Patents by Inventor Satish Radhakrishnan

Satish Radhakrishnan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220413452
    Abstract: Methods and systems for reducing substrate particle scratching using machine learning are provided. A machine learning model is trained to predict process recipe settings for a substrate temperature control process to be performed for a current substrate at a manufacturing system. First training data and second training data are generated for the machine learning model. The first training data includes historical data associated with prior process recipe settings for a prior substrate temperature control process performed for a prior substrate at a prior process chamber. The second training data is associated with a historical scratch profile of one or more surfaces of the prior substrate after performance of the prior substrate temperature control process according to the prior process recipe settings.
    Type: Application
    Filed: June 28, 2021
    Publication date: December 29, 2022
    Inventors: Kartik B. Shah, Satish Radhakrishnan, Karthik Ramanathan, Karthikeyan Balaraman, Adolph Miller Allen, Xinyuan Chong, Mitrabhanu Sahu, Wenjing Xu, Michael Sterling Jackson, Weize Hu, Feng Chen
  • Patent number: 11515129
    Abstract: An example semiconductor processing system may include a chamber body having sidewalls and a base. The processing system may also include a substrate support extending through the base of the chamber body. The substrate support may include a support platen configured to support a semiconductor substrate, and a shaft coupled with the support platen. The processing system may further include a plate coupled with the shaft of the substrate support. The plate may have an emissivity greater than 0.5. In some embodiments, the plate may include a radiation shied disposed proximate the support platen. In some embodiments, the plate may include a pumping plate disposed proximate the base of the chamber body. In some embodiments, the emissivity of the plate may range between about 0.5 and about 0.95.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: November 29, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Elizabeth Neville, Satish Radhakrishnan, Kartik Shah, Vinay Prabhakar, Venkata Sharat Chandra Parimi, Sungwon Ha
  • Patent number: 11515176
    Abstract: Exemplary substrate processing systems may include chamber body defining a transfer region. The systems may include a lid plate seated on the chamber body. The lid plate may define a first plurality of apertures through the lid plate and a second plurality of apertures through the lid plate. The systems may include a plurality of lid stacks equal to a number of apertures of the first plurality of apertures defined through the lid plate. Each lid stack of the plurality of lid stacks may include a choke plate seated on the lid plate along a first surface of the choke plate. The choke plate may define a first aperture axially aligned with an associated aperture of the first plurality of apertures. The choke plate may define a second aperture axially aligned with an associated aperture of the second plurality of apertures.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: November 29, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Siva Chandrasekar, Satish Radhakrishnan, Rajath Kumar Lakkenahalli Hiriyannaiah, Viren Kalsekar, Vinay Prabhakar
  • Patent number: 11505863
    Abstract: Methods and systems for forming films on substrates in semiconductor processes are disclosed. The method includes providing different materials each contained in separate ampoules. Material is flowed from each ampoule into a separate portion of a showerhead contained within a process chamber via a heated gas line. From the showerhead, each material is flowed on to a substrate that sits on the surface of a rotating pedestal. Controlling the mass flow rate out of the showerhead and the rotation rate of the pedestal helps result in films with desirable material domain sizes to be deposited on the substrate.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: November 22, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Alexander N. Lerner, Roey Shaviv, Prashanth Kothnur, Satish Radhakrishnan, Xiaozhou Che
  • Publication number: 20220367236
    Abstract: Some embodiments of the disclosure relate to methods of modifying a heater pedestal to improve temperature and thickness uniformity. Some embodiments of the disclosure relate to the modified heater pedestals with improved temperature and thickness uniformity. In some embodiments, the height of support mesas in different regions of the pedestal are modified to increase temperature uniformity. In some embodiments, the heater elements are moved above the vacuum channel and purge channel to increase temperature uniformity. In some embodiments, the edge ring is modified to be coplanar with the top of a supported substrate.
    Type: Application
    Filed: October 8, 2021
    Publication date: November 17, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Muhannad Mustafa, Yongjing Lin, Satish Radhakrishnan, Haoyan Sha, Shih Chung Chen, Mario D. Silvetti, Mandyam Sriram, Vijay D. Parkhe
  • Publication number: 20220351988
    Abstract: Methods and apparatus for controlling a flow of process material to a deposition chamber.
    Type: Application
    Filed: July 18, 2022
    Publication date: November 3, 2022
    Inventors: ALEXANDER LERNER, ROEY SHAVIV, PHILLIP STOUT, JOSEPH M. RANISH, PRASHANTH KOTHNUR, SATISH RADHAKRISHNAN
  • Patent number: 11393703
    Abstract: Methods and apparatus for controlling a flow of process material to a deposition chamber.
