Patents by Inventor Satish Radhakrishnan
Satish Radhakrishnan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220351988Abstract: Methods and apparatus for controlling a flow of process material to a deposition chamber.Type: ApplicationFiled: July 18, 2022Publication date: November 3, 2022Inventors: ALEXANDER LERNER, ROEY SHAVIV, PHILLIP STOUT, JOSEPH M. RANISH, PRASHANTH KOTHNUR, SATISH RADHAKRISHNAN
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Patent number: 11393703Abstract: Methods and apparatus for controlling a flow of process material to a deposition chamber.Type: GrantFiled: June 16, 2019Date of Patent: July 19, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Alexander Lerner, Roey Shaviv, Phillip Stout, Joseph M Ranish, Prashanth Kothnur, Satish Radhakrishnan
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Publication number: 20220122822Abstract: Semiconductor processing systems according to embodiments of the present technology may include a chamber body having sidewalls and a base. The chamber body may define an internal volume. The systems may include a substrate support assembly having a shaft and a platen coupled with the shaft along a first surface of the platen. The semiconductor processing systems may include a cover plate positioned on the platen of the substrate support assembly along a second surface of the platen opposite the first surface. The cover plate may include a flange extending about an exterior region of the cover plate. The flange may be in direct contact with the platen. The cover plate may include an upper wall vertically offset from the flange. An interior volume may be defined between the upper wall and the platen of the substrate support assembly.Type: ApplicationFiled: October 21, 2020Publication date: April 21, 2022Applicant: Applied Materials, Inc.Inventors: Venkata Sharat Chandra Parimi, Satish Radhakrishnan, Diwakar Kedlaya, Fang Ruan, Amit Bansal
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Publication number: 20210320027Abstract: Exemplary methods of semiconductor processing may include coupling a fluid conduit within a substrate support in a semiconductor processing chamber to a system foreline. The coupling may vacuum chuck a substrate with the substrate support. The methods may include flowing a gas into the fluid conduit. The methods may include maintaining a pressure between the substrate and the substrate support at a pressure higher than the pressure at the system foreline.Type: ApplicationFiled: April 9, 2020Publication date: October 14, 2021Applicant: Applied Materials, Inc.Inventors: Zubin Huang, Rui Cheng, Diwakar Kedlaya, Satish Radhakrishnan, Anton V. Baryshnikov, Venkatanarayana Shankaramurthy, Karthik Janakiraman, Paul L. Brillhart, Badri N. Ramamurthi
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Publication number: 20210320018Abstract: Exemplary substrate processing systems may include chamber body defining a transfer region. The systems may include a lid plate seated on the chamber body. The lid plate may define a first plurality of apertures through the lid plate and a second plurality of apertures through the lid plate. The systems may include a plurality of lid stacks equal to a number of apertures of the first plurality of apertures defined through the lid plate. Each lid stack of the plurality of lid stacks may include a choke plate seated on the lid plate along a first surface of the choke plate. The choke plate may define a first aperture axially aligned with an associated aperture of the first plurality of apertures. The choke plate may define a second aperture axially aligned with an associated aperture of the second plurality of apertures.Type: ApplicationFiled: April 14, 2020Publication date: October 14, 2021Applicant: Applied Materials, Inc.Inventors: Siva Chandrasekar, Satish Radhakrishnan, Rajath Kumar Lakkenahalli Hiriyannaiah, Viren Kalsekar, Vinay Prabhakar
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Publication number: 20210202218Abstract: Exemplary semiconductor processing chambers may include a chamber body including sidewalls and a base. The chambers may include a substrate support extending through the base of the chamber body. The substrate support may include a support platen configured to support a semiconductor substrate. The substrate support may include a shaft coupled with the support platen. The substrate support may include a shield coupled with the shaft of the substrate support. The shield may include a plurality of apertures defined through the shield. The substrate support may include a block seated in an aperture of the shield.Type: ApplicationFiled: December 27, 2019Publication date: July 1, 2021Applicant: Applied Materials, Inc.Inventors: Venkata Sharat Chandra Parimi, Satish Radhakrishnan, Xiaoquan Min, Sarah Michelle Bobek, Sungwon Ha, Prashant Kumar Kulshreshtha, Vinay Prabhakar
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Publication number: 20210166921Abstract: An example semiconductor processing system may include a chamber body having sidewalls and a base. The processing system may also include a substrate support extending through the base of the chamber body. The substrate support may include a support platen configured to support a semiconductor substrate, and a shaft coupled with the support platen. The processing system may further include a plate coupled with the shaft of the substrate support. The plate may have an emissivity greater than 0.5. In some embodiments, the plate may include a radiation shied disposed proximate the support platen. In some embodiments, the plate may include a pumping plate disposed proximate the base of the chamber body. In some embodiments, the emissivity of the plate may range between about 0.5 and about 0.95.Type: ApplicationFiled: December 3, 2019Publication date: June 3, 2021Applicant: Applied Materials, Inc.Inventors: Elizabeth Neville, Satish Radhakrishnan, Kartik Shah, Vinay Prabhakar, Venkata Sharat Chandra Parimi, Sungwon Ha
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Publication number: 20210025048Abstract: One or more embodiments described herein generally relate to methods and systems for forming films on substrates in semiconductor processes. In embodiments described herein, process chamber is provided that includes a lid plate having a plurality of cooling channels formed therein, a pedestal, the pedestal having a plurality of cooling channels formed therein, and a showerhead, wherein the showerhead comprises a plurality of segments and each segment is at least partially surrounded by a shield.Type: ApplicationFiled: July 8, 2020Publication date: January 28, 2021Inventors: Alexander N. LERNER, Roey SHAVIV, Satish RADHAKRISHNAN
