Patents by Inventor Satoru Yuhaku
Satoru Yuhaku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 5496619Abstract: Conductive paste for via connection of a multilayer ceramic substrate, comprising: an inorganic component which consists of 30.0 to 70.0% by weight of powder of conductive material and the remainder being one of glass powder having a softening point higher than a starting point of sintering of insulating material and crystalline glass ceramic powder having a glass transition point higher than the starting point of sintering of the insulating material; and an organics vehicle component which consists of at least organic binder and solvent.Type: GrantFiled: June 6, 1994Date of Patent: March 5, 1996Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Minehiro Itagaki, Kazuyuki Okano, Suzushi Kimura, Seiichi Nakatani, Yoshihiro Bessho, Satoru Yuhaku, Yasuhiko Hakotani, Kazuhiro Miura
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Patent number: 5407473Abstract: Conductive ink has an inorganic compound comprising 70.0-95.0 wt. % of CuO which is conductive and 5.0-30.0 wt. % of inorganic binder mixed with each other, and solvent and organic binder in which the inorganic compound is dispersed. The inorganic binder consists of lead borosilicate crystalline glass or aluminum borosilicate crystalline glass soften and crystallizes at 850.degree.-950.degree. C. The diameter of CuO powder of the inorganic compound is 100-7.0 .mu.m. The diameter of the lead borosilicate crystalline glass powder or the aluminum borosilicate crystalline glass powder of the inorganic compound is 1.0-5.0 .mu.m. The organic binder consists of ethyl cellulose or copolymer of polyisobytylmethacrylate and poly.alpha.-methylstyrene. The conductive ink contains the organic binder at 0.5-2.0 wt. %.Type: GrantFiled: December 29, 1993Date of Patent: April 18, 1995Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuhiro Miura, Yoshihiro Bessho, Satoru Yuhaku, Yasuhiko Hakotani, Minehiro Itagaki, Yoshifumi Nakamura, Akihiko Miyoshi
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Patent number: 5370759Abstract: A method for producing a multilayered ceramic substrate including the steps of:forming at least two green sheets each including a low-temperature firing glass-ceramic substrate material,forming an electrode pattern and a via hole electrode on and through each green sheet with a conductor paste,laminating said green sheets to obtain a laminate,forming a pair of green sheets which include an inorganic material which is not sintered at a firing temperature of the green sheet of the low-temperature firing glass-ceramic substrate material or lower, and then forming a hole through the inorganic material green sheet,laminating the inorganic material green sheet on the outermost green sheet of the laminate to obtain a resultant laminate in which the hole is positioned over a portion of the electrode pattern of an outermost low-temperature firing glass-ceramic green sheets of the laminate,firing said resultant laminate at the firing temperature, andremoving the unsintered inorganic material.Type: GrantFiled: May 14, 1993Date of Patent: December 6, 1994Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yasuhiko Hakotani, Seiichi Nakatani, Tsuneharu Katada, Satoru Yuhaku, Kazuhiro Miura, Yoshifumi Nakamura
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Patent number: 5252519Abstract: A multilayered glass-ceramic substrate using copper as wiring material is fabricated by a step of forming wiring patterns with Au paste for connection of semiconductor chip prepared by adding at least one of Ni powder, Pt powder and Pd powder to Au powder, and copper oxide paste mainly composed of CuO powder, on a green sheet, and burning out the organic pattern by heat treatment in air, a step of reducing the copper oxide electrode by heat treatment in a reducing atmosphere containing hydrogen, and a step of sintering the substrate material, copper oxide electrode and gold electrode by heat treatment in nitrogen. Since the Au wiring pattern is formed on the top layer of the multilayered substrate in this constitution, wire bonding of high reliability is realized. Besides, by making use of the excellent solderability of Au, it may be also applied in flip-chip mounting of semiconductor.Type: GrantFiled: October 31, 1991Date of Patent: October 12, 1993Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Seiichi Nakatani, Tsutomu Nishimura, Satoru Yuhaku, Yasuhiko Hakotani
