Patents by Inventor Satoshi Murata

Satoshi Murata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020080321
    Abstract: There is provided a liquid crystal display device manufacturing method that comprises the steps of forming a sealing member along a periphery of a display area on a first surface of a first substrate, dropping a liquid crystal to the first surface of the first substrate from a top end of a liquid crystal supply needle provided to a lower end of a syringe in which the liquid crystal is filled, and dropping down the liquid crystal adhered to a surface of the liquid crystal supply needle onto the first substrate by an external force in a middle of dropping of the liquid crystal or after the liquid crystal is droppe. Accordingly, an amount of liquid crystal supplied to the substrate can be controlled with high precision.
    Type: Application
    Filed: June 26, 2001
    Publication date: June 27, 2002
    Applicant: FUJITSU LIMITED
    Inventors: Hiroyuki Sugimura, Taiji Yuhara, Satoshi Murata, Norimichi Nakayama, Hiroyasu Inoue
  • Patent number: 6368704
    Abstract: To provide a conductive paste that exhibits a high thermal conductivity (a low thermal resistance) after adhesion and hardening and that enables an adhesive layer to be formed thin and to provide an electronic part that has an excellent radiating capability and that enables the thickness of films to be reduced. A conductive paste containing conductive particles, a hardenable resin, and a solvent has mixed therein fine spherical conductive particles such as Ag particles, the particle size is on the order of 0.05 to 1 &mgr;m, smaller than the first conductive particles. This conductive paste is used to mount an electronic part such as a semiconductor chip in producing a semiconductor package.
    Type: Grant
    Filed: November 16, 1998
    Date of Patent: April 9, 2002
    Assignee: NEC Corporation
    Inventors: Satoshi Murata, Miki Kashiwabara
  • Patent number: 6351203
    Abstract: A wire-wound inductor includes a substantially square-flanged core member and a case core member. The substantially square-flanged core member includes an upper substantially square flange and a lower substantially square flange. The substantially square-flanged core member, around which a coil is wound, is inserted into the case core member, and the upper flange of the substantially square-flanged core member is fitted in an opening of the case core member. A planar corner abutment surface is provided at each of the four corners of the inner surface of the substantially square opening, and the corners of the upper flange abut the respective planar corner abutment surfaces.
    Type: Grant
    Filed: December 21, 1999
    Date of Patent: February 26, 2002
    Assignee: Murata Manufacturing Co., LTD
    Inventors: Hideyuki Mihara, Satoshi Murata, Tetsuya Morinaga
  • Patent number: 6344784
    Abstract: A coil component includes a conductor film provided on the surface of a core having flanges. On one flange, first and second dividing grooves and a connecting groove are provided, whereby first and second terminals are defined. On the other flange, third and fifth dividing grooves and a connecting groove are provided, whereby third and fourth terminals are defined. First and second winding-around grooves are connected to the respective dividing grooves and arranged substantially parallel to each other. A coil connected to the first and third terminals and a coil connected to the second and fourth terminals are also provided.
    Type: Grant
    Filed: August 21, 2000
    Date of Patent: February 5, 2002
    Assignee: Murata Manufacturing Co., LTD
    Inventors: Satoshi Murata, Hideyuki Mihara, Etsuji Yamamoto, Minoru Tamada
  • Publication number: 20010033218
    Abstract: Three thin-film coils having insulating layers therebetween are laminated on the coil winding portion of the core member. A terminal electrode is electrically connected to the end portion of the third thin-film coil. A terminal electrode is electrically connected to the end portion of the first thin-film coil through the lead-out opening portions and separated areas. In this way, the thin-film coils are electrically connected in series between the terminal electrodes. Then, in the thin-film coils, the winding directions of the neighboring coils having an insulating layer therebetween are opposite to each other.
