Patents by Inventor Satoshi Kamemoto

Satoshi Kamemoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10895807
    Abstract: The invention provides a cured film and a positive type photosensitive resin composition unlikely to cause a decrease in light emission luminance or shrinkage of pixels and high in long term reliability. [Solution] The invention provides a cured film comprising a cured product of a photosensitive resin composition including an alkali-soluble resin (a), a photoacid generating agent (b), at least one compound (c) selected from the group consisting of cyclic amides, cyclic ureas, and derivatives thereof, and a thermal crosslinking agent (d), the thermal crosslinking agent (d) containing an epoxy compound, oxetanyl compound, isocyanate compound, acidic group-containing alkoxymethyl compound, and/or acidic group-containing methylol compound, and the total content of the compound (c) in the cured film being 0.005 mass % or more and 5 mass % or less.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: January 19, 2021
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yuta Shuto, Satoshi Kamemoto, Kazuto Miyoshi
  • Patent number: 10896942
    Abstract: The purpose is to provide an organic EL display device which has good sensitivity and is free from the occurrence of luminance decrease or pixel shrinkage, thereby having excellent long-term reliability. In order to achieve the above-described purpose, provided is the following configuration. Namely, an organic EL display device wherein an insulating layer formed on a first electrode is a cured film obtained by curing a photosensitive resin composition; and the residual amount of acid anhydrides contained in the cured film is from 0.003 to 0.04 (inclusive) when the residual amount of aromatic rings contained in the cured film is taken as 1 (the reference value).
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: January 19, 2021
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Takeshi Arai, Satoshi Kamemoto, Kazuto Miyoshi
  • Publication number: 20210011381
    Abstract: To provide an alkaline developable negative-type photosensitive resin composition from which a cured film that has a high-resolution and low-taper pattern shape and that are excellent in heat resistance and light blocking property can be obtained. A negative-type photosensitive resin composition is characterized by containing an (A1) first resin, a (A2) second resin, a (C) photopolymerization initiator, and a (D) coloring agent, wherein the (A1) first resin is an (A1-1) polyimide and/or an (A1-2) polybenzo-oxazole, and wherein the (A2) second resin is one or more species selected from a (A2-1) polyimide precursor, a (A2-2) polybenzo-oxazole precursor, a (A2-3) polysiloxane, a (A2-4) cardo based resin, and an (A2-5) acrylic resin, and wherein a content ratio of the (A1) first resin in a total of 100 mass % of the (A1) first resin and the (A2) second resin is within the range of 25 to 90 mass %.
    Type: Application
    Filed: September 9, 2020
    Publication date: January 14, 2021
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yugo TANIGAKI, Satoshi KAMEMOTO, Kazuto MIYOSHI
  • Patent number: 10802401
    Abstract: To provide an alkaline developable negative-type photosensitive resin composition from which a cured film that has a high-resolution and low-taper pattern shape and that are excellent in heat resistance and light blocking property can be obtained. A negative-type photosensitive resin composition is characterized by containing an (A1) first resin, a (A2) second resin, a (C) photopolymerization initiator, and a (D) coloring agent, wherein the (A1) first resin is an (A1-1) polyimide and/or an (A1-2) polybenzo-oxazole, and wherein the (A2) second resin is one or more species selected from a (A2-1) polyimide precursor, a (A2-2) polybenzo-oxazole precursor, a (A2-3) polysiloxane, a (A2-4) cardo based resin, and an (A2-5) acrylic resin, and wherein a content ratio of the (A1) first resin in a total of 100 mass % of the (A1) first resin and the (A2) second resin is within the range of 25 to 90 mass %.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: October 13, 2020
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yugo Tanigaki, Satoshi Kamemoto, Kazuto Miyoshi
  • Patent number: 10613439
    Abstract: The invention aims to provide a photosensitive colored resin composition and a heat resistant colored resin film produced therefrom that has the function of absorbing light in the shorter visible wavelength range with high sensitivity to serve effectively as planarizing film, insulation layer, and barrier rib used in organic luminescence apparatuses and display elements and the function of reducing external light reflection. The photosensitive colored resin composition includes an alkali-soluble resin (a), a photosensitive compound (b), and a compound (c) having an absorption maximum in the wavelength range of 400 nm or more and less than 490 nm, the photosensitive compound (b) containing a photosensitive compound (b1), the photosensitive compound (b1) being such that its maximum absorption wavelength in the range of 350 nm or more and 450 nm or less is located within the wavelength range of 350 nm or more and 390 nm or less.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: April 7, 2020
