Abstract: A bonding sheet material for a weather strip disclosed herein is a composition including at least EPDM, a cross-linking agent, and carbon black, and has a volume resistivity of 1.0 × 106 ?·cm or more based on a double ring electrode method of JIS-K6271-1: 2015 where a test piece has a thickness of 2 mm. When the composition is placed in a mold and molded to press the composition at 50° C. under 100 Kgf/cm2 for 60 seconds whereby a molded article is produced, the molded article has a thickness change rate of 100% or less, the thickness change rate being represented by formula (1): Thickness change rate = ((thickness of molded article after 30 minutes from releasing press - thickness of mold)/thickness of mold) × 100.

Abstract: A processing fluid supplying method includes: supplying a processing fluid of a gaseous state to a circulation line; generating a processing fluid of a liquid state by cooling the processing fluid of the gaseous state in the circulation line; branching the processing fluid of the liquid state from the circulation line to a branch line; and generating a processing fluid of a supercritical state by heating the processing fluid of the liquid state in the circulation line.

Abstract: There is provided a substrate processing apparatus comprising a liquid amount detecting part configured to detect a liquid amount of a liquid film formed on a substrate; and a coating state detecting part configured to detect a coating state of the substrate with the liquid film formed thereon.

Abstract: A processing fluid supplying method includes: supplying a processing fluid of a gaseous state to a circulation line; generating a processing fluid of a liquid state by cooling the processing fluid of the gaseous state in the circulation line; branching the processing fluid of the liquid state from the circulation line to a branch line; and generating a processing fluid of a supercritical state by heating the processing fluid of the liquid state in the circulation line.

Abstract: A substrate processing apparatus includes: a processing container including a processing space capable of accommodating a substrate in a state where a surface of the substrate is wet by a liquid; a processing fluid supply that supplies a processing fluid in a supercritical state to the processing space toward the liquid; a first exhaust line connected to a first exhaust source; a second exhaust line connected to a second exhaust source and connected to the first exhaust line between the first exhaust source and the processing space; and a controller controlling the second exhaust pressure. The processing fluid in the supercritical state contacts the liquid to dry the substrate, and the controller makes the second exhaust pressure to be higher than the first exhaust pressure during a period in which the processing fluid supply stops supplying the processing fluid to the processing space.

Abstract: A substrate processing system includes: a substrate processing apparatus configured to process a substrate with a processing fluid; and a processing fluid supply apparatus configured to supply the processing fluid to the substrate processing apparatus. The processing fluid supply apparatus includes: a circulation line, a gas supply line, a cooler, a pump, a branch line, a heating unit, and a pressure regulator.

Abstract: A substrate processing apparatus configured to dry a substrate having a liquid film formed on a pattern formation surface thereof with a supercritical fluid includes a processing vessel which is configured to accommodate the substrate therein and into which the supercritical fluid is supplied; a substrate holder which has a base member configured to support the substrate from below while allowing the pattern formation surface of the substrate to face upwards, and which is configured to hold the substrate within the processing vessel; a first detector configured to detect an inclination of the base member with respect to a horizontal plane; a posture adjusting device configured to adjust the inclination of the base member with respect to the horizontal plane; and a controller configured to control the posture adjusting device to perform horizontal leveling of the base member based on a detection result of the first detector.

Abstract: A substrate processing apparatus for drying a substrate by substituting a liquid film of a drying liquid formed on the substrate with a supercritical fluid incudes: a pressure container configured to accommodate the substrate on which the liquid film is formed; a discharge line configured to discharge a fluid inside the pressure container; a depressurizing valve provided in a middle of the discharge line; and a concentration measurement part configured to measure a concentration of vapor of the drying liquid in the fluid flowing through the discharge line, wherein the concentration measurement part is provided on a downstream side of the depressurizing valve of the discharge line and measures the concentration of the drying liquid in the fluid depressurized by the depressurizing valve.

Abstract: A substrate processing apparatus includes: a processing container including a processing space capable of accommodating a substrate in a state where a surface of the substrate is wet by a liquid; a processing fluid supply that supplies a processing fluid in a supercritical state to the processing space toward the liquid; a first exhaust line connected to a first exhaust source; a second exhaust line connected to a second exhaust source and connected to the first exhaust line between the first exhaust source and the processing space; and a controller controlling the second exhaust pressure. The processing fluid in the supercritical state contacts the liquid to dry the substrate, and the controller makes the second exhaust pressure to be higher than the first exhaust pressure during a period in which the processing fluid supply stops supplying the processing fluid to the processing space.

