Abstract: A semiconductor device fabrication method includes preparing a semiconductor wafer having a plurality of chip areas formed with semiconductor elements and a scribe area having a dicing area in said scribe area for separating said plurality of chip areas, wherein in said scribe area a groove forming area is defined to surround each chip area at a position outside of the dicing area, disposing a multilayer wiring structure including dummy wirings above said semiconductor wafer, said multilayer wiring structure having interlayer insulating films and wiring layers alternately formed, forming a cover layer including a passivation layer, said cover layer covering said multilayer wiring structure, and forming a groove in each said groove forming area, said groove surrounding each of said plurality of chip areas and extending from a surface of said semiconductor wafer and at least through said passivation layer.

Abstract: A recording/reproducing apparatus, for recording/reproducing video content comprises a recording/reproducing portion, which is configured to record the video content into a recording medium, and to reproduce the video content recorded in the recording medium, wherein determination is made if video content to be reproduced at high-speed includes video content or not, which can be displayed in 3D, when reproducing the video content recorded in the recording medium at the high-speed, and upon basis of that determination, a method of high-speed reproduction is changed.

Abstract: A network device connected via a bus with a plurality of network devices includes: an authentication unit that executes authentication based upon message authentication information included in data transmitted, via the bus, by one of the plurality of network devices acting as a sender device; and a processing unit that invalidates the data upon determining that unauthorized data have been transmitted by the sender device impersonating another network device among the plurality of network devices if the authentication fails.

Abstract: A method of manufacturing a semiconductor device, including: forming a moisture resistant ring surrounding a multilayer interconnection structure in a layered body formed of stacked layers of a plurality of interlayer insulating films lower in dielectric constant than a SiO2 film and including the multilayer interconnection structure; forming a groove in the layered body between the moisture resistant ring and a scribe line, the groove reaching a surface of a semiconductor substrate; forming a film including Si and C as principal components and covering sidewall surfaces and a bottom surface of the groove; and forming a protection film on the film along the sidewall surfaces and the bottom surface of the groove.

Abstract: A semiconductor device includes first and second conductor patterns embedded in a first interlayer insulation film and a third conductor pattern embedded in a second interlayer insulation film, the third conductor pattern including a main part and an extension part, the extension part being electrically connected to the first conductor pattern by a first via-plug, the extension part having a branched pattern closer to the main part compared with the first conductor pattern, the branched pattern making a contact with the second conductor pattern via a second via-plug, each of the main part, extension part including the branched pattern, first via-plug and second via-plug forming a damascene structure.

Abstract: A semiconductor device includes first and second conductor patterns embedded in a first interlayer insulation film and a third conductor pattern embedded in a second interlayer insulation film, the third conductor pattern including a main part and an extension part, the extension part being electrically connected to the first conductor pattern by a first via-plug, the extension part having a branched pattern closer to the main part compared with the first conductor pattern, the branched pattern making a contact with the second conductor pattern via a second via-plug, each of the main part, extension part including the branched pattern, first via-plug and second via-plug forming a damascene structure.

Abstract: An information processing apparatus includes a communication unit, a storage unit, and a controller. The communication unit is configured to be able to download arbitrary application data from a service on a network in which first application data encoded by a predetermined system and second application data encoded by another system or unencoded. The storage unit is configured to store decoding information for decoding the first application data. The controller is configured to be able to decode the first application data using the decoding information to install a first application obtained by decoding the first application data.

Abstract: A method of manufacturing a semiconductor device includes: forming a first metal film on an insulating film over a substrate; forming a capacitor lower electrode by patterning the first metal film; and forming a dielectric film on upper and side surfaces of the capacitor lower electrode and on the insulating film. The method further includes: forming a conductive protection film on the dielectric film; patterning the conductive protection film into a shape of covering the capacitor lower electrode; forming a capacitor dielectric film in a shape of covering the upper and side surfaces of the capacitor lower electrode, by patterning the dielectric film so that the patterned conductive protection film covers an upper surface of the capacitor dielectric film; forming a second metal film on the patterned conductive protection film; and forming a capacitor upper electrode that covers at least an upper surface of the patterned conductive protection film.

Abstract: A recording/reproducing apparatus, for recording/reproducing video content comprises a recording/reproducing portion, which is configured to record the video content into a recording medium, and to reproduce the video content recorded in the recording medium, wherein determination is made if video content to be reproduced at high-speed includes video content or not, which can be displayed in 3D, when reproducing the video content recorded in the recording medium at the high-speed, and upon basis of that determination, a method of high-speed reproduction is changed.

Abstract: A semiconductor device comprising scribe areas that include dicing areas for separating chip areas, a groove forming area surrounding each chip area, and includes interlayer insulating lamination disposed above the semiconductor wafer; a multilayer wiring structure formed in the interlayer insulating lamination, the multilayer wiring structure including wiring layers disposed in the chip area, and dummy wirings disposed in the chip area and the scribe area, the wiring layers and the dummy wirings being formed from same mother layers; a cover layer including a passivation layer, the cover layer covering the multilayer wiring structure; and a groove formed in each groove forming area, the groove surrounding the chip areas and extending from a surface of the semiconductor wafer and at least through the passivation layer; wherein the multilayer wiring structure includes no dummy wirings in the groove forming area at least in an uppermost wiring layer.