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Keika Hashimoto, Satoshi Kamemoto, Kazuto Miyoshi
  • Publication number: 20200012191
    Abstract: The present invention provides a photosensitive resin composition which has a light-blocking property, and at the same time, a high sensitivity, and has excellent half-tone characteristics. The present invention provides a photosensitive resin composition including an (A) alkali-soluble resin, a (B) radically polymerizable compound, a (C) photo initiator, and a (D) colorant, where the (A) alkali-soluble resin contains a polyimide, a polyimide precursor, a polybenzoxazole precursor, and/or a copolymer thereof, and the (B) radically polymerizable compound contains a (B-1) bifunctional or higher (meth)acrylic compound that has a glass transition temperature of 150° C. or higher as a homopolymer, and a (B-2) tetrafunctional or higher (meth)acrylic compound other than the (B-1).
    Type: Application
    Filed: March 16, 2018
    Publication date: January 9, 2020
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Satoshi KAMEMOTO, Yugo TANIGAKI, Kazuto MIYOSHI
  • Patent number: 10324376
    Abstract: The present invention provides a negative type colored photosensitive resin composition that serves to produce a cured film having a forward tapered shape. This negative type colored photosensitive resin composition includes an alkali-soluble resin (A), a photo initiator (B), a photo polymerizable compound (C), and a coloring agent (D), the alkali-soluble resin (A) containing a polyimide precursor, polybenzoxazole precursor, and/or a copolymer thereof (A-1), each resin (A-1) having a trifluoromethyl group in the backbone chain.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: June 18, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Satoshi Kamemoto, Yugo Tanigaki, Kazuto Miyoshi
  • Publication number: 20190072851
    Abstract: The present invention provides a negative type photosensitive resin composition having high sensitivity, excellent halftone characteristics, capability to form a small tapered pattern shape, and alkali-developability. The negative type photosensitive resin composition includes, as an alkali-soluble resin (A), at least a weakly acidic group-containing resin (A1) and an unsaturated group-containing resin (A2), the weakly acidic group-containing resin (A1) containing an acidic group having an acid dissociation constant in the range of 13.0 to 23.0 in dimethyl sulfoxide, and the unsaturated group-containing resin (A2) containing an ethylenically unsaturated double bond group.
    Type: Application
    Filed: March 17, 2017
    Publication date: March 7, 2019
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yugo TANIGAKI, Satoshi KAMEMOTO, Kazuto MIYOSHI
  • Patent number: 10199548
    Abstract: The purpose of the present invention is to provide a photosensitive resin composition for thin film transistors, a cured film of which generates an extremely small amount of an outgas, and which is capable of forming an insulating layer for thin film transistors having excellent drive performance. In order to achieve the above-described purpose, the present invention has the configuration described below. Namely, a photosensitive resin composition for thin film transistors, which contains (A) an alkali-soluble resin having an amide group and/or an imide group, (B) a photosensitive compound and (C) organic solvents, and wherein the content of an organic solvent having nitrogen atoms in the organic solvents (C) is 1% by mass or less relative to the total mass of the organic solvents.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: February 5, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Satoshi Kamemoto, Yusuke Komori, Kazuto Miyoshi
  • Publication number: 20180356727
    Abstract: The invention provides a cured film and a positive type photosensitive resin composition unlikely to cause a decrease in light emission luminance or shrinkage of pixels and high in long term reliability. [Solution] The invention provides a cured film comprising a cured product of a photosensitive resin composition including an alkali-soluble resin (a), a photoacid generating agent (b), at least one compound (c) selected from the group consisting of cyclic amides, cyclic ureas, and derivatives thereof, and a thermal crosslinking agent (d), the thermal crosslinking agent (d) containing an epoxy compound, oxetanyl compound, isocyanate compound, acidic group-containing alkoxymethyl compound, and/or acidic group-containing methylol compound, and the total content of the compound (c) in the cured film being 0.005 mass % or more and 5 mass % or less.
