Patents by Inventor Satoshi Shida

Satoshi Shida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9175814
    Abstract: An LED lamp has an envelope that includes a globe and a case, an interior space of the envelope being divided in two by a mount closing an opening of the globe, the lamp containing, in a globe side of the interior space, an LED and, in a case side of the interior space, a circuit unit for causing the LED to emit light. The LED is thermally connected to the mount, and the mount and the case are joined to the globe such that, during light emission, at least as much heat from the LED is propagated from the mount to the globe as from the mount to the case.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: November 3, 2015
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Satoshi Shida, Kenji Takahashi, Mitsuko Shuto, Masahiro Miki, Hideo Nagai, Takaari Uemoto
  • Publication number: 20150098218
    Abstract: A light emitting module includes: a substrate; first light emitting elements arranged circularly on the substrate and having a first light distribution angle (a narrow light distribution angle); and second light emitting elements arranged circularly to surround the plurality of first light emitting elements on the substrate, and having a second light distribution angle (a wide light distribution angle) different from the first light distribution angle.
    Type: Application
    Filed: September 29, 2014
    Publication date: April 9, 2015
    Applicant: PANASONIC CORPORATION
    Inventors: Makoto KAI, Takaari UEMOTO, Satoshi SHIDA
  • Publication number: 20140153252
    Abstract: An LED lamp has an envelope that includes a globe (30) and a case (50), an interior space of the envelope being divided in two by a mount (20) closing an opening of the globe (30), the lamp containing, in a globe (30) side of the interior space, an LED and, in a case (50) side of the interior space, a circuit unit for causing the LED to emit light. The LED is thermally connected to the mount (20), and the mount (20) and the case (50) are joined to the globe (30) such that, during light emission, at least as much heat from the LED is propagated from the mount (20) to the globe (30) as from the mount (20) to the case (50).
    Type: Application
    Filed: February 15, 2012
    Publication date: June 5, 2014
    Applicant: PANASONIC CORPORATION
    Inventors: Satoshi Shida, Kenji Takahashi, Mitsuko Shuto, Masahiro Miki, Hideo Nagai, Takaari Uemoto
  • Patent number: 8461755
    Abstract: A light source used for illumination provides favorable heat dissipation properties while suppressing the lowering of the efficiency of light emission. The light source includes a mount substrate, an LED 23 mounted on the mount substrate and a silicon resin mold containing phosphor particles that convert the wavelength of light emitted from the LED 25. The mount substrate includes a metal substrate 23 coated with a ceramic layer 24 containing light-transmissive or highly reflective ceramic particles.
    Type: Grant
    Filed: July 29, 2009
    Date of Patent: June 11, 2013
    Assignee: Panasonic Corporation
    Inventors: Satoshi Shida, Kenzi Takahashi, Mitsuhito Miyazaki
  • Patent number: 8439527
    Abstract: Provided is a bulb-type lamp including a lightweight housing with great handleability. An LED light bulb comprises: an LED module on which LEDs are mounted; a cylindrically-shaped case having openings at both ends, which are first and second ends; a mount member on a front surface of which the LED module is mounted, the mount member closing a corresponding one of the openings of the case by being in contact with an inner circumferential surface of the first end of the case; a base member attached to the second end of the case; and a lighting circuit that is disposed inside the case. A wall thickness of the case is in a range of 200 ?m to 500 ?m inclusive, and the wall thickness of at least one portion of the case decreases from the first end toward the second end of the case.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: May 14, 2013
    Assignee: Panasonic Corporation
    Inventors: Kenzi Takahasi, Yasushige Tomiyoshi, Satoshi Shida, Tatsumi Setomoto, Akira Taniuchi, Takaari Uemoto, Hideo Nagai
  • Patent number: 8410501
    Abstract: A light source that restricts the heat accumulation in the phosphor. The light source includes: a substrate 5; LED elements D21, D22, D23, D41, D42 that have been implemented on a main surface of the substrate 5; projections 11 that have been formed in areas of the main surface of the substrate 5 in which any of the LED elements D21, D22, D23, D41, D42 have not been implemented; and a translucent sealing member 7 that has been formed on the substrate in a state that the LED elements D21, D22, D23, D41, D42 and the projections 11 are covered and sealed with the sealing member 7. The sealing member 7 includes a phosphor 13 that converts light from the LED elements D21, D22, D23, D41, D42 into light of a predetermined color. The heat conductivity of the projections 11 is higher than the heat conductivity of the sealing member 7.