    Type: Application
    Filed: March 15, 2001
    Publication date: October 25, 2001
    Inventors: Satoshi Murata, Hideyuki Mihara, Etsuji Yamamoto, Yoshihiro Nishinaga, Minoru Tamada
  • Publication number: 20010026348
    Abstract: The present invention relates to a method for manufacturing a liquid crystal display utilizing the dispense-injection method, and it is an object of the invention to provide a method for manufacturing a liquid crystal display which allows an optimum quantity of liquid crystals to be dispensed on each substrate.
    Type: Application
    Filed: March 19, 2001
    Publication date: October 4, 2001
    Applicant: FUJITSU LIMITED
    Inventors: Satoshi Murata, Hiroyuki Sugimura, Norimichi Nakayama, Hiroyasu Inoue
  • Publication number: 20010022547
    Abstract: A small-sized multilayer inductor having a greatly increased inductance value includes two thin-film coils with an insulation layer interposed therebetween, the coils being disposed on a coil-winding portion of a wound-core member. At positions opposing flanges of the wound-core member, two terminal electrodes for a first thin-film coil are respectively provided. To one of the two terminal electrodes, the starting end of the first thin-film coil is electrically connected via one connection opening while the finishing end of the first thin-film coil is electrically connected to the other terminal electrode via the other connection opening. Similarly, at positions opposing the flanges of the wound-core member, two terminal electrodes, which are electrically connected to a second thin-film coil, are respectively provided.
    Type: Application
    Filed: March 12, 2001
    Publication date: September 20, 2001
    Inventors: Satoshi Murata, Hideyuki Mihara, Etsuji Yamamoto, Yoshihiro Nishinaga, Minoru Tamada
  • Patent number: 6275572
    Abstract: The present invention is provided to improve congestion control without changing a quality of a connection service of communications even if congestion occurs and realize a flexible correspondence. The congestion control method, comprising the steps of generating a call pattern as time series data of calls from a subscriber, performing Fast Fourier transformation on the time series data of the calls to detect short periodic component of a frequency, delaying the detected short periodical component with a prescribed threshold, and delaying a timing of sending a congestion tone (CT) or busy tone (BT) when the value of the short periodical component exceeds the prescribed threshold.
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: August 14, 2001
    Assignee: Fujitsu Limited
    Inventors: Mamoru Higuchi, Satoshi Murata
  • Publication number: 20010005854
    Abstract: An e-mail sending and receiving system is disclosed, by which positional data about a plurality of places can be included in an e-mail message to be sent, and further detailed data can be obtained based on the included positional data, thereby improving the convenience and effectiveness of the positional data. The system comprises a mail generating section for generating an e-mail message to be sent to an addressee; a positional data storage section for storing a plurality of positional data; and a positional data attaching section for attaching one or more of the positional data stored in the positional data storage section to the e-mail message generated by the mail generating section. The system may further comprise a section for generating detailed data relating to each positional data attached to the e-mail message, and attaching a URL for accessing the detailed data to the e-mail message.
    Type: Application
    Filed: December 19, 2000
    Publication date: June 28, 2001
    Applicant: HONDA GIKEN KOGYO KABUSHIKI KAISHA
    Inventors: Satoshi Murata, Takeshi Imai, Yuichiro Watanabe
  • Patent number: 6160465
    Abstract: A soft magnetic core is substantially cylindrical and a linear-shaped coil conductor is inserted through a hole in the central portion of the soft magnetic core. A hard magnetic material sheet has areas which are magnetized in a thickness direction thereof and the areas are arranged in strips so that a magnetization direction of adjacent strips is mutually opposite. The hard magnetic material is wound on the outside surface of the soft magnetic core and is fixed to the soft magnetic core. The direction of the areas formed as strips of the hard magnetic material is substantially perpendicular to the axial direction of the coil conductor.
    Type: Grant
    Filed: November 6, 1998
    Date of Patent: December 12, 2000
    Assignee: Murata Manufacturing Co. Ltd.
