Abstract: The present invention presents a nitride semiconductor light emitting device including a substrate, a first n-type nitride semiconductor layer, a light emitting layer, a p-type nitride semiconductor layer, a p-type nitride semiconductor tunnel junction layer, an n-type nitride semiconductor tunnel junction layer, and a second n-type semiconductor layer, in which the p-type and n-type nitride semiconductor tunnel junction layers form a tunnel junction, at least one of the p-type and n-type nitride semiconductor tunnel junction layers contains In, at least one of In-containing layers contacts with a layer having a larger band gap than the In-containing layer, and at least one of shortest distances between an interface of the In-containing layer and the layer having a larger band gap and an interface of the p-type and n-type nitride semiconductor tunnel junction layers is less than 40 nm.

Abstract: A nitride semiconductor light-emitting device comprises a substrate, and a first n-type nitride semiconductor layer, an emission layer, a p-type nitride semiconductor layer, a metal layer and a second n-type nitride semiconductor layer stacked on the substrate successively from the side closer to the substrate, with an electrode provided on the surface of the second n-type nitride semiconductor layer or above the surface of the second n-type nitride semiconductor layer. The metal layer is preferably made of a hydrogen-storage alloy.

Abstract: A nitride semiconductor light emitting device includes a substrate, and a first n-type nitride semiconductor layer, a light emitting layer, a first p-type nitride semiconductor layer, a second p-type nitride semiconductor layer, a p-type nitride semiconductor tunnel junction layer, an n-type nitride semiconductor tunnel junction layer and a second n-type nitride semiconductor layer that are formed on the substrate. The p-type nitride semiconductor tunnel junction layer and the n-type nitride semiconductor tunnel junction layer form a tunnel junction, and the p-type nitride semiconductor tunnel junction layer has an indium content ratio higher than that of the second p-type nitride semiconductor layer. At least one of the p-type nitride semiconductor tunnel junction layer and the n-type nitride semiconductor tunnel junction layer includes aluminum.

Abstract: In a nitride semiconductor light-emitting device having an active layer between an n-type nitride semiconductor layer and a p-type nitride semiconductor layer, the active layer has a multiple quantum well structure including a plurality of InxGa1-xN (0<x?1) quantum well layers and a plurality of InyGa1-yN (0?y<1) barrier layers stacked alternately, and at least one of the plurality of barrier layers has a super-lattice structure in which a plurality of barrier sub-layers having mutually different In composition ratios are stacked periodically.

Abstract: A method of fabricating a nitride semiconductor light emitting device includes the steps of: depositing on a substrate a first n-type nitride semiconductor layer, a light emitting layer, a p-type nitride semiconductor layer, and p-type nitride semiconductor tunnel junction layer containing an indium, in this order; depositing a nitride semiconductor evaporation reduction layer on the p-type nitride semiconductor tunnel junction layer at the temperature of the substrate which is at most a temperature higher by 150° C.

Abstract: An object is to provide a method of manufacturing a nitride semiconductor light emitting device having high light emission output and allowing decrease in forward voltage (Vf). The invention is directed to a method of manufacturing a nitride semiconductor light emitting device including at least an n-type nitride semiconductor, a p-type nitride semiconductor and an active layer formed between the n-type nitride semiconductor and the p-type nitride semiconductor, wherein the n-type nitride semiconductor includes at least an n-type contact layer and an n-side GaN layer, the n-side GaN layer consists of a single or a plurality of undoped and/or n-type layers, and the method includes the step of forming the n-side GaN layer by organic metal vapor deposition with the growth temperature set within the range of 500 to 1000° C., such that the n-side GaN layer is formed between the n-type contact layer and the active layer.

Abstract: A method of manufacturing a nitride semiconductor light emitting device having high light emission output and allowing decrease in forward voltage (Vf) is provided. The invention is directed to a method of manufacturing a nitride semiconductor light emitting device including at least an n-type nitride semiconductor, a p-type nitride semiconductor and an active layer formed between the n-type nitride semiconductor and the p-type nitride semiconductor, wherein the n-type nitride semiconductor includes at least an n-type contact layer and an n-side GaN layer, the n-side GaN layer consists of a single or a plurality of undoped and/or n-type layers, and the method includes the step of forming the n-side GaN layer by organic metal vapor deposition using a nitrogen-containing gas as a carrier gas, such that the n-side GaN layer is formed between the n-type contact layer and the active layer.

Abstract: An object is to provide a nitride semiconductor light emitting device capable of attaining high light emission output while lowering Vf, as well as to provide a manufacturing method thereof.

Abstract: To provide a fuel sealing structure capable of preventing the leakage of not only liquid fuel but also gasified fuel, an annular packing 30 is interposed between an annular sealing surface 15 on an opening part 11 of a container 20 and an annular sealing surface 25 of a closure 20. The distance between the second regions 15b, 25b of the sealing surfaces 15, 25 is shorter than that between the first regions 15a, 25a. The packing 30 includes a first sealing part 31 sandwiched between the first regions 15a,25a and a second sealing part 32 sandwiched between the 15b, 25b. The second sealing part 32 is smaller in thickness than the first sealing part 31 and the difference of the thicknesses is larger than the difference of distances between the above-mentioned regions. With the closure 20 attached, the compression ratio of the second sealing part 32 is smaller than that of the first sealing part 31.

Abstract: A method of manufacturing a nitride semiconductor device includes the steps of forming a groove on a surface of a first substrate by scribing, and forming a nitride semiconductor layer on the surface where the groove is formed. In addition, the method includes the steps of bonding the nitride semiconductor layer and a second substrate together and separating the nitride semiconductor layer and the first substrate from each other. With this manufacturing method, a nitride semiconductor device can be obtained with high yield.