Abstract: Disclosed is a substrate processing apparatus. The substrate processing apparatus includes a container body, and a holding member that conveys the substrate from an outside of the container body into the container body and holds the substrate inside the container body during the processing. A substrate support pin supporting a wafer and a cooling plate cooling the holding member are provided outside the container body.

Abstract: A substrate processing apparatus configured to perform a drying processing of drying substrates by using a processing fluid in a supercritical state includes a processing vessel and multiple holders. In the processing vessel, the drying processing is performed. The multiple holders are respectively configured to hold the substrates within the processing vessel.

Abstract: A substrate processing system includes: a substrate processing apparatus configured to process a substrate with a processing fluid; and a processing fluid supply apparatus configured to supply the processing fluid to the substrate processing apparatus. The processing fluid supply apparatus includes: a circulation line, a gas supply line, a cooler, a pump, a branch line, a heating unit, and a pressure regulator.

Abstract: Provided is a substrate processing apparatus including a liquid processing unit that performs a liquid processing on a substrate; a drying processing unit that performs a drying processing on the substrate in a wet state; a first conveyance unit that conveys the substrate to the liquid processing unit; a second conveyance unit that conveys the substrate in the wet state from the liquid processing unit to the drying processing unit; and a third conveyance unit that conveys the substrate before the liquid processing in the liquid processing unit and to convey the substrate after the drying processing from the drying processing unit. The first and second conveyance units and the drying processing unit are disposed on a side that faces the third conveyance unit, and the liquid processing unit is disposed on a side that faces the first and second conveyance units and is opposite to the third conveyance unit.

Abstract: A moving image reproduction apparatus that reproduces and displays captured moving image on a display device. An MPU acquires a shake amount, and determines whether the shake amount exceeds a range within which camera shake in the captured moving image can be corrected. When the shake amount exceeds the range, the MPU calculates an interpolated shake amount based on the shake amount such that the interpolated shake amount is within the range. The MPU decides a camera shake correction amount based on the shake amount and the interpolated shake amount. The MPU corrects camera shake using the camera shake correction amount. When the shake amount does not exceed the range, the MPU decides the shake amount as the camera shake correction amount, whereas when the shake amount exceeds the range, the MPU decides the interpolated shake amount as the camera shake correction amount.

Abstract: Disclosed is a substrate processing apparatus including: a container body configured to accommodate a substrate and perform a processing on the substrate using a high-pressure processing fluid; a conveyance port configured to carry the substrate into and out of the container body; an opening formed in the container body at a position different from the conveyance port; and a cover member configured to close the opening.

Abstract: There is provided a substrate processing apparatus comprising a liquid amount detecting part configured to detect a liquid amount of a liquid film formed on a substrate; and a coating state detecting part configured to detect a coating state of the substrate with the liquid film formed thereon.

Abstract: Grain noise and scratches are applied to an input image as random noise to generate a combined image. When applying grain noise clipped from two-dimensional noise data to the input image, each time clipping is performed, a positional difference from a last clipping position is evaluated. When the positional difference is determined to be small, a current clipping position is changed. When applying scratches clipped from noise data of a plurality of patterns to an input image, when a condition for successively applying scratches for a predetermined time period is selected, a positional difference from a last pasting position is evaluated. When the positional difference is determined to be large, the application of scratches is invalidated.

Abstract: A moving image reproduction apparatus that reproduces and displays captured moving image on a display device. An MPU acquires a shake amount, and determines whether the shake amount exceeds a range within which camera shake in the captured moving image can be corrected. When the shake amount exceeds the range, the MPU calculates an interpolated shake amount based on the shake amount such that the interpolated shake amount is within the range. The MPU decides a camera shake correction amount based on the shake amount and the interpolated shake amount. The MPU corrects camera shake using the camera shake correction amount. When the shake amount does not exceed the range, the MPU decides the shake amount as the camera shake correction amount, whereas when the shake amount exceeds the range, the MPU decides the interpolated shake amount as the camera shake correction amount.

Abstract: Disclosed is a substrate processing apparatus including: a container body configured to accommodate a substrate and perform a processing on the substrate using a high-pressure processing fluid; a conveyance port configured to carry the substrate into and out of the container body; an opening formed in the container body at a position different from the conveyance port; and a cover member configured to close the opening.

Abstract: A substrate processing apparatus of the present disclosure includes: a processing container; and a supply line which connects the processing container with a fluid source that delivers a supercritical processing fluid. A first opening/closing valve is provided in the supply line. A first throttle is provided on a downstream side of the first opening/closing valve to change the supercritical processing fluid flowing through the supply line to a gaseous state when a pressure within the processing container is equal to or lower than a critical pressure of the processing fluid. A first filter is provided on a downstream side of the first throttle.