Patents by Inventor Satoshi Shida
Satoshi Shida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6830989Abstract: Handling of each arrayed component is implemented in pickup operation within a movement range of a supporting body against the size of a supporting region of the arrayed component smaller than that in the prior art. Each component supported on a supporting body in array is moved to a pickup position with a movement of the supporting body in X and Y two component array directions, and is fed to pickup operation by a tool with push-up operation by a push-up pin involved, in which after each unit region (D1 to D4) dividedly set around the pickup position of the supporting body is positioned at a pickup standby position by rotation of the supporting body in a switching manner, the component in the positioned unit region is moved in each component array direction of the supporting body and fed to pickup operation in sequence.Type: GrantFiled: February 26, 2002Date of Patent: December 14, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Satoshi Shida, Shinji Kanayama, Takashi Shimizu, Kenji Takahashi, Ryoji Inutsuka, Hiroyuki Yoshida
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Publication number: 20040183910Abstract: Handling of each arrayed component is implemented in pickup operation within a movement range of a supporting body against the size of a supporting region of the arrayed component smaller than that in the prior art. Each component supported on a supporting body in array is moved to a pickup position with a movement of the supporting body in X and Y two component array directions, and is fed to pickup operation by a tool with push-up operation by a push-up pin involved, in which after each unit region (D1 to D4) dividedly set around the pickup position of the supporting body is positioned at a pickup standby position by rotation of the supporting body in a switching manner, the component in the positioned unit region is moved in each component array direction of the supporting body and fed to pickup operation in sequence.Type: ApplicationFiled: March 22, 2004Publication date: September 23, 2004Inventors: Satoshi Shida, Shinji Kanayama, Takashi Shimizu, Kenji Takahashi, Ryoji Inutsuka, Hiroyuki Yoshida
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Patent number: 6748649Abstract: A holding head includes an axially driveable shaft having a nozzle at one end of the shaft for holding a component, a motor for driving the shaft in an axial direction in response to power supplied to the motor, and a detecting device for detecting movement of the shall in the axial direction. A method of operating the component holding head comprises using the detecting device to detect movement of the shaft in the axial direction resulting from the shaft being driven by the motor, and controlling power supplied to the motor in response to the movement of the shaft as detected by the detecting device such that the distance that the shaft is driven by the motor in the axial direction is controlled.Type: GrantFiled: December 21, 2001Date of Patent: June 15, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Osamu Okuda, Akira Kabeshita, Satoshi Shida, Makoto Sueki
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Patent number: 6706130Abstract: When pressurizing and relatively moving the objects to be bonded to each other relative to each other subject their metallic bonding portions to friction bonding for the friction bonding of the metallic bonding portions, the friction bonding operation is temporarily partway reduced or stopped.Type: GrantFiled: April 4, 2002Date of Patent: March 16, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shozo Minamitani, Shinji Kanayama, Satoshi Shida, Yasuharu Ueno
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Patent number: 6692214Abstract: A pusher 13 has a leaf spring 12, a driving section 22, a direction changing section 23, and guides 24. The driving section 22 nips the leaf spring to longitudinally advance and retract it. Advancement of a fore end of the leaf spring 12 in a pushing direction causes the object facing the leaf spring to be pushed from a first position to a second position. A direction changing section 23 bends the tail end of the leaf spring relative to the fore end so as to change the direction of advancement and retraction. Guides 24 guide the fore and tail ends with respect to the direction changing section.Type: GrantFiled: July 17, 2002Date of Patent: February 17, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Satoshi Shida, Takashi Shimizu, Ryoji Inutsuka, Hiroaki Hayashi, Shinji Kanayama, Yuichi Takakura
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Publication number: 20040020043Abstract: A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at the component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted on a substrate such as circuit board. The component held by the placement head is recognized by an imaging device at or in the vicinity of the transfer station.Type: ApplicationFiled: December 5, 2002Publication date: February 5, 2004Inventors: Yasuharu Ueno, Shozo Minamitani, Shinji Kanayama, Satoshi Shida, Shunji Onobori