    Type: Application
    Filed: March 8, 2017
    Publication date: December 13, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yuta SHUTO, Satoshi KAMEMOTO, Kazuto MIYOSHI
  • Publication number: 20180356729
    Abstract: To provide a negative-type photosensitive resin composition that is highly sensitive and capable of formation of a low-taper pattern shape and that is capable of providing a cured film that is excellent in heat resistance. A negative-type photosensitive resin composition contains an (A) alkali-soluble resin, a (B) radical polymerizable compound, and a (C) photo initiator, the negative-type photosensitive resin composition being characterized in that the (A) alkali-soluble resin contains one or more species of resins selected from a (A-1) polyimide, a (A-2) polybenzoxazole, a (A-3) polyimide precursor, a (A-4) polybenzoxazole precursor, a (A-5) polysiloxane, and a (A-6) cardo based resin, and that the (B) radical polymerizable compound contains a compound having five ethylenic unsaturated bond groups in a (B-1) molecule, in an amount within the range of 51 to 99 mass %.
    Type: Application
    Filed: March 15, 2017
    Publication date: December 13, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yugo TANIGAKI, Daisuke SAKII, Satoshi KAMEMOTO
  • Publication number: 20180267405
    Abstract: The present invention provides a negative type colored photosensitive resin composition that serves to produce a cured film having a forward tapered shape. This negative type colored photosensitive resin composition includes an alkali-soluble resin (A), a photo initiator (B), a photo polymerizable compound (C), and a coloring agent (D), the alkali-soluble resin (A) containing a polyimide precursor, polybenzoxazole precursor, and/or a copolymer thereof (A-1), each resin (A-1) having a trifluoromethyl group in the backbone chain.
    Type: Application
    Filed: September 21, 2016
    Publication date: September 20, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Satoshi KAMEMOTO, Yugo TANIGAKI, Kazuto MIYOSHI
  • Publication number: 20180259852
    Abstract: To provide an alkaline developable negative-type photosensitive resin composition from which a cured film that has a high-resolution and low-taper pattern shape and that are excellent in heat resistance and light blocking property can be obtained. A negative-type photosensitive resin composition is characterized by containing an (A1) first resin, a (A2) second resin, a (C) photopolymerization initiator, and a (D) coloring agent, wherein the (A1) first resin is an (A1-1) polyimide and/or an (A1-2) polybenzo-oxazole, and wherein the (A2) second resin is one or more species selected from a (A2-1) polyimide precursor, a (A2-2) polybenzo-oxazole precursor, a (A2-3) polysiloxane, a (A2-4) cardo based resin, and an (A2-5) acrylic resin, and wherein a content ratio of the (A1) first resin in a total of 100 mass % of the (A1) first resin and the (A2) second resin is within the range of 25 to 90 mass %.
    Type: Application
    Filed: September 26, 2016
    Publication date: September 13, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yugo TANIGAKI, Satoshi KAMEMOTO, Kazuto MIYOSHI
  • Publication number: 20180019290
    Abstract: The purpose is to provide an organic EL display device which has good sensitivity and is free from the occurrence of luminance decrease or pixel shrinkage, thereby having excellent long-term reliability. In order to achieve the above-described purpose, provided is the following configuration. Namely, an organic EL display device wherein an insulating layer formed on a first electrode is a cured film obtained by curing a photosensitive resin composition; and the residual amount of acid anhydrides contained in the cured film is from 0.003 to 0.04 (inclusive) when the residual amount of aromatic rings contained in the cured film is taken as 1 (the reference value).
