Abstract: A process for manufacturing a quartz crystal element consists of the steps of producing plural quartz layers on a surface of a crystalline substrate having a lattice constant differing from that of quartz crystal, in which each of the quartz layers consists of a crystalline phase and an amorphous phase, and percentage of the crystalline phase in the quartz layer farther from the substrate is larger than percentage of the crystalline phase in the quartz layer adjacent to the substrate; and producing an epitaxially grown quartz crystal film on the surface of the quartz layer farther from the substrate by a reaction between silicon alkoxide and oxygen.

Abstract: A process for manufacturing a quartz crystal element consists of the steps of producing plural quartz layers on a surface of a crystalline substrate having a lattice constant differing from that of quartz crystal, in which each of the quartz layers consists of a crystalline phase and an amorphous phase, and percentage of the crystalline phase in the quartz layer farther from the substrate is larger than percentage of the crystalline phase in the quartz layer adjacent to the substrate; and producing an epitaxially grown quartz crystal film on the surface of the quartz layer farther from the substrate by a reaction between silicon alkoxide and oxygen.

Abstract: A single crystal of quartz thin film and a production method therefor are provided. A method for producing a quartz epitaxial thin film comprises the steps of vaporizing a silicon alkoxide as a silicon source under atmospheric pressure to introduce the silicon alkoxide to a substrate with hydrogen chloride as a reaction promoter, and reacting ethyl silicate with oxygen to deposit a quartz on the substrate. The single crystal of quartz thin film has excellent crystalinity, and optical properties.

Abstract: A service receiving device is provided for in a production facility such as a component mounting apparatus. A service providing device is provided for on a manufacturer's side of the production facility. The service receiving device and service providing device are configured to communicate with each other through various communication systems including, for example, the Internet. The communication system can be operated by software to create and/or transmit service responses to problems or production matters, including productivity or quality of maintenance.

Abstract: A method for monitoring a mounting tact of a component mounting apparatus including a component supplier for supplying a component and a component holder for holding the component from the component supplying device and mounting the component onto a circuit board. The method includes collecting and monitoring a mounting tact result value of the component mounting apparatus during a mounting operation via a communication system. The method further includes calculating a tact loss corresponding to an amount by which the mounting tact result value is greater than a standard mounting tact and monitoring the calculated tact loss.

Abstract: A quartz oscillator includes a base having a recessed portion provided on one face thereof by processing to have an inverse mesa shape, a quartz thin-film formed on the other face of the base by epitaxial growth to have a thickness of 10 ?m or less, a vibrating reed portion, and excitation electrodes for mechanically supporting the quartz thin-film and for vibrating the vibrating reed portion.

Abstract: A process for manufacturing a quartz crystal element consists of the steps of producing plural quartz layers on a surface of a crystalline substrate having a lattice constant differing from that of quartz crystal, in which each of the quartz layers consists of a crystalline phase and an amorphous phase, and percentage of the crystalline phase in the quartz layer farther from the substrate is larger than percentage of the crystalline phase in the quartz layer adjacent to the substrate; and producing an epitaxially grown quartz crystal film on the surface of the quartz layer farther from the substrate by a reaction between silicon alkoxide and oxygen.

Abstract: A single crystal of quartz thin film and a production method therefor are provided. A method for producing a quartz epitaxial thin film comprises the steps of vaporizing a silicon alkoxide as a silicon source under atmospheric pressure to introduce the silicon alkoxide to a substrate with hydrogen chloride as a reaction promoter, and reacting ethyl silicate with oxygen to deposit a quartz on the substrate. The single crystal of quartz thin film has excellent crystalinity, and optical properties.

Abstract: A quartz oscillator includes a base having a recessed portion provided on one face thereof by processing to have an inverse mesa shape, a quartz thin-film formed on the other face of the base by epitaxial growth to have a thickness of 10 &mgr;m or less, a vibrating reed portion, and excitation electrodes for mechanically supporting the quartz thin-film and for vibrating the vibrating reed portion.

Abstract: A service receiving device (1) is provided for a production facility (151, 108, 108a, 108b, 100) such as a component mounting apparatus on the user side, whereas a service providing device (2) is provided for the manufacturer side providing the production facility. These service receiving device (1) and service providing device (2) communicate with each other in a mutual manner or from a necessary side to the other side through various communication systems including the Internet line owing to a software (161, 161a), so that a service relating to response to a trouble or production including the productivity or the quality maintenance is derived or transmitted according to need.

Abstract: The invention provides a method for testing oscillators in which cracks and chips on oscillator chips that may possibly have an effect on the oscillation characteristics can be detected efficiently, without using an optical examination device and an image processing device, which require troublesome adjustment and higher cost. When testing the oscillation characteristics of oscillator chips, the method comprises a network analyzer, an upper electrode, a lower electrode, an oscillator chip, a bush, and a personal computer. The personal computer is connected to the network analyzer using a GP-IB interface cable, and is capable of storing, displaying, and comparing all measurement results of the network analyzer. The upper electrode can be shifted vertically by a vertical mechanism.

