Patents by Inventor Satoshi Takeuchi
Satoshi Takeuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7931065Abstract: In a printed circuit board manufacturing equipment, a pressing die includes a first pressing part, a second pressing part, and a frame part. A buffer member is disposed between a first surface of a laminated body and the first pressing part. The second pressing part has a portion facing a second surface of the laminated body and a portion facing the buffer member. The frame part surrounds a whole area of a side surface of the buffer member. Before pressing and heating, the laminated body, the second pressing part, and the buffer member define an escape space therebetween for escaping the buffer member deformed due to the pressing. A lip protrudes from the frame part toward the laminated body. The lip is deformed following the deformation of the buffer member and comes in contact with a surface of the second pressing part facing the buffer member.Type: GrantFiled: April 23, 2009Date of Patent: April 26, 2011Assignee: DENSO CORPORATIONInventors: Satoshi Takeuchi, Atusi Sakaida, Toshihisa Taniguchi, Toshikazu Harada, Maki Chiba
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Patent number: 7889510Abstract: A component-embedded board device has a wiring board in which an electronic component is embedded, a connection member which is conductive and arranged at a surface of the wiring board, and an inner wiring unit which is arranged in the wiring board and connects an electrode of the electronic component with the connection member. The component-embedded board device is further provided with an inspection connection member for an inspection of a faulty wiring of the inner wiring unit, and an inspection wiring unit which is arranged in the wiring board and connects the inspection connection member with one of the electrode and a predetermined portion of the inner wiring unit. The inspection connection member is conductive and arranged at a surface of the wiring board.Type: GrantFiled: May 1, 2007Date of Patent: February 15, 2011Assignee: Denso CorporationInventors: Satoshi Takeuchi, Hiroki Kamiya, Katsunori Kubota, Motoki Shimizu
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Patent number: 7879656Abstract: A multilayer substrate includes an insulating base member having a plurality of resin films, an electric element embedded in the insulating base member, and a spacer. The resin films are made of a thermoplastic resin and stacked and attached to each other. At least one resin film has a through hole for inserting the electric element. The one resin film further has a plurality of protruding members. One protruding member opposes to another one protruding member so that the one and the another one contact and sandwich the electric element. The spacer is arranged between the one resin film and an adjacent resin film and is disposed at a base portion of one of the protruding members.Type: GrantFiled: March 18, 2010Date of Patent: February 1, 2011Assignee: DENSO CORPORATIONInventors: Hiroki Kamiya, Motoki Shimizu, Satoshi Takeuchi
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Patent number: 7834441Abstract: A multilayer substrate includes an insulating base member having a plurality of resin films, an electric element embedded in the insulating base member, and a spacer. The resin films are made of a thermoplastic resin and stacked and attached to each other. At least one resin film has a through hole for inserting the electric element. The one resin film further has a plurality of protruding members. One protruding member opposes to another one protruding member so that the one and the another one contact and sandwich the electric element. The spacer is arranged between the one resin film and an adjacent resin film and is disposed at a base portion of one of the protruding members.Type: GrantFiled: September 25, 2007Date of Patent: November 16, 2010Assignee: DENSO CORPORATIONInventors: Hiroki Kamiya, Motoki Shimizu, Satoshi Takeuchi
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Publication number: 20100175250Abstract: A multilayer substrate includes an insulating base member having a plurality of resin films, an electric element embedded in the insulating base member, and a spacer. The resin films are made of a thermoplastic resin and stacked and attached to each other. At least one resin film has a through hole for inserting the electric element. The one resin film further has a plurality of protruding members. One protruding member opposes to another one protruding member so that the one and the another one contact and sandwich the electric element. The spacer is arranged between the one resin film and an adjacent resin film and is disposed at a base portion of one of the protruding members.Type: ApplicationFiled: March 18, 2010Publication date: July 15, 2010Applicant: DENSO CORPORATIONInventors: Hiroki Kamiya, Motoki Shimizu, Satoshi Takeuchi
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Publication number: 20090266492Abstract: In a printed circuit board manufacturing equipment, a pressing die includes a first pressing part, a second pressing part, and a frame part. A buffer member is disposed between a first surface of a laminated body and the first pressing part. The second pressing part has a portion facing a second surface of the laminated body and a portion facing the buffer member. The frame part surrounds a whole area of a side surface of the buffer member. Before pressing and heating, the laminated body, the second pressing part, and the buffer member define an escape space therebetween for escaping the buffer member deformed due to the pressing. A lip protrudes from the frame part toward the laminated body. The lip is deformed following the deformation of the buffer member and comes in contact with a surface of the second pressing part facing the buffer member.Type: ApplicationFiled: April 23, 2009Publication date: October 29, 2009Applicant: DENSO CORPORATIONInventors: Satoshi Takeuchi, Atusi Sakaida, Toshihisa Taniguchi, Toshikazu Harada, Maki Chiba
