Abstract: A semiconductor device requires a reduced cost, has a decreased substrate mounting area, and ensures that paired transistors, etc., have equivalent characteristics to each other. A separation strip 10 splits a semiconductor substrate 3 of one conductivity type into pairing regions and surrounds the semiconductor substrate, and has a high impurity concentration than a front surface side of the semiconductor substrate 3 but the same conductivity type with semiconductor substrate 3. A pair of vertical type semiconductor elements 1, 2 is disposed which shares the semiconductor substrate as a collector region, and the semiconductor elements 1, 2 comprise base regions 12, 22 of a reverse conductivity type which are formed respectively in the pairing regions and emitter regions 13, 23 of the one conductivity type which are formed within the base regions 12, 22 of the reverse conductivity type.

Abstract: A resin sealed electronic device has an electronic element (30), a first external lead (10) with an element placement pad (11) having a thickness t of less than 0.1 mm, and a second external lead (20), which is disposed at a distance from the element placement pad (11), the first external lead (10) being bent into an S shape, the bending depth d thereof being made at least the thickness t of the first external lead (10), and the thickness T of the sealing resin on the non-element side of the element placement pad (11) being made smaller than the bending depth d. The electronic element (30), part of the first external lead (10), and part of the second external lead (20) are sealed by a sealing resin(40). This structure provides a compact electronic device, the vertical, horizontal, and height dimensions of which are all under 1 mm.

Abstract: Plating 5 having good slide friction characteristics is applied onto the pocket surfaces 4a1, 4a2, which are opposite each other in the circumferential direction of the pockets 4a of the carrier and onto the end face 4a3 in the axial direction. It is possible to improve the lubrication conditions at the contacting area of the outer circumferential surface of the planetary rollers and the pocket surface 4a1 of the carrier 4 by coating the plating 5 having good slide friction characteristics onto the pocket surfaces 4a1,4a2 of the pocket 4 of the carrier 4 and further onto the end face 4a3. That is, the friction force at the contacting area is able to be decreased by the plating 5 having good friction characteristics, whereby even in a case where the contacting area is lubricated with a little lubricant, thermal deterioration of the lubricant due to heat generation of the contacting area is suppressed and good lubrication actions can be expected.

Abstract: Pulp particles consisting essentially of 50 to 90% by weight of mica particles and 50 to 10% by weight of polyamide-imide, said polyamide-imide forming a continuous phase in which said mica particles are dispersed discontinuously.A paper-like sheet comprising an integrated intimate mixture of 20 to 95% by weight of the pulp particles and 80 to 5% by weight of staple fibers of a thermally stable polymer.