    Type: Grant
    Filed: June 16, 2019
    Date of Patent: July 19, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Alexander Lerner, Roey Shaviv, Phillip Stout, Joseph M Ranish, Prashanth Kothnur, Satish Radhakrishnan
  • Publication number: 20220122822
    Abstract: Semiconductor processing systems according to embodiments of the present technology may include a chamber body having sidewalls and a base. The chamber body may define an internal volume. The systems may include a substrate support assembly having a shaft and a platen coupled with the shaft along a first surface of the platen. The semiconductor processing systems may include a cover plate positioned on the platen of the substrate support assembly along a second surface of the platen opposite the first surface. The cover plate may include a flange extending about an exterior region of the cover plate. The flange may be in direct contact with the platen. The cover plate may include an upper wall vertically offset from the flange. An interior volume may be defined between the upper wall and the platen of the substrate support assembly.
    Type: Application
    Filed: October 21, 2020
    Publication date: April 21, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Venkata Sharat Chandra Parimi, Satish Radhakrishnan, Diwakar Kedlaya, Fang Ruan, Amit Bansal
  • Publication number: 20210320018
    Abstract: Exemplary substrate processing systems may include chamber body defining a transfer region. The systems may include a lid plate seated on the chamber body. The lid plate may define a first plurality of apertures through the lid plate and a second plurality of apertures through the lid plate. The systems may include a plurality of lid stacks equal to a number of apertures of the first plurality of apertures defined through the lid plate. Each lid stack of the plurality of lid stacks may include a choke plate seated on the lid plate along a first surface of the choke plate. The choke plate may define a first aperture axially aligned with an associated aperture of the first plurality of apertures. The choke plate may define a second aperture axially aligned with an associated aperture of the second plurality of apertures.
    Type: Application
    Filed: April 14, 2020
    Publication date: October 14, 2021
    Applicant: Applied Materials, Inc.
    Inventors: Siva Chandrasekar, Satish Radhakrishnan, Rajath Kumar Lakkenahalli Hiriyannaiah, Viren Kalsekar, Vinay Prabhakar
  • Publication number: 20210320027
    Abstract: Exemplary methods of semiconductor processing may include coupling a fluid conduit within a substrate support in a semiconductor processing chamber to a system foreline. The coupling may vacuum chuck a substrate with the substrate support. The methods may include flowing a gas into the fluid conduit. The methods may include maintaining a pressure between the substrate and the substrate support at a pressure higher than the pressure at the system foreline.
    Type: Application
    Filed: April 9, 2020
    Publication date: October 14, 2021
    Applicant: Applied Materials, Inc.
    Inventors: Zubin Huang, Rui Cheng, Diwakar Kedlaya, Satish Radhakrishnan, Anton V. Baryshnikov, Venkatanarayana Shankaramurthy, Karthik Janakiraman, Paul L. Brillhart, Badri N. Ramamurthi
  • Publication number: 20210202218
    Abstract: Exemplary semiconductor processing chambers may include a chamber body including sidewalls and a base. The chambers may include a substrate support extending through the base of the chamber body. The substrate support may include a support platen configured to support a semiconductor substrate. The substrate support may include a shaft coupled with the support platen. The substrate support may include a shield coupled with the shaft of the substrate support. The shield may include a plurality of apertures defined through the shield. The substrate support may include a block seated in an aperture of the shield.
    Type: Application
    Filed: December 27, 2019
    Publication date: July 1, 2021
    Applicant: Applied Materials, Inc.
    Inventors: Venkata Sharat Chandra Parimi, Satish Radhakrishnan, Xiaoquan Min, Sarah Michelle Bobek, Sungwon Ha, Prashant Kumar Kulshreshtha, Vinay Prabhakar
  • Publication number: 20210166921
    Abstract: An example semiconductor processing system may include a chamber body having sidewalls and a base. The processing system may also include a substrate support extending through the base of the chamber body. The substrate support may include a support platen configured to support a semiconductor substrate, and a shaft coupled with the support platen. The processing system may further include a plate coupled with the shaft of the substrate support. The plate may have an emissivity greater than 0.5. In some embodiments, the plate may include a radiation shied disposed proximate the support platen. In some embodiments, the plate may include a pumping plate disposed proximate the base of the chamber body. In some embodiments, the emissivity of the plate may range between about 0.5 and about 0.95.
    Type: Application
    Filed: December 3, 2019
    Publication date: June 3, 2021
    Applicant: Applied Materials, Inc.
    Inventors: Elizabeth Neville, Satish Radhakrishnan, Kartik Shah, Vinay Prabhakar, Venkata Sharat Chandra Parimi, Sungwon Ha
  • Publication number: 20210025048
    Abstract: One or more embodiments described herein generally relate to methods and systems for forming films on substrates in semiconductor processes. In embodiments described herein, process chamber is provided that includes a lid plate having a plurality of cooling channels formed therein, a pedestal, the pedestal having a plurality of cooling channels formed therein, and a showerhead, wherein the showerhead comprises a plurality of segments and each segment is at least partially surrounded by a shield.