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Patent number: 7528509Abstract: To accurately tune the vibration frequency of a suspension during assembly. Secured positions 3e where a magnetic circuit part 2 is secured to a suspension 3 are provided near to each other. From among the secured positions 3e, secured positions 3e suitable for the characteristics of a suspension 3 to be mounted and the weight of a magnetic circuit part 2 are selected and secured to each other. Thus, the distance between the securing position and the central position of vibration of a suspension 3 and a housing 1 can be changed to tune the frequency to the desired value.Type: GrantFiled: March 18, 2005Date of Patent: May 5, 2009Assignee: Namiki Seimitsu Houseki Kabushiki KaishaInventors: Minoru Ueda, Satoshi Takeuchi, Etuo Oono
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Patent number: 7501031Abstract: The invention provides a steel sheet for hard tinplate and a TFS steel sheet each having an excellent formability and a temper grade of T4 to DR9, and an efficient manufacturing method capable of selectively manufacturing these steel sheets by using raw materials having the same composition, wherein, the steel sheet for hard tinplate and a TFS steel sheet having a temper grade of T4 to DR9 is manufactured from raw materials having the same composition by changing a reduction ratio of temper rolling or double reduce rolling for ultra-low carbon aluminum killed steel C and P contents of which are so regulated as to satisfy a specific formula <1>: 1.6×C×104+0.93×P×103?70 . . . ??<1>.Type: GrantFiled: June 17, 2005Date of Patent: March 10, 2009Assignee: Nippon Steel CorporationInventors: Satoshi Takeuchi, Riki Okamoto, Kazuhito Ito
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Publication number: 20090038716Abstract: The invention provides a steel sheet for hard tinplate and a TFS steel sheet each having an excellent formability and a temper grade of T4 to DR9, and an efficient manufacturing method capable of selectively manufacturing these steel sheets by using raw materials having the same composition, wherein, the steel sheet for hard tinplate and a TFS steel sheet having a temper grade of T4 to DR9 is manufactured from raw materials having the same composition by changing a reduction ratio of temper rolling or double reduce rolling for ultra-low carbon aluminum killed steel C and P contents of which are so regulated as to satisfy a specific formula <1>: 1.6×C×104+0.Type: ApplicationFiled: October 1, 2008Publication date: February 12, 2009Applicant: Nippon Steel CorporationInventors: Satoshi Takeuchi, Riki Okamoto, Kazuhito Ito
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Publication number: 20080136013Abstract: A multilayer substrate includes an insulating base member having a plurality of resin films, an electric element embedded in the insulating base member, and a spacer. The resin films are made of a thermoplastic resin and stacked and attached to each other. At least one resin film has a through hole for inserting the electric element. The one resin film further has a plurality of protruding members. One protruding member opposes to another one protruding member so that the one and the another one contact and sandwich the electric element. The spacer is arranged between the one resin film and an adjacent resin film and is disposed at a base portion of one of the protruding members.Type: ApplicationFiled: September 25, 2007Publication date: June 12, 2008Applicant: DENSO CORPORATIONInventors: Hiroki Kamiya, Motoki Shimizu, Satoshi Takeuchi
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Publication number: 20080017409Abstract: A multilayer board includes a base member made of an insulation material. A plurality of conductor patterns is disposed in the base member in a multi-layered manner. A plurality of interlayer connectors is disposed in the base member, and is electrically connected to the conductor pattern by a heating process. An electronic device is disposed in the base member, and is electrically connected to at least one of the interlayer connector and the conductor pattern. The electronic device includes an electrode made of a material having a melting point higher than a temperature of the heating process.Type: ApplicationFiled: May 31, 2007Publication date: January 24, 2008Applicant: DENSO CORPORATIONInventors: Satoshi Takeuchi, Hiroki Kamiya, Motoki Shimizu
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Patent number: 7304248Abstract: A multi-layer printed circuit board includes: a resin substrate including a plurality of laminated thermoplastic resin films; a thin film resistor embedded in the resin substrate; and an electrode disposed on the thin film resistor. The thermoplastic resin film includes a conductive pattern made of metallic film. The electrode is covered with the conductive pattern disposed over or under the electrode.Type: GrantFiled: April 1, 2004Date of Patent: December 4, 2007Assignee: DENSO CORPORATIONInventors: Kazuo Tada, Koji Kondo, Satoshi Takeuchi
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Publication number: 20070263369Abstract: A component-embedded board device has a wiring board in which an electronic component is embedded, a connection member which is conductive and arranged at a surface of the wiring board, and an inner wiring unit which is arranged in the wiring board and connects an electrode of the electronic component with the connection member. The component-embedded board device is further provided with an inspection connection member for an inspection of a faulty wiring of the inner wiring unit, and an inspection wiring unit which is arranged in the wiring board and connects the inspection connection member with one of the electrode and a predetermined portion of the inner wiring unit. The inspection connection member is conductive and arranged at a surface of the wiring board.Type: ApplicationFiled: May 1, 2007Publication date: November 15, 2007Applicant: DENSO CORPORATIONInventors: Satoshi Takeuchi, Hiroki Kamiya, Katsunori Kubota, Motoki Shimizu
