Patents by Inventor Satoshi Okamura

Satoshi Okamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240073866
    Abstract: A communication apparatus includes a receiving unit configured to receive, from another communication apparatus, a plurality of requests to transmit a signal in a resource autonomously selected by the another communication apparatus; a control unit configured to control the transmitting of a plurality of the signals respectively corresponding to the plurality of the requests, based on a condition; and a transmitting unit configured to transmit, to the another communication apparatus, at least a predetermined number of signals among the plurality of signals.
    Type: Application
    Filed: March 22, 2021
    Publication date: February 29, 2024
    Applicant: NTT DOCOMO, INC.
    Inventors: Shohei Yoshioka, Shinya Kumagai, Yuki Takahashi, Mayuko Okano, Masaya Okamura, Satoshi Nagata
  • Publication number: 20230404103
    Abstract: The present invention relates to a cocoa product containing elevated amounts of antioxidant molecules. Further aspects of the invention relate to the use of this product for making a beverage and into a capsule and to the process of making this product.
    Type: Application
    Filed: November 2, 2021
    Publication date: December 21, 2023
    Inventors: FEDERICO MORA, ELSA VILANOVA, MARINA RESINK-ROMBOUTS, LUIGI POISSON, STEFAN SPRENG, CELINE SARRAZIN-HORISBERGER, SATOSHI OKAMURA
  • Publication number: 20230278406
    Abstract: A bonding sheet material for a weather strip disclosed herein is a composition including at least EPDM, a cross-linking agent, and carbon black, and has a volume resistivity of 1.0 × 106 ?·cm or more based on a double ring electrode method of JIS-K6271-1: 2015 where a test piece has a thickness of 2 mm. When the composition is placed in a mold and molded to press the composition at 50° C. under 100 Kgf/cm2 for 60 seconds whereby a molded article is produced, the molded article has a thickness change rate of 100% or less, the thickness change rate being represented by formula (1): Thickness change rate = ((thickness of molded article after 30 minutes from releasing press - thickness of mold)/thickness of mold) × 100.
    Type: Application
    Filed: May 13, 2021
    Publication date: September 7, 2023
    Applicant: TOKAI KOGYO CO., LTD.
    Inventors: Satoshi OKAMURA, Yasuhiro FUKUSHIMA
  • Patent number: 11735439
    Abstract: A processing fluid supplying method includes: supplying a processing fluid of a gaseous state to a circulation line; generating a processing fluid of a liquid state by cooling the processing fluid of the gaseous state in the circulation line; branching the processing fluid of the liquid state from the circulation line to a branch line; and generating a processing fluid of a supercritical state by heating the processing fluid of the liquid state in the circulation line.
    Type: Grant
    Filed: September 21, 2022
    Date of Patent: August 22, 2023
    Assignee: Tokyo Electron Limited
    Inventors: Yasuo Kiyohara, Hiroaki Inadomi, Satoshi Okamura
  • Publication number: 20230187233
    Abstract: There is provided a substrate processing apparatus comprising a liquid amount detecting part configured to detect a liquid amount of a liquid film formed on a substrate; and a coating state detecting part configured to detect a coating state of the substrate with the liquid film formed thereon.
    Type: Application
    Filed: February 9, 2023
    Publication date: June 15, 2023
    Inventors: Masataka GOSHO, Yuichi DOUKI, Satoshi BIWA, Satoshi OKAMURA, Katsuhiro OOKAWA, Yuichiro KUNUGIMOTO
  • Publication number: 20230028053
    Abstract: A processing fluid supplying method includes: supplying a processing fluid of a gaseous state to a circulation line; generating a processing fluid of a liquid state by cooling the processing fluid of the gaseous state in the circulation line; branching the processing fluid of the liquid state from the circulation line to a branch line; and generating a processing fluid of a supercritical state by heating the processing fluid of the liquid state in the circulation line.
    Type: Application
    Filed: September 21, 2022
    Publication date: January 26, 2023
    Inventors: Yasuo KIYOHARA, Hiroaki INADOMI, Satoshi OKAMURA
  • Patent number: 11557492
    Abstract: A substrate processing apparatus includes: a processing container including a processing space capable of accommodating a substrate in a state where a surface of the substrate is wet by a liquid; a processing fluid supply that supplies a processing fluid in a supercritical state to the processing space toward the liquid; a first exhaust line connected to a first exhaust source; a second exhaust line connected to a second exhaust source and connected to the first exhaust line between the first exhaust source and the processing space; and a controller controlling the second exhaust pressure. The processing fluid in the supercritical state contacts the liquid to dry the substrate, and the controller makes the second exhaust pressure to be higher than the first exhaust pressure during a period in which the processing fluid supply stops supplying the processing fluid to the processing space.