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Patent number: 6527905Abstract: A method of mounting an electronic component at a specified position of an object. The method includes applying a sealant beforehand in a first application process. The sealant is quickly, sufficiently and forcibly applied in the first application process simply by avoiding electrodes at the arrangement position, and tightly contacting the arranged electronic component and the object. Then, without obstructing successive bonding of electrodes of the electronic component and the object, the bonding of the electrodes is performed in the usual manner. A second application process is carried out by applying a sealant to the periphery of the electronic component in the same manner as in the convention method, which is sufficient to cause the sealant to flow to the sealant previously applied under the electronic component. The second application process can be accordingly conducted speedily and sufficiently.Type: GrantFiled: November 2, 2000Date of Patent: March 4, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Makoto Imanishi, Akira Kabeshita, Kohei Enchi, Satoshi Shida
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Patent number: 6506222Abstract: A divided component separated individually beforehand is supplied in a state while stored in a storage body, taken outside by a take-out and storage unit, and a component is mounted on the divided component by a mounting unit, and thereby a divided component with the component is produced. A plurality of the produced divided components with the components mounted thereon are collected into the storage body. Since the component is mounted on the already divided component, as compared with the prior art, no trouble is given rise to at a junction part between the divided component and the component, thus contributing to an improvement in product quality.Type: GrantFiled: June 5, 2001Date of Patent: January 14, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shozo Minamitani, Takashi Shimizu, Shinji Kanayama, Kenji Takahashi, Kazushi Higashi, Satoshi Shida, Naoto Hosotani
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Publication number: 20020050060Abstract: A voice coil motor is attached to a shaft, that is installed in a component holding head, to drive the shaft in an axial direction. Also, a detecting device is arranged to detect movement of the shaft. The supply of power to the voice coil motor is controlled on the basis of a detection result of the detecting device, whereby movement of the shaft in the axial direction is controlled. The movement of the shaft in the axial direction is accordingly correctly known.Type: ApplicationFiled: December 21, 2001Publication date: May 2, 2002Inventors: Osamu Okuda, Akira Kabeshita, Satoshi Shida, Makoto Sueki
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Patent number: 6343415Abstract: A voice coil motor is attached to a shaft, that is installed in a component holding head, to drive the shaft in an axial direction. Also, a detecting device is arranged to detect movement of the shaft. The supply of power to the voice coil motor is controlled on the basis of a detection result of the detecting device, whereby movement of the shaft in the axial direction is controlled. The movement of the shaft in the axial direction is accordingly correctly known.Type: GrantFiled: June 23, 1999Date of Patent: February 5, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Osamu Okuda, Akira Kabeshita, Satoshi Shida, Makoto Sueki
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Publication number: 20010049874Abstract: An electronic component mounting apparatus which employs a first air feed device connected to an air passage at one end part of a spline shaft, and a second air feed device connected to the air passage in the vicinity of the other end of the spline shaft. The first and second air feeds function to supply air to the air passage to return an interior thereof to atmospheric pressure. The time required to return the vacuum pressure in the air passage to atmospheric pressure can be shortened by the use of the two separate air feeds.Type: ApplicationFiled: August 6, 2001Publication date: December 13, 2001Inventors: Osamu Okuda, Yoshihiro Yoshida, Akira Kabeshita, Satoshi Shida, Naoyuki Kitamura
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Apparatus for holding component, apparatus for mounting component, and method for mounting component
Patent number: 6298547Abstract: An electronic component mounting method which employs a first air feed device connected to an air passage at one end part of a spline shaft, and a second air feed device connected to the air passage in the vicinity of the other end of the spline shaft. The first and second air feeds function to supply air to the air passage to return an interior thereof to atmospheric pressure. The time required to return the vacuum pressure in the air passage to atmospheric pressure can be shortened by the use of the two separate air feeds.Type: GrantFiled: September 22, 1998Date of Patent: October 9, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Osamu Okuda, Yoshihiro Yoshida, Akira Kabeshita, Satoshi Shida, Naoyuki Kitamura -
