Patents by Inventor Satish Radhakrishnan

Satish Radhakrishnan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240186121
    Abstract: Exemplary choke plates for use in a substrate processing system may include a plate defining a first aperture through the plate and a second aperture through the plate. The second aperture may be laterally offset from the first aperture. The plate may include a flange that defines a purging inlet. The plate may include a rim defining a plurality of purging outlets that are fluidly coupled with the purging inlet. Each of the plurality of purging outlets may be fluidly coupled with the first aperture.
    Type: Application
    Filed: December 6, 2022
    Publication date: June 6, 2024
    Applicant: Applied Materials, Inc.
    Inventors: Vellaichamy Nagappan, Viren Kalsekar, Jeongmin Lee, Vinay K. Prabhakar, Pratap Chandran, Dharma Ratnam Srichurnam, Azhar Khan, Sumit Subhash Singh, Siva Chandrasekar, Satish Radhakrishnan
  • Patent number: 11970775
    Abstract: Embodiments of a showerhead are described herein. In some embodiments, a showerhead assembly includes: a first gas delivery portion having a first body, a first inlet, and a plurality of first tubes extending from the first body and defining a first plenum, wherein each tube of the plurality of first tubes includes a plurality of first holes; and a second gas delivery portion having a second body, a second inlet, and a plurality of second tubes extending from the second body and defining a second plenum fluidly independent from the first plenum, wherein each tube of the plurality of second tubes includes a plurality of second holes, and wherein the plurality of first tubes are disposed in an alternating pattern with the plurality of second tubes across a width of the showerhead assembly and a heat sink disposed between the plurality of first tubes and the plurality of second tubes.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: April 30, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Prashanth Kothnur, Satish Radhakrishnan, Alexander Lerner, Sergei Klimovich, Roey Shaviv
  • Patent number: 11835927
    Abstract: Process recipe data associated a process to be performed for a substrate at a process chamber is provided as input to a trained machine learning model. A set of process recipe settings for the process that minimizes scratching on one or more surfaces of the substrate is determined based on one or more outputs of the machine learning model. The process is performed for the substrate at the process chamber in accordance with the determined set of process recipe settings.
    Type: Grant
    Filed: December 19, 2022
    Date of Patent: December 5, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Kartik B Shah, Satish Radhakrishnan, Karthik Ramanathan, Karthikeyan Balaraman, Adolph Miller Allen, Xinyuan Chong, Mitrabhanu Sahu, Wenjing Xu, Michael Sterling Jackson, Weize Hu, Feng Chen
  • Patent number: 11834743
    Abstract: Apparatus for supplying vaporized reactants to a reaction chamber are described herein. In some embodiments, a showerhead assembly for depositing multiple materials on a substrate includes a plurality of gas delivery portions, each gas delivery portion having an inlet, a wedge shaped body that defines a plenum, and a plurality of openings disposed on a bottom surface of the gas delivery portion, wherein each of the plenums are fluidly isolated from each other.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: December 5, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Alexander Lerner, Prashanth Kothnur, Roey Shaviv, Satish Radhakrishnan
  • Patent number: 11830706
    Abstract: Embodiments of the present disclosure generally relate to a pedestal for increasing temperature uniformity in a substrate supported thereon. The pedestal comprises a body having a heater embedded therein. The body comprises a patterned surface that includes a first region having a first plurality of posts extending from a base surface of the body at a first height, and a second region surrounding the central region having a second plurality of posts extending from the base surface at a second height that is greater than the first height, wherein an upper surface of each of the first plurality of posts and the second plurality of posts are substantially coplanar and define a substrate receiving surface.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: November 28, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Venkata Sharat Chandra Parimi, Zubin Huang, Jian Li, Satish Radhakrishnan, Rui Cheng, Diwakar N. Kedlaya, Juan Carlos Rocha-Alvarez, Umesh M. Kelkar, Karthik Janakiraman, Sarah Michelle Bobek, Prashant Kumar Kulshreshtha, Vinay K. Prabhakar, Byung Seok Kwon
  • Publication number: 20230356354
    Abstract: Exemplary carrier heads for a chemical mechanical polishing apparatus may include a carrier body. The carrier heads may include a substrate mounting surface coupled with the carrier body. The carrier heads may include an inner ring that is sized and shaped to circumferentially surround a peripheral edge of a substrate positioned against the substrate mounting surface. The inner ring may be characterized by a first end having a first surface that faces the carrier body and a second end having a second surface opposite the first surface. The second end of the inner ring may be radially displaceable. The carrier heads may include an outer ring having an inner surface that is disposed against an outer surface of the inner ring.