Abstract: It was impossible for digital broadcast receiver apparatuses to determine whether or not a currently received program or a program to be received in the future is a 3D program. A transmitter apparatus transmits both a program content including video information and ID information including information for determining whether the program content is a 2D program content or a 3D program content. A receiver apparatus comprises: a receiving unit for receiving both the program content including the video information and ID information including information for determining whether the program content is a 2D program content or a 3D program content; and an output unit for outputting the received program content in a 2D format or 3D format. In a case where a 3D program is received and the content thereof is then converted to a 2D format for output, the output unit outputs, in addition to the content of the program in the 2D format, information indicating that the program is a 3D program.

Abstract: A semiconductor device comprising scribe areas that include dicing areas for separating chip areas, a groove forming area surrounding each chip area, and includes interlayer insulating lamination disposed above the semiconductor wafer; a multilayer wiring structure formed in the interlayer insulating lamination, the multilayer wiring structure including wiring layers disposed in the chip area, and dummy wirings disposed in the chip area and the scribe area, the wiring layers and the dummy wirings being formed from same mother layers; a cover layer including a passivation layer, the cover layer covering the multilayer wiring structure; and a groove formed in each groove forming area, the groove surrounding the chip areas and extending from a surface of the semiconductor wafer and at least through the passivation layer; wherein the multilayer wiring structure includes no dummy wirings in the groove forming area at least in an uppermost wiring layer.

Abstract: Previously, users could not be notified when the 3D mode type of a program being received by a digital broadcast receiver was not compatible with the digital broadcast receiver. A reception device is provided with: a reception unit which receives program content including video information and identification information including information for distinguishing whether the program content is 2D program content or 3D program content; and a display control unit which controls the display so as to display whether the aforementioned program content is 2D program content or 3D program content in response to the received aforementioned identification information.

Abstract: Transmitting apparatus transmits a 3D video content, including video data, caption data, and information of depth display position or parallax information relating to the caption data, while a receiving apparatus conducts video processing on the video data and the caption data, so as to display it/them in 3D or 2D, wherein the video processing comprises a first video process for displaying the video data of the 3D video content received, and for displaying the caption data received with using the information of depth display position or the parallax information, and a second video process for displaying the video data of the 3D video content received in 2D, and for displaying the caption information received without based on the information of depth display position or the parallax information, when an operation input signal to change 3D display into 2D display is inputted, enabling a user to view/listen to 3D content.

Abstract: In order to prevent abnormal video output at the time of switching between a 2D program and a 3D program in a digital broadcasting receiving device, disclosed is a receiving device provided with a receiving unit for receiving a program content including video information, and identification information including information for identifying whether the program content is a 2D program content or a 3D program content, and an output unit for outputting the received program content in a 2D format or a 3D format. The output unit outputs a display for giving notice of switching when switching from the 2D video program content to the 3D video program content is detected by the identification information received by the receiving unit.

Abstract: A surgery equipment holding device including a holder for holding surgical equipment, a bar connected to the holder, a brake which operatively engages the bar for stopping movement of the bar, and a pair of switches for switching being an active state and an inactive state of the brake. The surgery equipment holding device is characterized in the operation thereof at the time of disengaging the fixation state, and exhibits excellent operability.

Abstract: A semiconductor device has a multilayer interconnection structure, wherein the multilayer interconnection structure comprises at least a first interconnection layer and a second interconnection layer formed over the first interconnection layer, the first interconnection layer comprises a first conductor pattern embedded in a first interlayer insulation film and constituting a part of an interconnection pattern and a second, another interconnection pattern embedded in the first interlayer insulation film, the second interconnection layer comprises a third conductor pattern embedded in a second interlayer insulation film and constituting a part of said interconnection pattern, the third conductor pattern has an extension part in a part thereof so as to extend in a layer identical to the third conductor pattern, the third conductor pattern being electrically connected to the first conductor pattern at a first region of the extension part via a first via plug, the extension part making a contact with the second c

Abstract: A semiconductor device includes first and second conductor patterns embedded in a first interlayer insulation film and a third conductor pattern embedded in a second interlayer insulation film, the third conductor pattern including a main part and an extension part, the extension part being electrically connected to the first conductor pattern by a first via-plug, the extension part having a branched pattern closer to the main part compared with the first conductor pattern, the branched pattern making a contact with the second conductor pattern via a second via-plug, each of the main part, extension part including the branched pattern, first via-plug and second via-plug forming a damascene structure.

Abstract: An apparatus for holding a medical device has an arm unit equipped with, for example, a polyarticular arm, which holds the medical device such as endoscope movably in the space. Additionally to a determination unit and a controller, the holding apparatus has an operation unit equipped with a plurality of operation members with which an operator's operation causes the arm unit to be moved spatially. The determination unit determines whether or not operator's operations at the plurality of operation members corresponds to an improper state deviating from a properly operated state in which at least two predetermined operation members have been operated within a predetermined period of time which is set to measure simultaneity for operations. If it is determined that the operation is in the improper state, the controller prohibits the arm unit from moving. As long as the operation is proper, the arm unit can be moved.

Abstract: An imaging and displaying system comprises an imaging unit for acquiring images of a treatment site of a subject, a display unit for displaying the images acquired by the imaging unit, and a unit-to-unit connecting device for detachably connecting the imaging unit and the display unit. The imaging unit and the display unit are spatially and movably supported. At least one of the imaging unit and the display unit is detachably attached to an arm with a unit-to-arm detachable device therebetween.