Abstract: A quartz oscillator includes a base, a quartz thin-film formed on the base by epitaxial growth, a vibrating reed portion formed by processing the quartz thin-film, and excitation electrodes for vibrating the vibrating reed portion. At least one of the excitation electrodes may be formed by depositing a metal. The material for the base may include a single-element semiconductor, a compound semiconductor, and an oxide. When a semiconductor is used for the base, a semiconductor circuit may be provided to the base to form a module including a quartz oscillator.

Abstract: A single crystal thin film and a production method therefor are provided. A method for producing a crystal epitaxial thin film comprises the steps of vaporizing a silicon alkoxide as a silicon source under atmospheric pressure to introduce the silicon alkoxide to a substrate with hydrogen chloride as a reaction promoter, and reacting ethyl silicate with oxygen to deposit a crystal on the substrate. The single crystal thin film has excellent crystalinity, and optical properties.

Abstract: A parts mounting system includes a plurality of mounting units and a parts distributor unit for distributing parts to the mounting units. The parts distributor unit includes a specifying section for specifying types of parts that can be mounted by each of the mounting units, as division-specified parts, and a distributor section for sequentially distributing parts, based on the types of parts, from the parts other than the division-specified parts, to the mounting units. The distributor section sequentially distributes the division-specified parts to the mounting units so that the division-specified parts are divided thereby to reduce a difference in mounting time by each mounting unit after the parts other than division-specified parts are distributed.

Abstract: A crystal oscillator includes a base, a crystal thin-film formed on the base by epitaxial growth, a vibrating reed portion formed by processing the crystal thin-film, and excitation electrodes for vibrating the vibrating reed portion. At least one of the excitation electrodes may be formed by depositing a metal. The material for the base may include a single-element semiconductor, a compound semiconductor, and an oxide. When a semiconductor is used for the base, a semiconductor circuit may be provided to the base to form a module including a crystal oscillator.

Abstract: A component-lack advance notice method, a component-lack advance notice apparatus, and a component mounting apparatus including the component-lack advance notice apparatus, wherein a producible count determination part and advance notice parts are provided, so that an advance notice time from an advance notice of a lack of components to an actual occurrence of a lack of components is set beforehand. The producible count determination part obtains each advance notice remaining count of components to be supplied within the advance notice time from each component feed part on the basis of the advance notice time, and notifies a lack of components in advance on the basis of the advance notice remaining count.

Abstract: The invention provides a method for testing oscillators in which cracks and chips on oscillator chips that may possibly have an effect on the oscillation characteristics can be detected efficiently, without using an optical examination device and an image processing device, which require troublesome adjustment and higher cost. When testing the oscillation characteristics of oscillator chips, the method comprises a network analyzer, an upper electrode, a lower electrode, an oscillator chip, a bush, and a personal computer. The personal computer is connected to the network analyzer using a GP-IB interface cable, and is capable of storing, displaying, and comparing all measurement results of the network analyzer. The upper electrode can be shifted vertically by a vertical mechanism.

Abstract: High-speed high-reliability component supplying method and mounting method is obtained by checking whether or not a component is the regular component to be mounted through a component type detecting process by means of component arrangement data having a plurality of substitute component type names of components which can be mounted in the proper position of a component supply section and a detection section and a comparing and deciding process.

Abstract: A single crystal thin film and a production method therefor are provided. A method for producing a crystal epitaxial thin film comprises the steps of vaporizing a silicon alkoxide as a silicon source under atmospheric pressure to introduce the silicon alkoxide to a substrate with hydrogen chloride as a reaction promoter, and reacting ethyl silicate with oxygen to deposit a crystal on the substrate. The single crystal thin film has excellent crystalinity, and optical properties.

Abstract: A parts distributing method for distributing parts to mounting units in a parts mounting system having a plurality of mounting units, said method comprising the steps of: specifying parts of specific kinds which can be mounted with each mounting unit as division-specified parts; distributing parts specified for a specific mounting unit to the mounting unit; repeating operations to distribute parts having a maximum mounting time, out of remaining parts other than the division-specified parts, to mounting units which sequentially have a minimum mounting time; and repeating operations to distribute the division-specified parts one by one to mounting units which sequentially have a minimum mounting time. 1 TABLE I Tacts for high-speed Tacts for multi-function Part name Quantity mounting uuit mounting uuit Electronic 6 0.15 0.25 Part A Electronic 5 0.20 0.30 Part B Electronic 5 — 0.40 Part C Electronic 4 0.15 0.25 Part D Tact: mounting time per part (sec.