    Type: Application
    Filed: May 3, 2022
    Publication date: November 9, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Jeonghoon Oh, Andrew Nagengast, Steven M. Zuniga, Eric L. Lau, Hari Prasath Rajendran, Satish Radhakrishnan, Kuen-Hsiang Chen, Ekaterina A. Mikhaylichenko
  • Publication number: 20230294116
    Abstract: Dual channel showerhead assemblies are described. In some embodiments, the dual channel showerhead assemblies, which include a showerhead upper plate and a showerhead lower plate, enable delivery of mutually incompatible precursors along separate channels that mix in the process zone above a wafer. The dual channel showerhead assemblies provide at least two separate gas paths. In some embodiments, the hole design and hole distribution are configured for minimal jetting effect and plenum volumes for fast purging. The dual channel showerhead assemblies described herein may have a reduced purge out time compared to single channel showerheads, spiral dual channel showerheads, and bonded dual channel showerheads.
    Type: Application
    Filed: March 21, 2022
    Publication date: September 21, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Prahallad Iyengar, Dhritiman Subha Kashyap, Parth Swaroop, Satish Radhakrishnan
  • Patent number: 11692261
    Abstract: One or more embodiments described herein generally relate to methods and systems for forming films on substrates in semiconductor processes. In embodiments described herein, process chamber is provided that includes a lid plate having a plurality of cooling channels formed therein, a pedestal, the pedestal having a plurality of cooling channels formed therein, and a showerhead, wherein the showerhead comprises a plurality of segments and each segment is at least partially surrounded by a shield.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: July 4, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Alexander N. Lerner, Roey Shaviv, Satish Radhakrishnan
  • Publication number: 20230207345
    Abstract: Embodiments of the disclosure advantageously provide base plates with decreased metal contamination. Some embodiments of the disclosure advantageously provide base plates with increased edge purge channel uniformity. Some embodiments provide methods of forming base plates. Embodiments of the disclose are directed to a heater pedestal configured to support a substrate during processing. In some embodiments, the heater pedestal includes the base plate described herein.
    Type: Application
    Filed: December 23, 2021
    Publication date: June 29, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Muhannad Mustafa, Mario D. Silvetti, Michael Jerry Duret, Sanjeev Baluja, Satish Radhakrishnan, Yuan Xiaoxiong
  • Patent number: 11682544
    Abstract: Semiconductor processing systems according to embodiments of the present technology may include a chamber body having sidewalls and a base. The chamber body may define an internal volume. The systems may include a substrate support assembly having a shaft and a platen coupled with the shaft along a first surface of the platen. The semiconductor processing systems may include a cover plate positioned on the platen of the substrate support assembly along a second surface of the platen opposite the first surface. The cover plate may include a flange extending about an exterior region of the cover plate. The flange may be in direct contact with the platen. The cover plate may include an upper wall vertically offset from the flange. An interior volume may be defined between the upper wall and the platen of the substrate support assembly.
    Type: Grant
    Filed: October 21, 2020
    Date of Patent: June 20, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Venkata Sharat Chandra Parimi, Satish Radhakrishnan, Diwakar Kedlaya, Fang Ruan, Amit Bansal
  • Publication number: 20230121513
    Abstract: Process recipe data associated a process to be performed for a substrate at a process chamber is provided as input to a trained machine learning model. A set of process recipe settings for the process that minimizes scratching on one or more surfaces of the substrate is determined based on one or more outputs of the machine learning model. The process is performed for the substrate at the process chamber in accordance with the determined set of process recipe settings.