    Type: Grant
    Filed: June 2, 2020
    Date of Patent: January 17, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Satoshi Biwa, Satoshi Okamura, Gentaro Goshi
  • Patent number: 11482427
    Abstract: A substrate processing system includes: a substrate processing apparatus configured to process a substrate with a processing fluid; and a processing fluid supply apparatus configured to supply the processing fluid to the substrate processing apparatus. The processing fluid supply apparatus includes: a circulation line, a gas supply line, a cooler, a pump, a branch line, a heating unit, and a pressure regulator.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: October 25, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yasuo Kiyohara, Hiroaki Inadomi, Satoshi Okamura
  • Publication number: 20220254658
    Abstract: A substrate processing apparatus configured to dry a substrate having a liquid film formed on a pattern formation surface thereof with a supercritical fluid includes a processing vessel which is configured to accommodate the substrate therein and into which the supercritical fluid is supplied; a substrate holder which has a base member configured to support the substrate from below while allowing the pattern formation surface of the substrate to face upwards, and which is configured to hold the substrate within the processing vessel; a first detector configured to detect an inclination of the base member with respect to a horizontal plane; a posture adjusting device configured to adjust the inclination of the base member with respect to the horizontal plane; and a controller configured to control the posture adjusting device to perform horizontal leveling of the base member based on a detection result of the first detector.
    Type: Application
    Filed: February 4, 2022
    Publication date: August 11, 2022
    Inventors: Shogo Fukui, Masataka Gosho, Satoshi Okamura, Tomohito Ura
  • Publication number: 20220074660
    Abstract: A substrate processing apparatus for drying a substrate by substituting a liquid film of a drying liquid formed on the substrate with a supercritical fluid incudes: a pressure container configured to accommodate the substrate on which the liquid film is formed; a discharge line configured to discharge a fluid inside the pressure container; a depressurizing valve provided in a middle of the discharge line; and a concentration measurement part configured to measure a concentration of vapor of the drying liquid in the fluid flowing through the discharge line, wherein the concentration measurement part is provided on a downstream side of the depressurizing valve of the discharge line and measures the concentration of the drying liquid in the fluid depressurized by the depressurizing valve.
    Type: Application
    Filed: September 1, 2021
    Publication date: March 10, 2022
    Inventors: Masataka GOSHO, Shu YAMAMOTO, Tomohito URA, Satoshi OKAMURA
  • Publication number: 20200388512
    Abstract: A substrate processing apparatus includes: a processing container including a processing space capable of accommodating a substrate in a state where a surface of the substrate is wet by a liquid; a processing fluid supply that supplies a processing fluid in a supercritical state to the processing space toward the liquid; a first exhaust line connected to a first exhaust source; a second exhaust line connected to a second exhaust source and connected to the first exhaust line between the first exhaust source and the processing space; and a controller controlling the second exhaust pressure. The processing fluid in the supercritical state contacts the liquid to dry the substrate, and the controller makes the second exhaust pressure to be higher than the first exhaust pressure during a period in which the processing fluid supply stops supplying the processing fluid to the processing space.
    Type: Application
    Filed: June 2, 2020
    Publication date: December 10, 2020
    Inventors: Satoshi BIWA, Satoshi OKAMURA, Gentaro GOSHI
  • Patent number: 10679845
    Abstract: Disclosed is a substrate processing apparatus. The substrate processing apparatus includes a container body, and a holding member that conveys the substrate from an outside of the container body into the container body and holds the substrate inside the container body during the processing. A substrate support pin supporting a wafer and a cooling plate cooling the holding member are provided outside the container body.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: June 9, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Hiroaki Inadomi, Satoshi Okamura, Satoshi Biwa
  • Publication number: 20200168482
    Abstract: A substrate processing apparatus configured to perform a drying processing of drying substrates by using a processing fluid in a supercritical state includes a processing vessel and multiple holders. In the processing vessel, the drying processing is performed. The multiple holders are respectively configured to hold the substrates within the processing vessel.
    Type: Application
    Filed: November 21, 2019
    Publication date: May 28, 2020
    Inventors: Hiroaki Inadomi, Satoshi Biwa, Satoshi Okamura
  • Publication number: 20200098594
    Abstract: A substrate processing system includes: a substrate processing apparatus configured to process a substrate with a processing fluid; and a processing fluid supply apparatus configured to supply the processing fluid to the substrate processing apparatus. The processing fluid supply apparatus includes: a circulation line, a gas supply line, a cooler, a pump, a branch line, a heating unit, and a pressure regulator.