    Type: Grant
    Filed: January 10, 2008
    Date of Patent: April 2, 2013
    Assignee: Panasonic Corporation
    Inventors: Satoshi Shida, Hiroyuki Naito, Takaari Uemoto
  • Patent number: 8337049
    Abstract: A bulb-type lighting source employs a light-emitting element in a structure that facilitates heat dispersal. The lighting source includes a first heat sink member mounted in a bowl shaped case supporting a power supply circuit. A mounting substrate is positioned in surface contact with a surface of the heat sink member and is capable of supporting a light-emitting unit. A globe covers the light-emitting unit to permit light emission. A second heat sink member has a surface in contact with a perimeter of the mounting substrate and offset from the light-emitting unit to provide a second part in surface contact with the first heat member to facilitate the release of heat.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: December 25, 2012
    Assignee: Panasonic Corporation
    Inventors: Satoshi Shida, Takaari Uemoto
  • Publication number: 20120044684
    Abstract: Provided is a bulb-type lamp including a lightweight housing with great handleability. An LED light bulb comprises: an LED module on which LEDs are mounted; a cylindrically-shaped case having openings at both ends, which are first and second ends; a mount member on a front surface of which the LED module is mounted, the mount member closing a corresponding one of the openings of the case by being in contact with an inner circumferential surface of the first end of the case; a base member attached to the second end of the case; and a lighting circuit that is disposed inside the case. A wall thickness of the case is in a range of 200 ?m to 500 ?m inclusive, and the wall thickness of at least one portion of the case decreases from the first end toward the second end of the case.
    Type: Application
    Filed: September 23, 2011
    Publication date: February 23, 2012
    Applicant: Panasonic Corporation
    Inventors: Kenzi Takahasi, Yasushige Tomiyoshi, Satoshi Shida, Tatsumi Setomoto, Akira Taniuchi, Takaari Uemoto, Hideo Nagai
  • Patent number: 8047688
    Abstract: Provided is a bulb-type lamp including a lightweight housing with great handleability. An LED light bulb (1) comprises: an LED module (3) on which LEDs are mounted; a cylindrically-shaped case (7) having openings at both ends, which are first and second ends; a mount member (5) on a front surface of which the LED module (3) is mounted, the mount member (5) closing a corresponding one of the openings of the case (7) by being in contact with an inner circumferential surface of the first end of the case (7); a base member (91) attached to the second end of the case (7); and a lighting circuit (11) that is disposed inside the case (7). A wall thickness of the case (7) is in a range of 200 ?m to 500 ?m inclusive, and the wall thickness of at least one portion of the case (7) decreases from the first end toward the second end of the case (7).
    Type: Grant
    Filed: April 21, 2010
    Date of Patent: November 1, 2011
    Assignee: Panasonic Corporation
    Inventors: Kenzi Takahasi, Yasushige Tomiyoshi, Satoshi Shida, Tatsumi Setomoto, Akira Taniuchi, Takaari Uemoto, Hideo Nagai
  • Patent number: 7992516
    Abstract: A phosphor layer forming apparatus (1) in which a paste (21) containing a phosphor is discharged so as to cover each of a plurality of light-emitting elements (11) mounted on a substrate (10) includes the following: a discharge portion (12) for discharging the paste (21) in the form of droplets onto each of the light-emitting elements (11); a measurement portion (13) for measuring the thickness of individual phosphor layers that are formed of the paste (21) covering each of the light-emitting elements (11); and a discharge control portion (14) for controlling the amount of the paste (21) to be redischarged for each phosphor layer in accordance with the thickness of the individual phosphor layers measured by the measurement portion (13). This phosphor layer forming apparatus can reduce the manufacturing time.
    Type: Grant
    Filed: May 11, 2006
    Date of Patent: August 9, 2011
    Assignee: Panasonic Corporation
    Inventors: Satoshi Shida, Hiroyuki Naito, Noriyasu Tanimoto, Yasuharu Ueno, Makoto Morikawa
  • Publication number: 20110149577
    Abstract: A light source used for illumination provides favorable heat dissipation properties while suppressing the lowering of the efficiency of light emission. The light source includes a mount substrate, an LED 23 mounted on the mount substrate and a silicon resin mold containing phosphor particles that convert the wavelength of light emitted from the LED 25. The mount substrate includes a metal substrate 23 coated with a ceramic layer 24 containing light-transmissive or highly reflective ceramic particles.
    Type: Application
    Filed: July 29, 2009
    Publication date: June 23, 2011
    Inventors: Satoshi Shida, Kenzi Takahashi, Mitsuhito Miyazaki
  • Publication number: 20110089831
    Abstract: Provided is a bulb-type lamp including a lightweight housing with great handleability. An LED light bulb (1) comprises: an LED module (3) on which LEDs are mounted; a cylindrically-shaped case (7) having openings at both ends, which are first and second ends; a mount member (5) on a front surface of which the LED module (3) is mounted, the mount member (5) closing a corresponding one of the openings of the case (7) by being in contact with an inner circumferential surface of the first end of the case (7); a base member (91) attached to the second end of the case (7); and a lighting circuit (11) that is disposed inside the case (7). A wall thickness of the case (7) is in a range of 200 ?m to 500 ?m inclusive, and the wall thickness of at least one portion of the case (7) decreases from the first end toward the second end of the case (7).
