules.

Abstract: A composition, method, and article of manufacture are disclosed. The composition is a microcapsule that includes a transparent shell encapsulating a mixture comprising light upconversion molecules. The method is a method of forming a microcapsule, which includes obtaining light upconversion molecules, forming an emulsion of the light upconversion molecules and a shell formation solution, and encapsulating the light upconversion molecules in a transparent shell. The article of manufacture comprises the microcapsule.

Abstract: A composition, method, and article of manufacture are disclosed. The composition includes a silica particle with light upconversion molecules bound to its surface. The method includes obtaining silica particles and light upconversion molecules having sidechains with reactive functional groups. The method further includes binding the light upconversion molecules to surfaces of the silica particles. The article of manufacture includes the composition.

Abstract: A thermo-gravimetric analysis system includes a chamber having an interior; and a sample crucible connected to and inside of the chamber, the sample crucible configured to hold a sample material. The system further includes a reference crucible connected to and inside of the chamber; and a metal organic framework (MOF) crucible connected to and inside of the chamber, separate from the sample crucible, the MOF crucible including an MOF material.

Abstract: A multilayer component is coated with a fluorogenic probe designed to give off florescence when in contact with one or more metals in the multilayer component. The fluorogenic probe is exposed to radiation. The intensity and wavelength of the florescence is measured to determine a porosity of the one or more layers of the multilayer component.

Abstract: A device, method, and article of manufacture for corrosion monitoring are disclosed. The device includes a corrodible component and a silicone layer positioned over the corrodible component. The method includes providing a corrosion monitoring assembly having a corrodible component and a silicone layer positioned over the corrodible component. The article of manufacture includes a corrosion monitoring assembly having a corrodible component and a silicone layer positioned over the corrodible component.

Abstract: A method and a system for non-destructively detecting defects within and/or on plated-through holes are provided. The method includes sealing a plated-through hole on a printed circuit board to detect for possible defects along the sidewall of the plated-through hole. The method further includes applying an airflow through the plated-through hole and measuring the airflow entering the plated-through hole at the gasket to determine the initial airflow calculation. The method also includes measuring the airflow again as it exits the plated-through hole to determine an exit airflow calculation. A determination of the quality of the plated-through hole is made by the method by analyzing the initial airflow calculation and the exit airflow calculation.

Abstract: A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.

Abstract: A process includes removing air bubbles from extracorporeal blood via chemical entrapment of nitrogen (N2) gas.

Abstract: A method and a system for detecting defects in plated-through hole by partially submerging a printed circuit board in a fluid bath. The method includes partially submerging a printed circuit board on a first side and measuring a capillary height difference within a plated-through hole and the surrounding fluid bath. The method further includes partially submerging the printed circuit board on a second side and measuring a second capillary height difference within the plated-through hole and the surrounding fluid bath. The method also includes comparing the measured values with predetermined values to determine the quality of the plated-through hole.

Abstract: Acoustic dampeners, methods of making acoustic dampener, and uses thereof are described. The acoustic dampener includes a polymer foam article; and a metal-organic framework portion. The metal-organic framework portion comprises a metal-organic framework in a polymer matrix. The metal-organic framework portion is adhered to, or otherwise coupled to or included with, the polymer foam article. Such an acoustic dampener can be used in a computer equipment cabinet.

Abstract: Embodiments of the present invention are directed to an in-situ warpage monitoring system and method for preventing head-in-pillow (HIP) or other potential defect escapes during a solder reflow process. In a non-limiting embodiment of the invention, a product is passed through a reflow oven. The product can include a printed circuit board (PCB). An amount of warpage of the product is measured at one or more monitoring devices positioned along the reflow oven. Each measured amount of warpage is compared to a predetermined warpage limit. The product is sorted into one of a plurality of designated lots based on the comparison. The lots can include a pass lot, a fail lot, and a marginal pass lot.

Abstract: A multi-layer thermal interface material including two or more thermal interface materials laminated together, where each of the two or more thermal interface materials comprise different mechanical properties.

Abstract: An adhesive composition includes a photoinitiator and an acrylate-cyanoacrylate monomer. The acrylate-cyanoacrylate monomer includes at least one acrylate functional group to enable photo-curing of the adhesive composition and at least one cyanoacrylate functional group to enable latent curing of the adhesive composition.

Abstract: A microcapsule, a method, and an article of manufacture. The microcapsule includes a degradable shell and a polymerizing agent encapsulated by the degradable shell. The method includes selecting a polymerizing agent, encapsulating the polymerizing agent in a degradable shell, and rupturing the degradable shell by exposure to an energy source, such as a laser, a UV radiation source, and/or a heat source. The article of manufacture includes a microcapsule having a degradable shell and a polymerizing agent encapsulated by the degradable shell.