Publication number: 20010026012Abstract: A divided component separated individually beforehand is supplied in a state while stored in a storage body, taken outside by a take-out and storage unit, and a component is mounted on the divided component by a mounting unit, and thereby a divided component with the component is produced. A plurality of the produced divided components with the components mounted thereon are collected into the storage body. Since the component is mounted on the already divided component, as compared with the prior art, no trouble is given rise to at a junction part between the divided component and the component, thus contributing to an improvement in product quality.Type: ApplicationFiled: June 5, 2001Publication date: October 4, 2001Inventors: Shozo Minamitani, Takashi Shimizu, Shinji Kanayama, Kenji Takahashi, Kazushi Higashi, Satoshi Shida, Naoto Hosotani
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Patent number: 6264704Abstract: A divided component separated individually beforehand is supplied in a state while stored in a storage body, taken outside by a take-out and storage unit, and a component is mounted on the divided component by a mounting unit, and thereby a divided component with the component is produced. A plurality of the produced divided components with the components mounted thereon are collected into the storage body.Type: GrantFiled: March 12, 1999Date of Patent: July 24, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shozo Minamitani, Takashi Shimizu, Shinji Kanayama, Kenji Takahashi, Kazushi Higashi, Satoshi Shida, Naoto Hosotani
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Patent number: 6206066Abstract: A method of and apparatus for mounting an electronic component at a specified position of an object. The method includes applying a sealant in a first application process. The sealant is quickly, sufficiently and forcibly applied in the first application process simply by avoiding electrodes at the arrangement position, and tightly contacting the arranged electronic component and the object. Then the bonding of the electrodes is performed in the usual manner. A second application process is carried out by applying a sealant to the periphery of the electronic component in the same manner as in the convention method, which is sufficient to cause the sealant to flow to the sealant previously applied under the electronic component. The second application process can be accordingly conducted speedily and sufficiently. Air bubbles will not be trapped between the electronic component and the object, with the result that mounting failures due to breakage or corrosion of the electronic component can be reduced.Type: GrantFiled: June 12, 1998Date of Patent: March 27, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Makoto Imanishi, Akira Kabeshita, Kohei Enchi, Satoshi Shida
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Patent number: 6178621Abstract: By lightening the impact load to an electronic component and greatly promoting the load range, the adaptability to the electronic components is enhanced and the manned manual operation is eliminated, thereby improving the productivity and realizing unmanned operation. The vacuum-clamping nozzle unit comprises an automatically detachable vacuum-clamping nozzle (2) for vacuum-clamping the electronic component, a positioning section (3) for positioning the vacuum-clamping nozzle (2) in a rotating direction and a vertical direction, a pushing section (4) for urging said vacuum-clamping nozzle (2) downward by using fluid, a fluid pressure switching section for switching the urging force, a timing switching section for switching the timing of the urging force of said vacuum-clamping nozzle, and a pressure control section for controlling the load to a desired load. Switching the timing of the urging force can be made before or at the time of mounting the electronic component on an electronic circuit board.Type: GrantFiled: April 23, 1998Date of Patent: January 30, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Satoshi Shida, Wataru Hirai, Muneyoshi Fujiwara, Hiroshi Ohta, Hirokazu Honkawa
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Patent number: 5894657Abstract: An electronic component mounting apparatus includes a feeding device for feeding a to-be-placed element including an electronic component, an anisotropic conductive film, or a paste, a holding device for holding the fed element, an element moving device for supporting and moving the holding device in a first direction and placing the element held by the holding device on a circuit board, and a board moving device for holding and moving the circuit board in a second direction generally at right angles to the first direction where the element moving device is moved.Type: GrantFiled: December 8, 1995Date of Patent: April 20, 1999Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shinji Kanayama, Akira Kabeshita, Satoshi Shida, Kohei Enchi, Kenji Takahashi
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Patent number: 5783915Abstract: A linear actuating apparatus includes a shaft moved by a linear actuator means to slide along a center axis. A vertical position detector are provide for detecting the current position of the shaft to produce position signals indicative of detected positions. An actuation controller controls the movement of the shaft based on the position signals from the position detector.Type: GrantFiled: January 19, 1996Date of Patent: July 21, 1998Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Satoshi Shida, Akira Kabeshita, Shinji Kanayama, Kenji Takahashi, Makoto Imanishi, Osamu Nakao