Abstract: A first dummy pattern is arranged in the region allowed to generate the first dummy pattern, after that, the second dummy pattern is generated in the region not allowed to generate the first dummy pattern but allowed to generate the second dummy pattern to thereby enable to arrange the dummy patterns in an efficient manner in the wiring layer, so that the wiring density can be improved and differences in the wiring densities can be reduced.

Abstract: An image observation apparatus comprising an image display unit for displaying an observation image and a supporting mechanism for supporting the image display unit movably and adjustably in the directions of three, substantially perpendicular axes. Since the supporting mechanism of this image observation apparatus can move and adjust the image display unit in three orthogonal axial directions, an operator need not select a plurality of articulates for operating them when he/she wants to move the image display unit to a desired axial direction. Further, one of the three axes can be a rotational axis for turnably supporting the image display unit around the operator. According to this configuration, the image display unit can be independently moved and adjusted in three axial directions, while the observation angle of the observer with respect to the display face of the image display unit is kept constant.

Abstract: A method for fabricating a semiconductor device in which a scribe area can be diced with high yield. The method for fabricating a semiconductor device comprises (a) a step for providing a semiconductor wafer having a plurality of chip areas in which semiconductor elements are formed, and a scribe area for separating the plurality of chip areas and including dicing areas with groove forming areas being defined to surround each chip area on the outer side of the dicing area in the scribe area, (b) a step for arranging a multilayer interconnection structure where interlayer insulation films and interconnection layers are formed alternately above the semiconductor wafer along with dummy lines, (c) a step for forming a cover layer covering the multilayer interconnection structure and including a passivation layer, and (d) a step for forming a groove surrounding each of the plurality of chip areas and penetrating at least the passivation layer from above in the groove forming area.

Abstract: A lens holding unit that holds an objective lens on which a luminous flux from a subject is landed and an image-pickup element holding unit that holds an image-pickup element capable of picking up an optical image are connected to each other for elastic deformation and restoration. External force that acts on the lens holding unit serves to change the position of the optical axis of an optical image that is formed on the image-pickup surface of the image-pickup element.

Abstract: To provide a semiconductor device having copper wiring layers and organic insulating resin layers with less separation and its manufacture method. A semiconductor device has: a semiconductor substrate formed with a number of semiconductor elements; a first interlayer insulating film formed above the semiconductor substrate and having a first wiring recess; a first copper wiring embedded in the first wiring recess; a second interlayer insulating film having a second wiring recess, the second interlayer insulating film including a copper diffusion preventing layer formed on the first copper wiring and the first interlayer insulating film, an oxide film formed on the copper diffusion preventing layer, and an organic insulating resin layer formed on the oxide film; and a second copper wiring embedded in the second wiring recess.

Abstract: An imaging and displaying system comprises an imaging unit for acquiring images of a treatment site of a subject, a display unit for displaying the images acquired by the imaging unit, and a unit-to-unit connecting device for detachably connecting the imaging unit and the display unit. The imaging unit and the display unit are spatially and movably supported. At least one of the imaging unit and the display unit is detachably attached to an arm with a unit-to-arm detachable device therebetween.

Abstract: A first area, a ring shape second area surrounding the first area, and a third area surrounding the second area are defined on the surface of a support substrate. A first wiring layer is disposed above the support substrate. A wiring is formed in the third area, dummy patterns being formed in the second area, and conductive patterns are not formed in the first area. A functional element is disposed above the first wiring layer and in the first area.

Abstract: An apparatus for holding a medical device has an arm unit equipped with, for example, a polyarticular arm, which holds the medical device such as endoscope movably in the space. Additionally to a determination unit and a controller, the holding apparatus has an operation unit equipped with a plurality of operation members with which an operator's operation causes the arm unit to be moved spatially. The determination unit determines whether or not operator's operations at the plurality of operation members corresponds to an improper state deviating from a properly operated state in which at least two predetermined operation members have been operated within a predetermined period of time which is set to measure simultaneity for operations. If it is determined that the operation is in the improper state, the controller prohibits the arm unit from moving. As long as the operation is proper, the arm unit can be moved.

Abstract: The semiconductor device comprises an inter-layer insulating film 18 formed over a substrate 10, a fuse 26 buried in the inter-layer insulating film 18, and a cover film 30 formed over the inter-layer insulating film 18 and having an opening formed therein down to the fuse 26. The inter-layer insulating film 18 is formed in contact with the side wall of the fuse 26 in the opening, whereby the fuse 26 is supported with the inter-layer insulating film 18 to thereby prevent the pattern collapse and pattern scatter. The wide scatter of the fuses can be prevented, and the fuses can be arranged in a small pitch.

Abstract: Disclosed is an information providing system for providing information on content recording. The system includes: a network communicating unit for communication via a network; and an information distributing unit for distributing the information on content recording via the network.

