Abstract: Provided are a photosensitive resin composition which has excellent pattern processabilities (high sensitivity and high resolution) and is excellent in chemical resistance and thermal resistance after thermally treated; a heat-resistant resin or heat-resistant resin precursor used for the composition; and a diamine compound which is a raw material of the resin and the precursor. The diamine compound is a diamine compound represented by a general formula (1).

Abstract: An object of the present invention is to provide an organic EL display device which causes neither decrease in emission luminance nor pixel shrinkage and is excellent in long-term reliability. The present invention is directed to an organic EL display device including an insulating layer formed on a first electrode of the organic EL display device and constituted of a cured film obtained from a positive type photosensitive resin composition containing (A) an alkali-soluble resin, (B) an o-quinonediazide compound and (C) an organic solvent, wherein the mole ratio S/C obtained when a section of the cured film is measured is greater than or equal to 0.003 and less than or equal to 0.008.

Abstract: Disclosed is a positive-type photosensitive resin composition including (a) an alkali-soluble polyimide, (b) a compound having two or more epoxy groups in a molecule, and (c) a photo acid generator, wherein the content of the compound having two or more epoxy groups in a molecule (b) is within a range of 5 to 50 parts by weight based on 100 parts by weight of the alkali-soluble polyimide (a). The present invention provides a positive-type photosensitive resin composition capable of obtaining a high-resolution cured film which exhibits low warpage and also does not cause pattern embedment by reflow during a heating treatment at a low temperature of 200° C. or lower.