Abstract: An imprint lithography system includes: a first chuck configured to support a first substrate; a first bushing surrounding the first chuck and configured to pneumatically suspend the first chuck laterally within the first bushing; one or more supportive mechanisms disposed beneath the first chuck and configured to support the first chuck vertically within the first bushing, wherein the first chuck is configured to be forced in a downward direction against first vertical resistive forces provided by the one or more supportive mechanisms, while the first chuck is suspended laterally within the first bushing and while the first chuck is maintained in the first fixed rotational orientation.

Abstract: Systems and methods for managing multi-objective alignments in imprinting (e.g., single-sided or double-sided) are provided. An example system includes rollers for moving a template roll, a stage for holding a substrate, a dispenser for dispensing resist on the substrate, a light source for curing the resist to form an imprint on the substrate when a template of the template roll is pressed into the resist on the substrate, a first inspection system for registering a fiducial mark of the template to determine a template offset, a second inspection system for registering the imprint on the substrate to determine a wafer registration offset between a target location and an actual location of the imprint, and a controller for controlling to move the substrate with the resist below the template based on the template offset, and determine an overlay bias of the imprint on the substrate based on the wafer registration offset.

Abstract: In an example method of forming an optical film for an eyepiece, a curable material is dispensed into a space between a first and a second mold surface. A position of the first mold surface relative to the second mold surface is measured using a plurality of sensors. Each sensor measures a respective relative distance along a respective measurement axis between a respective point on a planar portion of the first mold surface and a respective point on a planar portion of the second mold surface. The measurement axes are parallel to each other, and the points define corresponding triangles on the first and second mold surfaces, respectively. The position of the first mold surface is adjusted relative to the second mold surface based on the measured position, and the curable material is cured to form the optical film.

Abstract: An imprint lithography system includes: a first chuck configured to support a first substrate; a first bushing surrounding the first chuck and configured to pneumatically suspend the first chuck laterally within the first bushing; one or more supportive mechanisms disposed beneath the first chuck and configured to support the first chuck vertically within the first bushing, wherein the first chuck is configured to be forced in a downward direction against first vertical resistive forces provided by the one or more supportive mechanisms, while the first chuck is suspended laterally within the first bushing and while the first chuck is maintained in the first fixed rotational orientation.

Abstract: Systems, apparatus, and methods for double-sided imprinting are provided. An example system includes first rollers for moving a first web including a first template having a first imprinting feature, second rollers for moving a second web including a second template having a second imprinting feature, dispensers for dispensing resist, a locating system for locating reference marks on the first and second webs for aligning the first and second templates, a light source for curing the resist, such that a cured first resist has a first imprinted feature corresponding to the first imprinting feature on one side of the substrate and a cured second resist has a second imprinted feature corresponding to the second imprinting feature on the other side of the substrate, and a moving system for feeding in the substrate between the first and second templates and unloading the double-imprinted substrate from the first and second webs.

Abstract: An imprint lithography method for positioning substrates includes supporting first and second substrates respectively atop first and second chucks, pneumatically suspending the first and second chucks laterally within first and second bushings, supporting the first and second chucks vertically within the first and second bushings, maintaining the first and second chucks respectively in first and second fixed rotational orientations, and forcing the first and second chucks in a downward direction independently of each other respectively against first and second vertical resistive forces until first and second top surfaces of the first and second substrates are coplanar, while maintaining the first and second chucks suspended laterally within the first and second bushings and while maintaining the first and second chucks in the first and second fixed rotational orientations.

Abstract: Systems, apparatus, and methods for double-sided imprinting are provided. An example system includes first rollers for moving a first web including a first template having a first imprinting feature, second rollers for moving a second web including a second template having a second imprinting feature, dispensers for dispensing resist, a locating system for locating reference marks on the first and second webs for aligning the first and second templates, a light source for curing the resist, such that a cured first resist has a first imprinted feature corresponding to the first imprinting feature on one side of the substrate and a cured second resist has a second imprinted feature corresponding to the second imprinting feature on the other side of the substrate, and a moving system for feeding in the substrate between the first and second templates and unloading the double-imprinted substrate from the first and second webs.

Abstract: In an example method of forming an optical film for an eyepiece, a curable material is dispensed into a space between a first and a second mold surface. A position of the first mold surface relative to the second mold surface is measured using a plurality of sensors. Each sensor measures a respective relative distance along a respective measurement axis between a respective point on a planar portion of the first mold surface and a respective point on a planar portion of the second mold surface. The measurement axes are parallel to each other, and the points define corresponding triangles on the first and second mold surfaces, respectively. The position of the first mold surface is adjusted relative to the second mold surface based on the measured position, and the curable material is cured to form the optical film.

Abstract: Systems, apparatus, and methods for double-sided imprinting are provided. An example system includes first rollers for moving a first web including a first template having a first imprinting feature, second rollers for moving a second web including a second template having a second imprinting feature, dispensers for dispensing resist, a locating system for locating reference marks on the first and second webs for aligning the first and second templates, a light source for curing the resist, such that a cured first resist has a first imprinted feature corresponding to the first imprinting feature on one side of the substrate and a cured second resist has a second imprinted feature corresponding to the second imprinting feature on the other side of the substrate, and a moving system for feeding in the substrate between the first and second templates and unloading the double-imprinted substrate from the first and second webs.

Abstract: An imprint lithography method for positioning substrates includes supporting first and second substrates respectively atop first and second chucks, pneumatically suspending the first and second chucks laterally within first and second bushings, supporting the first and second chucks vertically within the first and second bushings, maintaining the first and second chucks respectively in first and second fixed rotational orientations, and forcing the first and second chucks in a downward direction independently of each other respectively against first and second vertical resistive forces until first and second top surfaces of the first and second substrates are coplanar, while maintaining the first and second chucks suspended laterally within the first and second bushings and while maintaining the first and second chucks in the first and second fixed rotational orientations.