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Patent number: 5014158Abstract: A laminated ceramic capacitor comprises a plurality of inner electrode layers for developing a capacitance, dielectric layers sandwiched with the inner electrode layers, and a pair of outer electrodes coupled to their associated inner electrode layers for output of the capacitance. The inner electrode layers are made of Ni. The dielectric layers are made of a dielectric ceramic composition having a structural formula of:{Bam(Til-xZrx)O2+m}1-.alpha.-.beta.-{MnO2}.alpha.-{X}.beta.where X is at least one of Yb2O3, Dy2O3, and ThO2 and m, x, .alpha., and .beta. are expressed as:0.98.ltoreq.m.ltoreq.1.020.ltoreq.x.ltoreq.0.20.005.ltoreq..alpha..ltoreq.0.050.001.ltoreq..beta..ltoreq.0.02so that the laminated ceramic capacitor can be minimized in the size, increased in the capacitance, and reduced in the cost of production.Type: GrantFiled: April 11, 1990Date of Patent: May 7, 1991Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Tsutomu Nishimura, Seiichi Nakatani, Satoru Yuhaku, Yasuhiko Hakotani, Tatsuro Kikuchi
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Patent number: 5004640Abstract: Multilayered ceramic substrates having Cu electrode patterns in or on ceramic-glass insulating layers which consist essentially of Al.sub.2 O.sub.3, SiO.sub.2, B.sub.2 O.sub.3, Na.sub.2 O, K.sub.2 O, CaO, MgO and PbO. The methods for manufacturing the substrate comprises thermally treating a laminate of alternately superimposing ceramic-glass insulating layers and CuO-based electrode layers of desired patterns in air or in a molecular oxygen-containing atmosphere to eliminate organic binders from the laminates by burning out, reducing the CuO into metallic Cu at low temperatures in an atmosphere containing hydrogen, and firing the thus reduced laminate in an inert gas such as nitrogen. The firing is effected at 850.degree. to 950.degree. C. The multilayered ceramic substrate may also be obtained by forming ceramic-glass insulating layers and CuO-based electrode layers alternately on a sintered ceramic support, followed by the thermal treatment, reduction and firing set forth above.Type: GrantFiled: March 10, 1989Date of Patent: April 2, 1991Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Seiichi Nakatani, Satoru Yuhaku, Tsutomu Nishimura, Yukio Terada, Yasuyuki Baba
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Patent number: 4906405Abstract: Disclosed are a CuO conductor paste which is effective for making a multilayered ceramic body, the conductor material of which is made of copper, and a method of manufacturing a multilayered ceramic body using the conductor paste. The conductor paste is made of CuO as the main component with an addition of at least one of PbO-based glass, or any of Bi.sub.2 O.sub.3 -based glass, CuO-based glass and CuAl.sub.2 O.sub.4 as the additive. The multilayered ceramic body is manufactured by a method comprising a forming process for making a multilayered body from the conductor paste and dielectric material, a binder removing process by heat treating the multilayered body, thus obtained, in air, a reduction process for reducing CuO to copper in a mixed gas atmosphere of hydrogen and nitrogen, and a sintering process for sintering the multilayered body thus reduced in a nitrogen gas atmosphere.Type: GrantFiled: May 17, 1988Date of Patent: March 6, 1990Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Seiichi Nakatani, Tsutomu Nishimura, Satoru Yuhaku, Minehiro Itagaki
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Patent number: 4877555Abstract: Disclosed is a conductor paste effective to manufacture a ceramic multilayer structure. The conductor paste comprises an inorganic component containing CuO as a main component and at least one of Cu and Cu.sub.2 O. A multilayer body of the conductor paste and a dielectric paste is subjected to a binder removing process in air, a reduction process in a mixed gas of hydrogen and nitrogen, and a firing process in nitrogen, thereby to obtain a ceramic multilayer structure.Type: GrantFiled: April 13, 1988Date of Patent: October 31, 1989Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Satoru Yuhaku, Seiichi Nakatani, Tutomu Nishimura
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Patent number: 4863683Abstract: A manufacturing method for a multilayered ceramic body using Cu, Ni, Co or Fe as a conductor material, and a conductor forming paste of particular composition of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component, the paste being applied to the multilayered body. The manufacturing method comprises: a process of forming the multilayered body with conductor paste of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component and insulating paste formed of glass and/or ceramic, so that a binder is removed from the laminate by heat treatment in an oxidizing atmosphere; a process of heat treatment for reducing the oxide; and a sintering process for sintering the laminate in a nitrogen atmosphere.Type: GrantFiled: June 24, 1987Date of Patent: September 5, 1989Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Seiichi Nakatani, Satoru Yuhaku, Hideyuki Okinaka, Toru Ishida, Osamu Makino, Tatsuro Kikuchi