    Type: Application
    Filed: December 19, 2022
    Publication date: April 20, 2023
    Inventors: Kartik B. Shah, Satish Radhakrishnan, Karthik Ramanathan, Karthikeyan Balaraman, Adolph Miller Allen, Xinyuan Chong, Mitrabhanu Sahu, Wenjing Xu, Michael Sterling Jackson, Weize Hu, Feng Chen
  • Publication number: 20230092987
    Abstract: Embodiments of apparatus for supplying vaporized reactants to a reaction chamber are described herein. In some embodiments, a showerhead assembly for depositing multiple materials on a substrate includes a plurality of gas delivery portions, each gas delivery portion having an inlet, a wedge shaped body that defines a plenum, and a plurality of openings disposed on a bottom surface of the gas delivery portion, wherein each of the plenums are fluidly isolated from each other.
    Type: Application
    Filed: December 1, 2022
    Publication date: March 23, 2023
    Inventors: ALEXANDER LERNER, PRASHANTH KOTHNUR, ROEY SHAVIV, SATISH RADHAKRISHNAN
  • Patent number: 11600470
    Abstract: Exemplary semiconductor processing chambers may include a chamber body including sidewalls and a base. The chambers may include a substrate support extending through the base of the chamber body. The substrate support may include a support platen configured to support a semiconductor substrate. The substrate support may include a shaft coupled with the support platen. The substrate support may include a shield coupled with the shaft of the substrate support. The shield may include a plurality of apertures defined through the shield. The substrate support may include a block seated in an aperture of the shield.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: March 7, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Venkata Sharat Chandra Parimi, Satish Radhakrishnan, Xiaoquan Min, Sarah Michelle Bobek, Sungwon Ha, Prashant Kumar Kulshreshtha, Vinay Prabhakar
  • Publication number: 20230069317
    Abstract: Exemplary substrate processing systems may include a chamber body defining a transfer region. The systems may include a lid plate seated on the chamber body. The lid plate may define a first plurality of apertures and a second plurality of apertures. The systems may include a plurality of lid stacks equal to a number of the first plurality of apertures. Each lid stack may include a choke plate seated on the lid plate along a first surface of the choke plate. The choke plate may define a first aperture axially aligned with an associated aperture of the first plurality of apertures. The choke plate may define a second aperture axially aligned with an associated aperture of the second plurality of apertures. The choke plate may define protrusions extending from each of a top and bottom surface of the choke plate that are arranged substantially symmetrically about the first aperture.
    Type: Application
    Filed: August 25, 2021
    Publication date: March 2, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Siva Chandrasekar, Satish Radhakrishnan, Viren Kalsekar, Vellaichamy Nagappan, Vinay K. Prabhakar
  • Patent number: 11586160
    Abstract: Methods and systems for reducing substrate particle scratching using machine learning are provided. A machine learning model is trained to predict process recipe settings for a substrate temperature control process to be performed for a current substrate at a manufacturing system. First training data and second training data are generated for the machine learning model. The first training data includes historical data associated with prior process recipe settings for a prior substrate temperature control process performed for a prior substrate at a prior process chamber. The second training data is associated with a historical scratch profile of one or more surfaces of the prior substrate after performance of the prior substrate temperature control process according to the prior process recipe settings.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: February 21, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Kartik B Shah, Satish Radhakrishnan, Karthik Ramanathan, Karthikeyan Balaraman, Adolph Miller Allen, Xinyuan Chong, Mitrabhanu Sahu, Wenjing Xu, Michael Sterling Jackson, Weize Hu, Feng Chen
  • Publication number: 20230042777
    Abstract: One or more embodiments described herein generally relate to methods and systems for forming films on substrates in semiconductor processes. In embodiments described herein, a process system includes different materials each contained in separate ampoules. Each material is flowed into a separate portion of a showerhead contained within a process chamber via a heated gas line. From the showerhead, each material is flowed on to a substrate that sits on the surface of a rotating pedestal. Controlling the mass flow rate out of the showerhead and the rotation rate of the pedestal helps result in films with desirable material domain sizes to be deposited on the substrate.