    Type: Application
    Filed: March 7, 2016
    Publication date: January 18, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Takeshi ARAI, Satoshi KAMEMOTO, Kazuto MIYOSHI
  • Publication number: 20180017867
    Abstract: The purpose of the present invention is to provide a photosensitive resin composition for thin film transistors, a cured film of which generates an extremely small amount of an outgas, and which is capable of forming an insulating layer for thin film transistors having excellent drive performance. In order to achieve the above-described purpose, the present invention has the configuration described below. Namely, a photosensitive resin composition for thin film transistors, which contains (A) an alkali-soluble resin having an amide group and/or an imide group, (B) a photosensitive compound and (C) organic solvents, and wherein the content of an organic solvent having nitrogen atoms in the organic solvents (C) is 1% by mass or less relative to the total mass of the organic solvents.
    Type: Application
    Filed: March 16, 2016
    Publication date: January 18, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Satoshi KAMEMOTO, Yusuke KOMORI, Kazuto MIYOSHI
  • Publication number: 20180011404
    Abstract: The invention aims to provide a photosensitive colored resin composition and a heat resistant colored resin film produced therefrom that has the function of absorbing light in the shorter visible wavelength range with high sensitivity to serve effectively as planarizing film, insulation layer, and barrier rib used in organic luminescence apparatuses and display elements and the function of reducing external light reflection. The photosensitive colored resin composition includes an alkali-soluble resin (a), a photosensitive compound (b), and a compound (c) having an absorption maximum in the wavelength range of 400 nm or more and less than 490 nm, the photosensitive compound (b) containing a photosensitive compound (b1), the photosensitive compound (b1) being such that its maximum absorption wavelength in the range of 350 nm or more and 450 nm or less is located within the wavelength range of 350 nm or more and 390 nm or less.
    Type: Application
    Filed: September 22, 2017
    Publication date: January 11, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Keika HASHIMOTO, Satoshi KAMEMOTO, Kazuto MIYOSHI
  • Publication number: 20170334837
    Abstract: Provided are a photosensitive resin composition which has excellent pattern processabilities (high sensitivity and high resolution) and is excellent in chemical resistance and thermal resistance after thermally treated; a heat-resistant resin or heat-resistant resin precursor used for the composition; and a diamine compound which is a raw material of the resin and the precursor. The diamine compound is a diamine compound represented by a general formula (1).
    Type: Application
    Filed: August 7, 2017
    Publication date: November 23, 2017
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yusuke KOMORI, Satoshi KAMEMOTO, Kazuto MIYOSHI
  • Publication number: 20170293224
    Abstract: An object of the present invention is to provide an organic EL display device which causes neither decrease in emission luminance nor pixel shrinkage and is excellent in long-term reliability. The present invention is directed to an organic EL display device including an insulating layer formed on a first electrode of the organic EL display device and constituted of a cured film obtained from a positive type photosensitive resin composition containing (A) an alkali-soluble resin, (B) an o-quinonediazide compound and (C) an organic solvent, wherein the mole ratio S/C obtained when a section of the cured film is measured is greater than or equal to 0.003 and less than or equal to 0.008.
    Type: Application
    Filed: September 14, 2015
    Publication date: October 12, 2017
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Satoshi KAMEMOTO, Takeshi ARAI, Kazuto MIYOSHI
  • Publication number: 20150219991
    Abstract: Disclosed is a positive-type photosensitive resin composition including (a) an alkali-soluble polyimide, (b) a compound having two or more epoxy groups in a molecule, and (c) a photo acid generator, wherein the content of the compound having two or more epoxy groups in a molecule (b) is within a range of 5 to 50 parts by weight based on 100 parts by weight of the alkali-soluble polyimide (a). The present invention provides a positive-type photosensitive resin composition capable of obtaining a high-resolution cured film which exhibits low warpage and also does not cause pattern embedment by reflow during a heating treatment at a low temperature of 200° C. or lower.
    Type: Application
    Filed: September 24, 2012
    Publication date: August 6, 2015
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yuki Masuda, Satoshi Kamemoto, Hiroyuki Onishi, Masao Tomikawa