Patents by Inventor Satish Radhakrishnan

Satish Radhakrishnan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEGMENTED SHOWERHEAD FOR UNIFORM DELIVERY OF MULTIPLE PRECURSORS
    Publication number: 20200087790
    Abstract: Embodiments of apparatus for supplying vaporized reactants to a reaction chamber are described herein. In some embodiments, a showerhead assembly for depositing multiple materials on a substrate includes a plurality of gas delivery portions, each gas delivery portion having an inlet, a wedge shaped body that defines a plenum, and a plurality of openings disposed on a bottom surface of the gas delivery portion, wherein each of the plenums are fluidly isolated from each other.
    Type: Application
    Filed: September 13, 2019
    Publication date: March 19, 2020
    Inventors: ALEXANDER LERNER, PRASHANTH KOTHNUR, ROEY SHAVIV, SATISH RADHAKRISHNAN
  • SHOWERHEAD FOR PROVIDING MULTIPLE MATERIALS TO A PROCESS CHAMBER
    Publication number: 20200048767
    Abstract: Embodiments of a showerhead are described herein. In some embodiments, a showerhead assembly includes: a first gas delivery portion having a first body, a first inlet, and a plurality of first tubes extending from the first body and defining a first plenum, wherein each tube of the plurality of first tubes includes a plurality of first holes; and a second gas delivery portion having a second body, a second inlet, and a plurality of second tubes extending from the second body and defining a second plenum fluidly independent from the first plenum, wherein each tube of the plurality of second tubes includes a plurality of second holes, and wherein the plurality of first tubes are disposed in an alternating pattern with the plurality of second tubes across a width of the showerhead assembly and a heat sink disposed between the plurality of first tubes and the plurality of second tubes.
    Type: Application
    Filed: August 6, 2019
    Publication date: February 13, 2020
    Inventors: PRASHANTH KOTHNUR, SATISH RADHAKRISHNAN, ALEXANDER LERNER, SERGEI KLIMOVICH, ROEY SHAVIV
  • APPARATUS AND METHOD FOR CONTROLLING A FLOW PROCESS MATERIAL TO A DEPOSITION CHAMBER
    Publication number: 20190382890
    Abstract: Methods and apparatus for controlling a flow of process material to a deposition chamber.
    Type: Application
    Filed: June 16, 2019
    Publication date: December 19, 2019
    Inventors: ALEXANDER LERNER, ROEY SHAVIV, PHILLIP STOUT, JOSEPH M. RANISH, PRASHANTH KOTHNUR, SATISH RADHAKRISHNAN
  • Debond interconnect structures
    Patent number: 9461010
    Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.
    Type: Grant
    Filed: January 18, 2016
    Date of Patent: October 4, 2016
    Assignee: Intel Corporation
    Inventors: Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan, Tatyana Andryushchenko, Guanghai Xu
  • DEBOND INTERCONNECT STRUCTURES
    Publication number: 20160133596
    Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.
    Type: Application
    Filed: January 18, 2016
    Publication date: May 12, 2016
    Applicant: Intel Corporation
    Inventors: Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan, Tatyana Andryushchenko, Guanghai Xu
  • Debond interconnect structures
    Patent number: 9269686
    Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: February 23, 2016
    Assignee: Intel Corporation
    Inventors: Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan, Tatyana T. Adryushchenko, Guanghai Xu
  • DEBOND INTERCONNECT STRUCTURES
    Publication number: 20140106560
    Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.
    Type: Application
    Filed: December 18, 2013
    Publication date: April 17, 2014
    Inventors: Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan, Tatyana Tanya Andryushcheko, Guanghai Xu
  • Debond interconnect structures
    Patent number: 8637778
    Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.
    Type: Grant
    Filed: April 8, 2010
    Date of Patent: January 28, 2014
    Assignee: Intel Corporation
    Inventors: Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan, Tatyana Tanya Andryushchenko, Guanghai Xu
  • DEBOND INTERCONNECT STRUCTURES
    Publication number: 20110247872
    Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.
    Type: Application
    Filed: April 8, 2010
    Publication date: October 13, 2011
    Inventors: Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan, Tatyana Tanya Andryushchenko, Guanghai Xu