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Publication number: 20200378000Abstract: One or more embodiments described herein generally relate to methods and systems for forming films on substrates in semiconductor processes. In embodiments described herein, a process system includes different materials each contained in separate ampoules. Each material is flowed into a separate portion of a showerhead contained within a process chamber via a heated gas line. From the showerhead, each material is flowed on to a substrate that sits on the surface of a rotating pedestal. Controlling the mass flow rate out of the showerhead and the rotation rate of the pedestal helps result in films with desirable material domain sizes to be deposited on the substrate.Type: ApplicationFiled: April 21, 2020Publication date: December 3, 2020Inventors: Alexander N. Lerner, Roey Shaviv, Prashanth Kothnur, Satish Radhakrishnan, Xiaozhou Che
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Publication number: 20200234932Abstract: Embodiments of the present disclosure generally relate to a pedestal for increasing temperature uniformity in a substrate supported thereon. The pedestal comprises a body having a heater embedded therein. The body comprises a patterned surface that includes a first region having a first plurality of posts extending from a base surface of the body at a first height, and a second region surrounding the central region having a second plurality of posts extending from the base surface at a second height that is greater than the first height, wherein an upper surface of each of the first plurality of posts and the second plurality of posts are substantially coplanar and define a substrate receiving surface.Type: ApplicationFiled: December 4, 2019Publication date: July 23, 2020Inventors: Venkata Sharat Chandra PARIMI, Zubin HUANG, Jian LI, Satish RADHAKRISHNAN, Rui CHENG, Diwakar N. KEDLAYA, Juan Carlos ROCHA-ALVAREZ, Umesh M. KELKAR, Karthik JANAKIRAMAN, Sarah Michelle BOBEK, Prashant Kumar KULSHRESHTHA, Vinay K. PRABHAKAR, Byung Seok KWON
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Publication number: 20200087790Abstract: Embodiments of apparatus for supplying vaporized reactants to a reaction chamber are described herein. In some embodiments, a showerhead assembly for depositing multiple materials on a substrate includes a plurality of gas delivery portions, each gas delivery portion having an inlet, a wedge shaped body that defines a plenum, and a plurality of openings disposed on a bottom surface of the gas delivery portion, wherein each of the plenums are fluidly isolated from each other.Type: ApplicationFiled: September 13, 2019Publication date: March 19, 2020Inventors: ALEXANDER LERNER, PRASHANTH KOTHNUR, ROEY SHAVIV, SATISH RADHAKRISHNAN
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Publication number: 20200048767Abstract: Embodiments of a showerhead are described herein. In some embodiments, a showerhead assembly includes: a first gas delivery portion having a first body, a first inlet, and a plurality of first tubes extending from the first body and defining a first plenum, wherein each tube of the plurality of first tubes includes a plurality of first holes; and a second gas delivery portion having a second body, a second inlet, and a plurality of second tubes extending from the second body and defining a second plenum fluidly independent from the first plenum, wherein each tube of the plurality of second tubes includes a plurality of second holes, and wherein the plurality of first tubes are disposed in an alternating pattern with the plurality of second tubes across a width of the showerhead assembly and a heat sink disposed between the plurality of first tubes and the plurality of second tubes.Type: ApplicationFiled: August 6, 2019Publication date: February 13, 2020Inventors: PRASHANTH KOTHNUR, SATISH RADHAKRISHNAN, ALEXANDER LERNER, SERGEI KLIMOVICH, ROEY SHAVIV
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Publication number: 20190382890Abstract: Methods and apparatus for controlling a flow of process material to a deposition chamber.Type: ApplicationFiled: June 16, 2019Publication date: December 19, 2019Inventors: ALEXANDER LERNER, ROEY SHAVIV, PHILLIP STOUT, JOSEPH M. RANISH, PRASHANTH KOTHNUR, SATISH RADHAKRISHNAN
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Patent number: 9461010Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.Type: GrantFiled: January 18, 2016Date of Patent: October 4, 2016Assignee: Intel CorporationInventors: Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan, Tatyana Andryushchenko, Guanghai Xu
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Publication number: 20160133596Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.Type: ApplicationFiled: January 18, 2016Publication date: May 12, 2016Applicant: Intel CorporationInventors: Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan, Tatyana Andryushchenko, Guanghai Xu
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Patent number: 9269686Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.Type: GrantFiled: December 18, 2013Date of Patent: February 23, 2016Assignee: Intel CorporationInventors: Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan, Tatyana T. Adryushchenko, Guanghai Xu
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Publication number: 20140106560Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.Type: ApplicationFiled: December 18, 2013Publication date: April 17, 2014Inventors: Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan, Tatyana Tanya Andryushcheko, Guanghai Xu
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Patent number: 8637778Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.Type: GrantFiled: April 8, 2010Date of Patent: January 28, 2014Assignee: Intel CorporationInventors: Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan, Tatyana Tanya Andryushchenko, Guanghai Xu
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Publication number: 20110247872Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.Type: ApplicationFiled: April 8, 2010Publication date: October 13, 2011Inventors: Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan, Tatyana Tanya Andryushchenko, Guanghai Xu