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Patent number: 4812422Abstract: Disclosed is a dielectric paste for a ceramic multilayer wiring substrate, of which feature, among others, lies in the composition of inorganic components comprised of ceramics made of Al.sub.2 O.sub.3, SiO.sub.2, CaO and MgO, and a borosilicate glass. This can be prepared by mixing a part of the glass with the ceramic, calcining the mixture at a high temperature, and then adding the remaining glass to mix with the calcined product. The insulation layer is densely formed, and a dielectric paste excelling in electric insulating property can be obtained by mixing this composition with an organic liquid.Type: GrantFiled: June 3, 1986Date of Patent: March 14, 1989Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Satoru Yuhaku, Seiichi Nakatani, Tsutomu Nishimura, Toru Ishida
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Patent number: 4795512Abstract: A method of manufacturing a multilayer ceramic using Cu as the conductor material is disclosed. This method comprises a step of forming a multilayer laminate by the green tape multilayer laminating method or by the thick film printing method on ceramic substrate with an insulating material with a mixture of ceramic and glass containing lead oxide as its main component and a conductor paste with CuO as its main component; a step of heat-treatment for decomposing and removing organic binder in air (binder removing process); a step of causing reduction at temperatures where copper oxide is reduced, but lead oxide is not, in a mixed gas atmosphere of nitrogen and hydrogen (reduction process); and a step of firing in a nitrogen atmosphere, thereby effecting sintering of the insulating material composed of ceramic and glass containing lead oxide and metallization of copper electrodes (firing process).Type: GrantFiled: February 25, 1987Date of Patent: January 3, 1989Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Seiichi Nakatani, Tsutomu Nishimura, Satoru Yuhaku, Toru Ishida
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Patent number: 4714570Abstract: A manufacturing method for a multilayered ceramic body using Cu, Ni, Co or Fe as a conductor material, and a conductor forming paste of a particular composition of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component, the paste being applied to the multilayered body. The manufacturing method comprises: a process of forming the multilayered body with conductor paste of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component and insulating paste formed of glass and/or ceramic, so that a binder is removed from the laminate by heat treatment in an oxidizing atmosphere; a process of heat treatment for reducing the oxide; and a sintering process for sintering the laminate in a nitrogen atmosphere.Type: GrantFiled: July 17, 1985Date of Patent: December 22, 1987Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Seiichi Nakatani, Satoru Yuhaku, Hideyuki Okinaka, Toru Ishida, Osamu Makino, Tatsuro Kikuchi
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Patent number: 4695403Abstract: A thick film conductor composition for a ceramic wiring substrate comprises an inorganic ingredient mainly composed of a copper oxide powder added with a metal capable of forming a homogeneous solid solution with copper, and an organic vehicle. The inorganic ingredient may be further added with a manganese oxide or a heat resistant insulating material such as ceramics and/or glass.Type: GrantFiled: June 17, 1986Date of Patent: September 22, 1987Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Tsutomu Nishimura, Seiichi Nakatani, Satoru Yuhaku, Toru Ishida
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Patent number: 4606750Abstract: A mold used for manufacturing optical glass parts by the direct press molding of lumps of raw optical glass. The pressing surface of the mold is made of a material comprising .alpha. type SiC or amorphous SiC or a mixture of both. The pressing surface may be a coated film on a base body of hard alloy or high density carbon.Type: GrantFiled: December 7, 1984Date of Patent: August 19, 1986Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hideo Torii, Masaki Aoki, Hideyuki Okinaka, Satoru Yuhaku, Shoji Nakamura