    Inventors: Kouichi Yamaguchi, Tatsuyuki Yamada, Yukio Sakamoto, Masami Sugitani, Satoshi Murata
  • Patent number: 6047978
    Abstract: In a wheel suspension of a vehicle such as an automobile assembled from a pair of trailing arms arranged to extend substantially longitudinally of the vehicle in a laterally symmetrical relationship thereto with each front end thereof being pivotably mounted to the vehicle body while each rear end thereof rotatably supporting a corresponding one of either a pair of front wheels or a pair of rear wheels, and a torsion beam arranged to extend substantially laterally of the vehicle between the pair of trailing arms with opposite ends thereof being firmly connected thereto by welding, so as to form a link assembly assembled by a weld seam formed therebetween, the link is formed with at least one notch adjacent to a weld seam for relieving a surface tensile stress exerted across the weld seam according to a force acting between the trailing arms and the torsion beam.
    Type: Grant
    Filed: February 9, 1998
    Date of Patent: April 11, 2000
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Kei Watanabe, Satoshi Murata, Hiroyuki Shimatani
  • Patent number: 6011303
    Abstract: An electronic component includes a substrate portion, a bank portion, a plurality of lead members, an anchor hole, and at least a pair of notches. A chip is supported on the substrate portion. The bank portion is formed on a periphery of the substrate portion to surround the chip. The plurality of lead members are made of conductive strip pieces, and each lead member has an inner lead electrically connected to the chip and an outer lead extending to an outside. The substrate portion and the bank portion are integrally molded with a resin to include the lead members, so that the inner and outer leads are fixed to a connecting portion between the substrate portion and the bank portion. The anchor hole is formed in a portion where each of the lead members is in contact with the bank portion, and is filled with a resin. The pair of notches are formed in two ends of each of the lead members to sandwich the anchor hole.
    Type: Grant
    Filed: November 26, 1997
    Date of Patent: January 4, 2000
    Assignee: NEC Corporation
    Inventors: Junichi Tanaka, Seiji Ichikawa, Tomoaki Hirokawa, Tomoaki Kimura, Taku Sato, Kenji Watanabe, Kenji Utida, Masatoshi Ohara, Takeo Ogihara, Satoshi Murata, Tsutomu Kubota
  • Patent number: 5988845
    Abstract: A three-dimensional universal unit includes multiple identically configured assembly units, each having a central unit body, arms that can rotate relative to the unit body, the arms extending from the unit body in three orthogonal axes and having a connecting mechanism at the end of each arm. The assembly unit also has an information processing unit for controlling a motor in the unit body, an assembly unit operation, a rotary drive transmission system for transmitting arm drive motion from the motor, and a drive transmission system for engaging and disengaging the connecting mechanisms. Each connecting mechanism can mechanically connect with a connecting mechanism of another assembly unit and includes a communication device for exchanging information between information processing units of connected assembly units.
    Type: Grant
    Filed: October 6, 1997
    Date of Patent: November 23, 1999
    Assignee: Agency of Industrial Science & Technology, Ministry of International Trade & Industry
    Inventor: Satoshi Murata
  • Patent number: 5977854
    Abstract: An electromagnetic noise absorber has a pair of ferrite cores arranged with open ends of the ferrite cores facing each other. Each of the ferrite cores includes an axial portion, an outer cylindrical portion and a bottom portion and is constructed by coupling an end of the axial portion and an end of the outer cylindrical portion to the bottom portion. A slot is formed in the outer cylindrical portion and the bottom portion of each ferrite core such that the slot extends from the open end of the outer cylindrical portion to the bottom portion. The electromagnetic noise absorber can be easily attached to a signal line by placing the signal line in the slots and turning one of the ferrite cores. Since the signal line are wound around the axial portion of the ferrite cores, the signal line has a high impedance.
    Type: Grant
    Filed: July 18, 1997
    Date of Patent: November 2, 1999
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hideyuki Mihara, Satoshi Murata, Yukio Sakamoto
  • Patent number: 5970322
    Abstract: An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.