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Patent number: 7287321Abstract: Two types of resin films are prepared for manufacturing a multi-layer board containing a chip component. A fist type has a via hole for the chip component to be inserted into, while a second type does not have the via hole. Resin films including the two types are piled before the chip component is inserted. At least a given resin film of the first type has a via hole provided with protruding members. Of the protruding members, opposing protruding members form a gap between their tips. This gap is shorter than an outer dimension of the inserted chip component. The chip component crushes portion of the tips of the protruding members while being pressed and inserted into the via hole in the given resin film.Type: GrantFiled: August 26, 2005Date of Patent: October 30, 2007Assignee: DENSO CORPORATIONInventors: Satoshi Takeuchi, Motoki Shimizu
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Patent number: 7286367Abstract: A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined positions, a plurality of conductive patterns, which are located on the resin films, and a plurality of conductive pattern interconnecting members, which are located in the via-holes to electrically interconnect the conductive patterns that are electrically separated by the resin films. Two of the conductive patterns are respectively located on two surfaces, which are opposite to each other, of one of the resin films while overlapping. The two of the conductive patterns and the one of the resin films make up a capacitor.Type: GrantFiled: January 10, 2003Date of Patent: October 23, 2007Assignee: DENSO CORPORATIONInventors: Toshihiro Miyake, Satoshi Takeuchi, Koji Kondo, Toshikazu Harada, Masayuki Aoyama, Yoshitaro Yazaki, Kazuo Tada, Yoshihiko Shiraishi, Yosuke Ozaki, Katsumi Yamazaki, Seiji Konishi, Seiichi Shindou
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Publication number: 20070194633Abstract: [Problems]To accurately tune the vibration frequency of a suspension during assembly. [Means for Solving Problems] Secured positions 3e where a magnetic circuit part 2 is secured to a suspension 3 are provided near to each other. From among the secured positions 3e, secured positions 3e suitable for the characteristics of a suspension 3 to be mounted and the weight of a magnetic circuit part 2 are selected and secured to each other. Thus, the distance between the securing position and the central position of vibration of a suspension 3 and a housing 1 can be changed to tune the frequency to the desired value.Type: ApplicationFiled: March 18, 2005Publication date: August 23, 2007Applicant: NAMIKI SEIMITU HOUSEKI KABUSHIKI KAISHAInventors: Minoru Ueda, Satoshi Takeuchi, Etuo Oono
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Patent number: 7165321Abstract: A manufacturing method of a printed wiring board having an embedded electric device is as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality of second resin films, on which a plurality of conductive layers is formed. The first and second resin films and the sheet member include thermoplastic resin. An electric device is inserted in the opening or the recess. Then, the piled body including the electric device is pressed and heated to integrate the piled body. When the piled body is pressed and heated, electrodes of the electric device are electrically connected to the conductive layers while the first and second resin films and the sheet member plastically deformed to seal the electric device.Type: GrantFiled: November 6, 2003Date of Patent: January 23, 2007Assignee: Denso CorporationInventors: Koji Kondo, Tomohiro Yokochi, Toshihiro Miyake, Satoshi Takeuchi
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Patent number: 7036214Abstract: In a manufacturing method of a rigid-flexible printed circuit board, slits for defining two sides of a removing portion are formed in a part of plural resin films, and the plural resin films are stacked and bonded to form a circuit board. Then, a product portion is cut from the circuit board. Before the bonding, a separation sheet is disposed between predetermined adjacent layers of the plural resin films to separate the removing portion from a residual portion of the product portion. Accordingly, while the product portion is cut from the circuit board, the removing portion is separated from the product portion, because the removing portion are defined by the separation sheet, the slits, and a cutting outline of the product portion.Type: GrantFiled: March 7, 2003Date of Patent: May 2, 2006Assignee: Denso CorporationInventors: Koji Kondo, Satoshi Takeuchi, Tomohiro Yokochi, Katsumi Yamazaki, Masakazu Terada
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Publication number: 20060042078Abstract: Two types of resin films are prepared for manufacturing a multi-layer board containing a chip component. A fist type has a via hole for the chip component to be inserted into, while a second type does not have the via hole. Resin films including the two types are piled before the chip component is inserted. At least a given resin film of the first type has a via hole provided with protruding members. Of the protruding members, opposing protruding members form a gap between their tips. This gap is shorter than an outer dimension of the inserted chip component. The chip component crushes portion of the tips of the protruding members while being pressed and inserted into the via hole in the given resin film.Type: ApplicationFiled: August 26, 2005Publication date: March 2, 2006Inventors: Satoshi Takeuchi, Motoki Shimizu
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Publication number: 20050279432Abstract: The invention provides a steel sheet for hard tinplate and a TFS steel sheet each having an excellent formability and a temper grade of T4 to DR9, and an efficient manufacturing method capable of selectively manufacturing these steel sheets by using raw materials having the same composition, wherein, the steel sheet for hard tinplate and a TFS steel sheet having a temper grade of T4 to DR9 is manufactured from raw materials having the same composition by changing a reduction ratio of temper rolling or double reduce rolling for ultra-low carbon aluminum killed steel C and P contents of which are so regulated as to satisfy a specific formula <1>: 1.6×C×104+0.Type: ApplicationFiled: June 17, 2005Publication date: December 22, 2005Inventors: Satoshi Takeuchi, Riki Okamoto, Kazuhito Ito