    Type: Application
    Filed: April 21, 2010
    Publication date: April 21, 2011
    Inventors: Kenzi Takahasi, Yasushige Tomiyoshi, Satoshi Shida, Tatsumi Setomoto, Akira Taniuch, Takaari Uemoto, Hideo Nagai
  • Publication number: 20110090699
    Abstract: To provide a bulb-type lighting source that employs a light-emitting element and has better heat dispersal characteristics than the conventional technology. A lamp 1 comprising a heat sink member 11, a mounting substrate 21 placed in surface contact with a surface of the heat sink member 11, a light-emitting unit 24 placed on a surface of the mounting substrate 21, a globe 41 covering the light-emitting unit 24 in light emission directions thereof, and a heat sink member 31 that has a first part in surface contact with a perimeter 28 of the surface of the mounting substrate 21 where the light-emitting unit 24 is not mounted and a second part in surface contact with the heat sink member 11.
    Type: Application
    Filed: June 30, 2009
    Publication date: April 21, 2011
    Inventors: Satoshi Shida, Takaari Uemoto
  • Patent number: 7902568
    Abstract: A light-emitting module (2) includes a mounting board (1) with a conductor pattern and a plurality of light-emitting elements (15) mounted on the conductor pattern via wires (21). The extending direction of each of the wires (21) toward the conductor pattern is oriented irregularly when viewed perpendicularly to the mounting board (1). This can prevent the shadows of the wires (21) from overlapping, and thus can suppress the luminance nonuniformity.
    Type: Grant
    Filed: July 10, 2006
    Date of Patent: March 8, 2011
    Assignee: Panasonic Corporation
    Inventors: Makoto Morikawa, Takaari Uemoto, Keiji Nishimoto, Satoshi Shida, Yasuharu Ueno, Hiroyuki Naito
  • Patent number: 7855501
    Abstract: A light-emitting device (1) includes a substrate (10), a light-emitting element (12) that is mounted on the substrate (10) and includes a luminous region (12b) and a nonluminous region (12a), and a phosphor layer (13) that is formed to cover the light-emitting element (12). The thickness of the phosphor layer (13a) located on the nonluminous region (12a) is smaller than that of the phosphor layer (13b) located on the luminous region (12b). The light-emitting device (1) can suppress nonuniform luminescent color.
    Type: Grant
    Filed: May 11, 2006
    Date of Patent: December 21, 2010
    Assignee: Panasonic Corporation
    Inventors: Noriyasu Tanimoto, Toshifumi Ogata, Satoshi Shida, Hiroyuki Naito
  • Patent number: 7827677
    Abstract: A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at a component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted onto a substrate such as a circuit board. The component, when held by the placement head, is recognized by an imaging device at or in the vicinity of the transfer station.
    Type: Grant
    Filed: September 1, 2005
    Date of Patent: November 9, 2010
    Assignee: Panasonic Corporation
    Inventors: Yasuharu Ueno, Shozo Minamitani, Shinji Kanayama, Takashi Shimizu, Satoshi Shida, Shunji Onobori
  • Patent number: 7806642
    Abstract: In a receiver for component feed plates for housing, in multi-stage stacks, a plurality of component feed plates with a plurality of components placed thereon, identification mark portions are formed so as to be placed at end portions or their proximities of support guide portions in a plate feed direction so that each paired set of support guide portions out of individual support guide portions can be distinguished from the other paired sets of support guide portions and moreover visually discerned in the plate feed direction.
    Type: Grant
    Filed: April 20, 2005
    Date of Patent: October 5, 2010
    Assignee: Panasonic Corporation
    Inventors: Shoriki Narita, Kenichi Ishida, Shuichi Hirata, Satoshi Shida
  • Publication number: 20100244662
    Abstract: A luminescent light source (1) is configured to include: a substrate (10); a terminal (11) and a land (12) formed on the substrate (10); a light-emitting element (14) mounted on the land (12) via a bump (13); and a phosphor layer (15) that covers the light-emitting element (14) and is filled in an interstice between a principal surface of the substrate (10) and the light-emitting element (14), wherein the phosphor layer (15) contains a phosphor and a light-transmitting base material, and a content by volume of the phosphor in a part (15a) of the phosphor layer (15) filled in the interstice and a content by volume of the phosphor in a part (15b) of the phosphor layer (15) covering the light-emitting element (14) are substantially equal to each other.
    Type: Application
    Filed: August 24, 2007
    Publication date: September 30, 2010
    Applicant: PANASONIC CORPORATION
    Inventors: Takaari Uemoto, Keiji Nishimoto, Yasuharu Ueno, Satoshi Shida
  • Patent number: 7797820
    Abstract: In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.
    Type: Grant
    Filed: March 6, 2008
    Date of Patent: September 21, 2010
    Assignee: Panasonic Corporation
    Inventors: Satoshi Shida, Shinji Kanayama, Shunji Onobori, Shuichi Hirata, Mamoru Nakao, Kunio Oe, Akira Kugihara, Shoriki Narita, Yoshitaka Etoh, Hiroshi Haji
  • Patent number: D623781
    Type: Grant
    Filed: September 1, 2009
    Date of Patent: September 14, 2010
    Assignee: Panasonic Corporation
    Inventors: Takaari Uemoto, Keiji Nishimoto, Yasuharu Ueno, Satoshi Shida, Yuji Omata