    Type: Grant
    Filed: January 8, 1998
    Date of Patent: October 19, 1999
    Assignee: NEC Corporation
    Inventors: Seiji Ichikawa, Tomoaki Hirokawa, Tomoaki Kimura, Taku Sato, Junichi Tanaka, Kenji Uchida, Masatoshi Ohara, Takeo Ogihara, Satoshi Murata, Tsutomu Kubota
  • Patent number: 5956574
    Abstract: In a lead frame flash removing method and apparatus, a lead frame is molded integrally with a case. After molding, abrasive agent-mixed water is sprayed to a surface of the lead frame where a flash is formed. The lead frame is dipped in an electrolytic solution and applying a DC voltage is applied across the lead frame and an electrode in the electrolytic solution, thereby electrolytically processing the lead frame. After the electrolytic process, an external force is applied to the surface of the lead frame, thereby removing the flash.
    Type: Grant
    Filed: February 28, 1997
    Date of Patent: September 21, 1999
    Assignee: NEC Corporation
    Inventors: Seiji Ichikawa, Junichi Tanaka, Tomoaki Hirokawa, Taku Sato, Tomoaki Kimura, Satoshi Murata, Tsutomu Kubota, Takeo Ogihara, Kenji Uchida, Kenji Watanabe, Tsutomu Noguti
  • Patent number: 5937803
    Abstract: In a water-cooled engine cylinder block, a lower end of a water jacket outer wall and a cylinder wall are joined by a water jacket base wall, and coolant is led into a space formed by the cylinder wall, water jacket base wall and water jacket outer wall. A bend part having a crank shape cross-section is formed in the water jacket base wall. As a result, the rigidity of the water jacket base wall decreases so that transmission of the axial tension of the head bolt to the cylinder wall is suppressed, and deformation of the cylinder wall is suppressed.
    Type: Grant
    Filed: March 12, 1998
    Date of Patent: August 17, 1999
    Assignee: Nissan Motor Co., Ltd.
    Inventor: Satoshi Murata
  • Patent number: 5905301
    Abstract: A package of the present invention comprises a base molded integrally with a lead frame by resin, a chip mounted on the lead frame, and a cap made of resin, which covers the chip and is fixed to the base. The base includes a substrate portion sealing the lead frame therein, a frame-shaped bank portion formed at a periphery of an upper surface of said substrate portion, the bank portion having said lead frame interposed between it snd the substrate portion, and an anchor portion formed at a portion of the lead frame interposed between the substrate portion and the bank portion. The chip is mounted on a region of the lead frame surrounded by the bank portion. The cap is fixed to the bank portion.
    Type: Grant
    Filed: February 3, 1997
    Date of Patent: May 18, 1999
    Assignee: NEC Corporation
    Inventors: Seiji Ichikawa, Tomoaki Hirokawa, Tomoaki Kimura, Junichi Tanaka, Taku Sato, Satoshi Murata, Tsutomu Kubota, Takeo Ogihara, Kenji Uchida
  • Patent number: 5904501
    Abstract: A hollow package manufacturing method includes the adhesive spreading step, the adhesive applying step, and the cap adhering step. In the adhesive spreading step, an adhesive is spread on a circular table to a uniform thickness. In the adhesive applying step, an open end face of a cylindrical cap having a bottom is urged against the circular table to apply the adhesive to the cap. In the cap adhering step, the cap applied with the adhesive is adhered to a case. A hollow package manufacturing apparatus is also disclosed.
    Type: Grant
    Filed: March 26, 1997
    Date of Patent: May 18, 1999
    Assignee: NEC Corporation
    Inventors: Masatoshi Ohara, Takeo Ogihara, Satoshi Murata, Kenji Uchida, Tsutomu Kubota, Seiji Ichikawa, Tomoaki Hirokawa, Tomoaki Kimura, Taku Sato, Junichi Tanaka
  • Patent number: 5889232
    Abstract: An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.
    Type: Grant
    Filed: May 13, 1997
    Date of Patent: March 30, 1999
    Assignee: NEC Corporation
    Inventors: Seiji Ichikawa, Tomoaki Hirokawa, Tomoaki Kimura, Taku Sato, Junichi Tanaka, Kenji Uchida, Masatoshi Ohara, Takeo Ogihara, Satoshi Murata, Tsutomu Kubota