Abstract: The semiconductor device comprises a lower interconnection part 12 which is formed on a silicon substrate 10 and includes an inter-layer insulation film 36 formed of a low-k film 32and a hydrophilic insulation film 34 formed on the low-k film 32, and an interconnection layer 44a, 44b buried in interconnection trenches 38a, 38b formed in the inter-layer insulation film 36 and having an interconnection pitch which is a first pitch; and an intermediate interconnection part 14 which is formed on the lower interconnection part 12 and includes an inter-layer insulation film 142 formed of low-k films 136, 140, an interconnection layer 152a, 152b buried in interconnection trenches 146a, 146b formed in the inter-layer insulation film 142 and having an interconnection pitch which is a second pitch larger than the first pitch, and an SiC film 154 formed directly on the low-k film 140 and the interconnection layer 152a, 152b.

Abstract: A medical device supporting apparatus for supporting a medical device in a three-dimensional space, in which a holding device for holding the medical device is supported by a supporting mechanism three-dimensionally, and the state of the supporting unit is switched between the movable state and the locked state by operating a plurality of final control elements. Operation is stabilized by differentiating the amount of operating force of the plurality of final control elements.

Abstract: A semiconductor device has: a semiconductor substrate having a principal surface; a fuse circuit formed above the principal surface, the fuse circuit having fuse elements each having a predetermined breaking point; a first trench isolation region formed in a surface layer of the semiconductor substrate under the fuse circuit; and a plurality of active region dummies formed through the first trench isolation region in an area excepting a predetermined area around the predetermined breaking point. Although a dummy structure is formed also in a fuse circuit, a breaking margin is prevented from being lowered and a substrate damage is avoided, while surface flatness and line width controllability are ensured.

Abstract: An endoscope is connected optically removably to a TV camera through an adapter. A plurality of fixing pins is arranged on both sides of an insertion axis of an insertion part of the endoscope. A fixing unit to fix the endoscope removably is provided at the front end of an arm unit of an endoscope holder which supports the endoscope movably. The fixing unit has a claw and a movable claw, and grips the fixing pins of the endoscope releasably between the claw and the movable claw.

Abstract: The present invention provides a portable telephone set and a communication inquiring method wherein an inquiry regarding a telephone answering service and an inquiry regarding a mail service can be executed by one operation to achieve sufficient convenience to common users. When one of an inquiring operation as to whether or not a terminated telephone answering service call by the telephone answering service function is present and another inquiring operation as to whether or not a terminated mail by the mail service function is present is performed, an inquiring action corresponding to the one operation is executed first, and then an inquiring action corresponding to the other operation is automatically executed.

Abstract: A first dummy pattern is arranged in the region allowed to generate the first dummy pattern, after that, the second dummy pattern is generated in the region not allowed to generate the first dummy pattern but allowed to generate the second dummy pattern to thereby enable to arrange the dummy patterns in an efficient manner in the wiring layer, so that the wiring density can be improved and differences in the wiring densities can be reduced.

Abstract: A medical instrument holding device includes a grasping portion onto which a medical instrument is mounted, an acceptant arm supported by a link mechanism, and a ball joint element adapted to be fixed to and released from the acceptant arm. The grasping portion is connected to the acceptant arm by the ball joint element arranged above or below the longitudinal axis of the acceptant arm. A total weight of the grasping portion is always balanced so as to apply to the acceptant arm (ball joint element) so that an operator can move the grasping portion under the condition that no total weight is applied to the operator.

Abstract: A medical instrument holding apparatus includes a supporting mechanism, a moving mechanism, a basal portion and a counterweight. The supporting mechanism supports a medical instrument. The moving mechanism which has first and second sides, and a shaft portion located between the first and second sides. The moving mechanism supports the supporting mechanism, allowing the medical instrument and the supporting mechanism to be moved around the shaft portion. The basal portion is coupled to the shaft portion. The basal portion supports the moving mechanism, allowing the moving mechanism to rotate around the shaft portion. The counterweight is located on the second side of the moving mechanism. The counterweight generates a first rotation moment being smaller than a second rotation moment generated from the weights of the medical instrument and the supporting mechanism and acting around the shaft portion in the opposite direction to the second rotation moment.

Abstract: A lens holding unit that holds an objective lens on which a luminous flux from a subject is landed and an image-pickup element holding unit that holds an image-pickup element capable of picking up an optical image are connected to each other for elastic deformation and restoration. External force that acts on the lens holding unit serves to change the position of the optical axis of an optical image that is formed on the image-pickup surface of the image-pickup element.

Abstract: A semiconductor device has: a semiconductor substrate having a principal surface; a fuse circuit formed above the principal surface, the fuse circuit having fuse elements each having a predetermined breaking point; a first trench isolation region formed in a surface layer of the semiconductor substrate under the fuse circuit; and a plurality of active region dummies formed through the first trench isolation region in an area excepting a predetermined area around the predetermined breaking point. Although a dummy structure is formed also in a fuse circuit, a breaking margin is prevented from being lowered and a substrate damage is avoided, while surface flatness and line width controllability are ensured.