Abstract: Systems, apparatus, and methods for double-sided imprinting are provided. An example system includes first rollers for moving a first web including a first template having a first imprinting feature, second rollers for moving a second web including a second template having a second imprinting feature, dispensers for dispensing resist, a locating system for locating reference marks on the first and second webs for aligning the first and second templates, a light source for curing the resist, such that a cured first resist has a first imprinted feature corresponding to the first imprinting feature on one side of the substrate and a cured second resist has a second imprinted feature corresponding to the second imprinting feature on the other side of the substrate, and a moving system for feeding in the substrate between the first and second templates and unloading the double-imprinted substrate from the first and second webs.

Abstract: An imprint lithography method for positioning substrates includes supporting first and second substrates respectively atop first and second chucks, pneumatically suspending the first and second chucks laterally within first and second bushings, supporting the first and second chucks vertically within the first and second bushings, maintaining the first and second chucks respectively in first and second fixed rotational orientations, and forcing the first and second chucks in a downward direction independently of each other respectively against first and second vertical resistive forces until first and second top surfaces of the first and second substrates are coplanar, while maintaining the first and second chucks suspended laterally within the first and second bushings and while maintaining the first and second chucks in the first and second fixed rotational orientations.

Abstract: A method of aligning a stencil to an eyepiece wafer includes providing the stencil, positioning the stencil with respect to a first light source, and determining locations of at least two stencil apertures. The method also includes providing the eyepiece wafer. The eyepiece wafer includes at least two eyepiece waveguides, each eyepiece waveguide including an incoupling grating and a corresponding diffraction pattern. The method further includes directing light from one or more second light sources to impinge on each of the corresponding diffraction patterns, imaging light diffracted from each incoupling grating, determining at least two incoupling grating locations, determining offsets between corresponding stencil aperture locations and incoupling grating locations, and aligning the stencil to the eyepiece wafer based on the determined offsets.

Abstract: Methods, systems, and apparatus for the loading and unloading of substrates, such as semiconductor wafers, involving microlithography and similar nano-fabrication techniques. The system includes two or more pedestals; a substrate chuck including two or more channels; a turntable having a top surface and a first end positioned opposite a second end, each of the first and second ends including a respective opening, each opening including two or more cutouts and two or more tabs, the turntable rotatable between first and second positions and an actuator system to adjust distances between the turntable and the substrate chuck and between the turntable and the pedestals.

Abstract: Systems, apparatus, and methods for double-sided imprinting are provided. An example system includes first rollers for moving a first web including a first template having a first imprinting feature, second rollers for moving a second web including a second template having a second imprinting feature, dispensers for dispensing resist, a locating system for locating reference marks on the first and second webs for aligning the first and second templates, a light source for curing the resist, such that a cured first resist has a first imprinted feature corresponding to the first imprinting feature on one side of the substrate and a cured second resist has a second imprinted feature corresponding to the second imprinting feature on the other side of the substrate, and a moving system for feeding in the substrate between the first and second templates and unloading the double-imprinted substrate from the first and second webs.

Abstract: Methods, systems, and apparatus for the loading and unloading of substrates, such as semiconductor wafers, involving microlithography and similar nano-fabrication techniques. The system includes two or more pedestals; a substrate chuck including two or more channels; a turntable having a top surface and a first end positioned opposite a second end, each of the first and second ends including a respective opening, each opening including two or more cutouts and two or more tabs, the turntable rotatable between first and second positions and an actuator system to adjust distances between the turntable and the substrate chuck and between the turntable and the pedestals.

Abstract: Methods, systems, and apparatus for the loading and unloading of substrates, such as semiconductor wafers, involving microlithography and similar nano-fabrication techniques. The system includes two or more pedestals; a substrate chuck including two or more channels; a turntable having a top surface and a first end positioned opposite a second end, each of the first and second ends including a respective opening, each opening including two or more cutouts and two or more tabs, the turntable rotatable between first and second positions and an actuator system to adjust distances between the turntable and the substrate chuck and between the turntable and the pedestals.

Abstract: An imprint lithography method for positioning substrates includes supporting first and second substrates respectively atop first and second chucks, pneumatically suspending the first and second chucks laterally within first and second bushings, supporting the first and second chucks vertically within the first and second bushings, maintaining the first and second chucks respectively in first and second fixed rotational orientations, and forcing the first and second chucks in a downward direction independently of each other respectively against first and second vertical resistive forces until first and second top surfaces of the first and second substrates are coplanar, while maintaining the first and second chucks suspended laterally within the first and second bushings and while maintaining the first and second chucks in the first and second fixed rotational orientations.

Abstract: Methods, systems, and apparatus for the loading and unloading of substrates, such as semiconductor wafers, involving microlithography and similar nano-fabrication techniques. The system includes two or more pedestals; a substrate chuck including two or more channels; a turntable having a top surface and a first end positioned opposite a second end, each of the first and second ends including a respective opening, each opening including two or more cutouts and two or more tabs, the turntable rotatable between first and second positions and an actuator system to adjust distances between the turntable and the substrate chuck and between the turntable and the pedestals.

Abstract: A substrate illumination and inspection system provides for illuminating and inspecting a substrate particularly the substrate edge. The system uses a light diffuser with a plurality of lights disposed at its exterior or interior for providing uniform diffuse illumination of a substrate. An optic and imaging system exterior of the light diffuser are used to inspect the plurality of surfaces of the substrate including specular surfaces. An automatic defect characterization processor is provided.