Abstract: The photoelastic polyurethane resin has a Young's modulus at 25° C. of 2 to 5 MPa, a photoelastic constant at 25° C. of 1000×10?12 Pa?1 to 100000×10?12 Pa?1, and a glass transition temperature of ?60° C. to ?21° C.

Abstract: The cushioning material having a sensor 1 includes a resin sheet 4 composed of photoelastic resin, a cushioning material 21 laminated on the resin sheet 4, a photosensor 15 including a light generating unit 5 and a light receiving unit 8 that are disposed to face each other so as to sandwich the resin sheet 4, and a processor 3 that detects a stress applied to the resin sheet 4 based on the light signal detected by the photosensor 15.

Abstract: In a self-repairing polyurethane resin material produced by reaction of pentamethylenediisocyanate with an active hydrogen group-containing compound, the active hydrogen group-containing compound contains a polyol compound having a number average molecular weight of 100 to 2000 and an average functionality of 2 to 3.

Abstract: A self-repairing polyurethane resin material is produced by reaction of a polyisocyanate compound consisting of aliphatic polyisocyanate and/or araliphatic polyisocyanate with an active hydrogen group-containing compound, used for producing polyurethane resin having self-repairing properties, has an isocyanate group at its molecular terminal, contains an allophanate group and an isocyanate trimer, and the mole ratio of the allophanate group relative to the isocyanate trimer is 0.1 to 20.

Abstract: A polyisocyanate composition is produced by reaction of bis(isocyanatomethyl) cyclohexane with trimethylolpropane, and contains a trimethylolpropane-monomolecular-body obtained by reaction of three molecules of bis(isocyanatomethyl) cyclohexane with one molecule of trimethylolpropane, and a trimethylolpropane-bimolecular-body obtained by reaction of five molecules of bis(isocyanatomethyl) cyclohexane with two molecules of trimethylolpropane; and the molar ratio of trimethylolpropane-monomolecular-body relative to trimethylolpropane-bimolecular-body (trimethylolpropane-monomolecular-body/trimethylolpropane-bimolecular-body) contained in the polyisocyanate composition is 1.5 or more and 4.5 or less.

Abstract: A pressure-sensitive adhesive sheet for covering according to an embodiment of the present invention includes a non-crosslinked rubber component having a maximum peak of the molecular weight distribution in the range of 50,000 to 3,000,000, an oil component having a maximum peak of the molecular weight distribution in the range of 1,000 to 20,000, and carbon black. The content of the non-crosslinked rubber component is 25% to 65% by mass, the content of the oil component is 35% to 75% by mass, and the content of the carbon black relative to 100 parts by mass of the total of the non-crosslinked rubber component and the oil component is 1 to 40 parts by mass.

Abstract: Disclosed is a polyurethane resin which is obtained by a reaction between a polyisocyanate component, which contains 1,4-bis(isocyanatomethyl)cyclohexane including not less than 80% by mole of trans isomers, and an active hydrogen compound component.

Abstract: The present invention provides a method for manufacturing a diamond substrate, including: a first step of preparing patterned diamond on a foundation surface, a second step of growing diamond from the patterned diamond prepared in the first step to form the diamond in a pattern gap of the patterned diamond prepared in the first step, a third step of removing the patterned diamond prepared in the first step to form a patterned diamond composed of the diamond formed in the second step, and a fourth step of growing diamond from the patterned diamond formed in the third step to form the diamond in a pattern gap of the patterned diamond formed in the third step. There can be provided a method for manufacturing a diamond substrate which can sufficiently suppress dislocation defects, a high-quality diamond substrate, and a freestanding diamond substrate.

Abstract: The present invention provides a method for manufacturing a diamond substrate, including: a first step of preparing patterned diamond on a foundation surface, a second step of removing a foreign substance adhered on a wall of the patterned diamond prepared in the first step, and a third step of growing diamond from the patterned diamond prepared in the first step to form the diamond in a pattern gap of the patterned diamond prepared in the first step. There can be provided a method for manufacturing a diamond substrate with few dislocation defects, in which generation of abnormal growth particles are suppressed.

Abstract: The eyewear material is an eyewear material containing thermoplastic polyurethane. The eyewear material has a tan ? peak at both less than 0° C. and 0° C. or more and 70° C. or less observed in dynamic viscoelasticity measurement in tensile mode under the measurement conditions of a temperature increase speed of 5° C./min and a measurement frequency of 10 Hz.

Abstract: An external wound-healing agent includes, as an active ingredient, at least one compound of a glycerol alkyl ester represented by Formula (I) or a diglycerol alkyl ester represented by Formula (II).