    Type: Application
    Filed: October 24, 2022
    Publication date: February 9, 2023
    Inventors: Alexander N. LERNER, Roey SHAVIV, Prashanth KOTHNUR, Satish RADHAKRISHNAN, Xiaozhou CHE
  • Publication number: 20220413452
    Abstract: Methods and systems for reducing substrate particle scratching using machine learning are provided. A machine learning model is trained to predict process recipe settings for a substrate temperature control process to be performed for a current substrate at a manufacturing system. First training data and second training data are generated for the machine learning model. The first training data includes historical data associated with prior process recipe settings for a prior substrate temperature control process performed for a prior substrate at a prior process chamber. The second training data is associated with a historical scratch profile of one or more surfaces of the prior substrate after performance of the prior substrate temperature control process according to the prior process recipe settings.
    Type: Application
    Filed: June 28, 2021
    Publication date: December 29, 2022
    Inventors: Kartik B. Shah, Satish Radhakrishnan, Karthik Ramanathan, Karthikeyan Balaraman, Adolph Miller Allen, Xinyuan Chong, Mitrabhanu Sahu, Wenjing Xu, Michael Sterling Jackson, Weize Hu, Feng Chen
  • Patent number: 11515129
    Abstract: An example semiconductor processing system may include a chamber body having sidewalls and a base. The processing system may also include a substrate support extending through the base of the chamber body. The substrate support may include a support platen configured to support a semiconductor substrate, and a shaft coupled with the support platen. The processing system may further include a plate coupled with the shaft of the substrate support. The plate may have an emissivity greater than 0.5. In some embodiments, the plate may include a radiation shied disposed proximate the support platen. In some embodiments, the plate may include a pumping plate disposed proximate the base of the chamber body. In some embodiments, the emissivity of the plate may range between about 0.5 and about 0.95.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: November 29, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Elizabeth Neville, Satish Radhakrishnan, Kartik Shah, Vinay Prabhakar, Venkata Sharat Chandra Parimi, Sungwon Ha
  • Patent number: 11515176
    Abstract: Exemplary substrate processing systems may include chamber body defining a transfer region. The systems may include a lid plate seated on the chamber body. The lid plate may define a first plurality of apertures through the lid plate and a second plurality of apertures through the lid plate. The systems may include a plurality of lid stacks equal to a number of apertures of the first plurality of apertures defined through the lid plate. Each lid stack of the plurality of lid stacks may include a choke plate seated on the lid plate along a first surface of the choke plate. The choke plate may define a first aperture axially aligned with an associated aperture of the first plurality of apertures. The choke plate may define a second aperture axially aligned with an associated aperture of the second plurality of apertures.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: November 29, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Siva Chandrasekar, Satish Radhakrishnan, Rajath Kumar Lakkenahalli Hiriyannaiah, Viren Kalsekar, Vinay Prabhakar
  • Patent number: 11505863
    Abstract: Methods and systems for forming films on substrates in semiconductor processes are disclosed. The method includes providing different materials each contained in separate ampoules. Material is flowed from each ampoule into a separate portion of a showerhead contained within a process chamber via a heated gas line. From the showerhead, each material is flowed on to a substrate that sits on the surface of a rotating pedestal. Controlling the mass flow rate out of the showerhead and the rotation rate of the pedestal helps result in films with desirable material domain sizes to be deposited on the substrate.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: November 22, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Alexander N. Lerner, Roey Shaviv, Prashanth Kothnur, Satish Radhakrishnan, Xiaozhou Che