    Type: Application
    Filed: July 8, 2020
    Publication date: January 28, 2021
    Inventors: Alexander N. LERNER, Roey SHAVIV, Satish RADHAKRISHNAN
  • Publication number: 20200378000
    Abstract: One or more embodiments described herein generally relate to methods and systems for forming films on substrates in semiconductor processes. In embodiments described herein, a process system includes different materials each contained in separate ampoules. Each material is flowed into a separate portion of a showerhead contained within a process chamber via a heated gas line. From the showerhead, each material is flowed on to a substrate that sits on the surface of a rotating pedestal. Controlling the mass flow rate out of the showerhead and the rotation rate of the pedestal helps result in films with desirable material domain sizes to be deposited on the substrate.
    Type: Application
    Filed: April 21, 2020
    Publication date: December 3, 2020
    Inventors: Alexander N. Lerner, Roey Shaviv, Prashanth Kothnur, Satish Radhakrishnan, Xiaozhou Che
  • Publication number: 20200234932
    Abstract: Embodiments of the present disclosure generally relate to a pedestal for increasing temperature uniformity in a substrate supported thereon. The pedestal comprises a body having a heater embedded therein. The body comprises a patterned surface that includes a first region having a first plurality of posts extending from a base surface of the body at a first height, and a second region surrounding the central region having a second plurality of posts extending from the base surface at a second height that is greater than the first height, wherein an upper surface of each of the first plurality of posts and the second plurality of posts are substantially coplanar and define a substrate receiving surface.
    Type: Application
    Filed: December 4, 2019
    Publication date: July 23, 2020
    Inventors: Venkata Sharat Chandra PARIMI, Zubin HUANG, Jian LI, Satish RADHAKRISHNAN, Rui CHENG, Diwakar N. KEDLAYA, Juan Carlos ROCHA-ALVAREZ, Umesh M. KELKAR, Karthik JANAKIRAMAN, Sarah Michelle BOBEK, Prashant Kumar KULSHRESHTHA, Vinay K. PRABHAKAR, Byung Seok KWON
  • Publication number: 20200087790
    Abstract: Embodiments of apparatus for supplying vaporized reactants to a reaction chamber are described herein. In some embodiments, a showerhead assembly for depositing multiple materials on a substrate includes a plurality of gas delivery portions, each gas delivery portion having an inlet, a wedge shaped body that defines a plenum, and a plurality of openings disposed on a bottom surface of the gas delivery portion, wherein each of the plenums are fluidly isolated from each other.
    Type: Application
    Filed: September 13, 2019
    Publication date: March 19, 2020
    Inventors: ALEXANDER LERNER, PRASHANTH KOTHNUR, ROEY SHAVIV, SATISH RADHAKRISHNAN
  • Publication number: 20200048767
    Abstract: Embodiments of a showerhead are described herein. In some embodiments, a showerhead assembly includes: a first gas delivery portion having a first body, a first inlet, and a plurality of first tubes extending from the first body and defining a first plenum, wherein each tube of the plurality of first tubes includes a plurality of first holes; and a second gas delivery portion having a second body, a second inlet, and a plurality of second tubes extending from the second body and defining a second plenum fluidly independent from the first plenum, wherein each tube of the plurality of second tubes includes a plurality of second holes, and wherein the plurality of first tubes are disposed in an alternating pattern with the plurality of second tubes across a width of the showerhead assembly and a heat sink disposed between the plurality of first tubes and the plurality of second tubes.
    Type: Application
    Filed: August 6, 2019
    Publication date: February 13, 2020
    Inventors: PRASHANTH KOTHNUR, SATISH RADHAKRISHNAN, ALEXANDER LERNER, SERGEI KLIMOVICH, ROEY SHAVIV
  • Publication number: 20190382890
    Abstract: Methods and apparatus for controlling a flow of process material to a deposition chamber.
    Type: Application
    Filed: June 16, 2019
    Publication date: December 19, 2019
    Inventors: ALEXANDER LERNER, ROEY SHAVIV, PHILLIP STOUT, JOSEPH M. RANISH, PRASHANTH KOTHNUR, SATISH RADHAKRISHNAN
  • Patent number: 9461010
    Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.
    Type: Grant
    Filed: January 18, 2016
    Date of Patent: October 4, 2016
    Assignee: Intel Corporation
    Inventors: Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan, Tatyana Andryushchenko, Guanghai Xu
  • Publication number: 20160133596
    Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.
    Type: Application
    Filed: January 18, 2016
    Publication date: May 12, 2016
    Applicant: Intel Corporation
    Inventors: Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan, Tatyana Andryushchenko, Guanghai Xu