Abstract: A semiconductor device includes a MISFET having: a diamond substrate; a drift layer having a first layer with a first density for providing a hopping conduction and a second layer with a second density lower than the first density, and having a ? dope structure; a body layer on the drift layer; a source region in an upper portion of the body layer; a gate insulation film on a surface of the body layer; a gate electrode on a surface of the gate insulation film; a first electrode electrically connected to the source region and a channel region; and a second electrode electrically connected to the diamond substrate. The MISFET flows current in the drift layer in a vertical direction, and the current flows between the first electrode and the second electrode.

Abstract: A heat-shrinkable tube or heat-shrinkable cap includes an adhesive layer disposed on the inner surface thereof, the adhesive layer including a low-viscosity adhesive layer formed of a resin having a viscosity of 10 Pa·s or less at a shear rate of 1 s?1 at the heat shrinkage temperature and a viscosity of 100 Pa·s or more at a shear rate of 1 s?1 at the maximum continuous use temperature. The heat-shrinkable tube or heat-shrinkable cap is used for waterproofing an exposed portion of electrical wires of an electrical wire bundle such as a wire harness, in which merely by placing the heat-shrinkable tube or heat-shrinkable cap over the exposed portion of electrical wires, waterproofing and water blocking between strands can be achieved, and outflow of the resin during heat shrinking does not occur. A method of waterproofing an electrical wire bundle uses the heat-shrinkable tube or heat-shrinkable cap.

Abstract: Disclosed is a polyurethane resin which is obtained by a reaction between a polyisocyanate component, which contains 1,4-bis(isocyanatomethyl)cyclohexane including not less than 80% by mole of trans isomers, and an active hydrogen compound component.

Abstract: It is an object of the present invention to provide a heat-recoverable article which heat-shrinks in an appropriate temperature range, in which the occurrence of bloom and bleeding is small, and which has excellent resistance to copper-induced damage; and a wire splice and a wire harness each including the heat-recoverable article. A heat-recoverable article according to the present invention has a cylindrical shape and includes a base material layer, in which the base material layer contains an antioxidant and two or more polyolefin resins, the base material layer has one melting-point peak temperature, the melting-point peak temperature is 112° C. to 128° C., the heat of fusion of all of the resin components of the base material layer is 80 to 130 J/g, and the oxidation induction temperature of the base material layer is 265° C. to 280° C.

Abstract: A resin has a viscosity of 10 Pa·s or less at a shear rate of 1 s?1 at 150° C. and a viscosity of 100 Pa·s or more at a shear rate of 1 s?1 at 125° C., the resin having a low viscosity that allows easy penetration into strands of a wire harness at a heat shrinkage temperature and having a high viscosity that does not allow flowing of the resin at a temperature at which the wire harness is used.

Abstract: A white light-emitting device of the present invention includes a substrate (101); a diamond semiconductor layer (105) provided on the substrate (101), in which one or a plurality of p-type ? layers (102), a p-type or n-type ? layer (103), and one or a plurality of n-type ? layers (104) are laminated in this order from the substrate (101); a first electrode (106) provided on the ? layer (102) which injects an electric current; a second electrode (107) provided on the ? layer (104) which injects an electric current; and a fluorescent member (108) which coats a light emission extraction region of the surface of the diamond semiconductor layer.

Abstract: A low-resilience polyurethane foam is produced by allowing a low-resilience polyurethane foam composition containing polyisocyanate (a), polyol (b), catalyst (c), and blowing agent (d) to react. The polyisocyanate (a) contains bis(isocyanatomethyl)cyclohexane, and the polyol (b) contains 5 to 30 mass % of polyol (b-1) having an average functionality of 1.5 to 4.5 and a hydroxyl number of 20 to 70 mgKOH/g, and 70 to 95 mass % of polyol (b-2) having an average functionality of 1.5 to 4.5 and a hydroxyl number of 140 to 300 mgKOH/g.

Abstract: A transparent polyamide resin composition includes a transparent polyamide resin which is a copolymer of an alicyclic diamine and a dicarboxylic acid and which has a refractive index of 1.500 to 1.550, and a transparent crosslinking auxiliary having a refractive index of 1.500 to 1.550, in which the amount of the crosslinking auxiliary added is 13 to 26 parts by mass relative to 100 parts by mass of the transparent polyamide resin, and the crosslinking auxiliary is dispersed, as phases with a diameter of 350 nm or less, in the transparent polyamide resin. A crosslinked transparent polyamide resin molded body is obtained by molding the transparent polyamide resin composition and crosslinking the transparent polyamide resin.

Abstract: A polymerizable composition for an optical material of the present invention includes polyisocyanate (a) including aliphatic polyisocyanate (a1) and a modified aliphatic polyisocyanate (a2), an episulfide (b), and a polythiol (c).