    Type: Application
    Filed: September 23, 2019
    Publication date: March 26, 2020
    Inventors: Yasuo Kiyohara, Hiroaki Inadomi, Satoshi Okamura
  • Patent number: 10593571
    Abstract: Provided is a substrate processing apparatus including a liquid processing unit that performs a liquid processing on a substrate; a drying processing unit that performs a drying processing on the substrate in a wet state; a first conveyance unit that conveys the substrate to the liquid processing unit; a second conveyance unit that conveys the substrate in the wet state from the liquid processing unit to the drying processing unit; and a third conveyance unit that conveys the substrate before the liquid processing in the liquid processing unit and to convey the substrate after the drying processing from the drying processing unit. The first and second conveyance units and the drying processing unit are disposed on a side that faces the third conveyance unit, and the liquid processing unit is disposed on a side that faces the first and second conveyance units and is opposite to the third conveyance unit.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: March 17, 2020
    Assignee: Tokyo Electron Limited
    Inventors: Hiroaki Inadomi, Tooru Nakamura, Kouji Kimoto, Yasuo Kiyohara, Satoshi Okamura, Satoshi Biwa, Nobuya Yamamoto, Katsuhiro Ookawa, Keiichi Yahata, Tetsuro Nakahara
  • Patent number: 10425614
    Abstract: A moving image reproduction apparatus that reproduces and displays captured moving image on a display device. An MPU acquires a shake amount, and determines whether the shake amount exceeds a range within which camera shake in the captured moving image can be corrected. When the shake amount exceeds the range, the MPU calculates an interpolated shake amount based on the shake amount such that the interpolated shake amount is within the range. The MPU decides a camera shake correction amount based on the shake amount and the interpolated shake amount. The MPU corrects camera shake using the camera shake correction amount. When the shake amount does not exceed the range, the MPU decides the shake amount as the camera shake correction amount, whereas when the shake amount exceeds the range, the MPU decides the interpolated shake amount as the camera shake correction amount.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: September 24, 2019
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Satoshi Okamura
  • Patent number: 10381246
    Abstract: Disclosed is a substrate processing apparatus including: a container body configured to accommodate a substrate and perform a processing on the substrate using a high-pressure processing fluid; a conveyance port configured to carry the substrate into and out of the container body; an opening formed in the container body at a position different from the conveyance port; and a cover member configured to close the opening.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: August 13, 2019
    Assignee: Tokyo Electron Limited
    Inventors: Satoshi Okamura, Satoshi Biwa
  • Publication number: 20190206702
    Abstract: There is provided a substrate processing apparatus comprising a liquid amount detecting part configured to detect a liquid amount of a liquid film formed on a substrate; and a coating state detecting part configured to detect a coating state of the substrate with the liquid film formed thereon.
    Type: Application
    Filed: January 2, 2019
    Publication date: July 4, 2019
    Inventors: Masataka GOSHO, Yuichi DOUKI, Satoshi BIWA, Satoshi OKAMURA, Katsuhiro OOKAWA, Yuichiro KUNUGIMOTO
  • Patent number: 10311915
    Abstract: Grain noise and scratches are applied to an input image as random noise to generate a combined image. When applying grain noise clipped from two-dimensional noise data to the input image, each time clipping is performed, a positional difference from a last clipping position is evaluated. When the positional difference is determined to be small, a current clipping position is changed. When applying scratches clipped from noise data of a plurality of patterns to an input image, when a condition for successively applying scratches for a predetermined time period is selected, a positional difference from a last pasting position is evaluated. When the positional difference is determined to be large, the application of scratches is invalidated.
    Type: Grant
    Filed: September 23, 2013
    Date of Patent: June 4, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventor: Satoshi Okamura
  • Publication number: 20180302589
    Abstract: A moving image reproduction apparatus that reproduces and displays captured moving image on a display device. An MPU acquires a shake amount, and determines whether the shake amount exceeds a range within which camera shake in the captured moving image can be corrected. When the shake amount exceeds the range, the MPU calculates an interpolated shake amount based on the shake amount such that the interpolated shake amount is within the range. The MPU decides a camera shake correction amount based on the shake amount and the interpolated shake amount. The MPU corrects camera shake using the camera shake correction amount. When the shake amount does not exceed the range, the MPU decides the shake amount as the camera shake correction amount, whereas when the shake amount exceeds the range, the MPU decides the interpolated shake amount as the camera shake correction amount.
    Type: Application
    Filed: April 10, 2018
    Publication date: October 18, 2018
    Inventor: Satoshi Okamura