Abstract: A white light-emitting device of the present invention includes a substrate (101); a diamond semiconductor layer (105) provided on the substrate (101), in which one or a plurality of p-type ? layers (102), a p-type or n-type ? layer (103), and one or a plurality of n-type ? layers (104) are laminated in this order from the substrate (101); a first electrode (106) provided on the ? layer (102) which injects an electric current; a second electrode (107) provided on the ? layer (104) which injects an electric current; and a fluorescent member (108) which coats a light emission extraction region of the surface of the diamond semiconductor layer.

Abstract: A Pentamethylene diisocyanate is obtained by phosgenating pentamethylenediamine or its salt obtained by a biochemical method, and contains 5 to 400 ppm of a compound represented by the general formula (1) below and a compound represented by the general formula (2) below in total:

Abstract: An object of the present invention is to provide a multilayered heat-recoverable article in which an adhesive layer easily flows during heat shrinkage to ensure adhesiveness with an adherend and does not flow out from a base material layer after heat shrinkage, and a wire splice and a wire harness that include a tube formed by thermally shrinking such a multilayered heat-recoverable article. The multilayered heat-recoverable article (1) according to the present invention includes a cylindrical base material layer (10), and an adhesive layer (11) formed on an inner circumferential surface of the base material layer. The adhesive layer (11) is formed of a resin composition that contains a polyamide as a main component and that does not substantially contain an inorganic filler. The resin composition is cross-linked by irradiation with ionizing radiation. A shear viscosity of the adhesive layer (11) at 150° C. is 300 Pa·s or more at a shear rate of 0.01 s?1 and 200 Pa·s or less at a shear rate of 100 s?1.

Abstract: A transparent polyamide resin composition includes a transparent polyamide resin which is a copolymer of an alicyclic diamine and a dicarboxylic acid and which has a refractive index of 1.500 to 1.550, and a transparent crosslinking auxiliary having a refractive index of 1.500 to 1.550, in which the amount of the crosslinking auxiliary added is 13 to 26 parts by mass relative to 100 parts by mass of the transparent polyamide resin, and the crosslinking auxiliary is dispersed, as phases with a diameter of 350 nm or less, in the transparent polyamide resin. A crosslinked transparent polyamide resin molded body is obtained by molding the transparent polyamide resin composition and crosslinking the transparent polyamide resin.

Abstract: A Pentamethylene diisocyanate is obtained by phosgenating pentamethylenediamine or its salt obtained by a biochemical method, and contains 5 to 400 ppm of a compound represented by the general formula (1) below and a compound represented by the general formula (2) below in total:

Abstract: A low-resilience polyurethane foam is produced by allowing a low-resilience polyurethane foam composition containing polyisocyanate (a), polyol (b), catalyst (c), and blowing agent (d) to react. The polyisocyanate (a) contains bis(isocyanatomethyl)cyclohexane, and the polyol (b) contains 5 to 30 mass % of polyol (b-1) having an average functionality of 1.5 to 4.5 and a hydroxyl number of 20 to 70 mgKOH/g, and 70 to 95 mass % of polyol (b-2) having an average functionality of 1.5 to 4.5 and a hydroxyl number of 140 to 300 mgKOH/g.

Abstract: An object of the present invention is to provide a heat-recoverable article that thermally shrinks in a suitable temperature range and that does not easily split, and a wire splice and a wire harness that use the heat-recoverable article. The heat-recoverable article according to the present invention is a cylindrical, heat-recoverable article including a base layer. The base layer contains two or more polyolefin-based resins and a flame retardant, the base layer has a single melting-point peak temperature, the melting-point peak temperature is 112° C. or more and 128° C. or less, and a heat of fusion of the base layer is 60 J/g or more and 85 J/g or less. A heat of fusion of a total resin component of the base layer is preferably 80 J/g or more and 135 J/g or less.

Abstract: A Pentamethylene diisocyanate is obtained by phosgenating pentamethylenediamine or its salt obtained by a biochemical method, and contains 5 to 400 ppm of a compound represented by the general formula (1) below and a compound represented by the general formula (2) below in total:

Abstract: It is an object of the present invention to provide a multilayered heat-recoverable article in which the occurrence of bloom and bleeding is small, which has excellent resistance to copper-induced damage, and which is easy to produce; and a wire splice and a wire harness each including the multilayered heat-recoverable article. A multilayered heat-recoverable article according to the present invention includes a cylindrical base material layer and an adhesive layer disposed on an inner peripheral surface of the base material layer, in which the base material layer contains a polyethylene and an oxidation inhibitor, the adhesive layer contains an ethylene-vinyl acetate copolymer and an oxidation inhibitor, the oxidation induction temperature of the base material layer is 255° C. to 270° C., and the oxidation induction temperature of the adhesive layer is 255° C. or higher.

Abstract: 1,4-bis(isocyanatomethyl)cyclohexane contains 70 mol % or more and 95 mol % or less of a trans isomer relative to a total amount of a cis isomer and the trans isomer, and 0.

Abstract: 1,4-bis(isocyanatomethyl)cyclohexane contains 70 mol % or more and 95 mol % or less of a trans isomer relative to a total amount of a cis isomer and the trans isomer, and 0.

Abstract: Provided are a multilayered heat-recoverable article which can suppress deterioration of a PVC insulated wire and flow of an adhesive layer and which is suitable for appropriately protecting the PVC insulated wire; and a wire splice and a wire harness, each including the multilayered heat-recoverable article. According to the present invention, a multilayered heat-recoverable article 1 includes a base material layer 10 and an adhesive layer 11 disposed on an inner side of the base material layer 10. The adhesive layer 11 does not flow at a temperature of 135° C. and includes a thermoplastic resin and a viscosity characteristics modifier composed of at least one selected from the group consisting of silica, an organically treated layered silicate, and a deterioration inhibitor.

Abstract: Disclosed is a polyurethane resin which is obtained by a reaction between a polyisocyanate component, which contains 1,4-bis(isocyanatomehyl)cyclohexane including not less than 80% by mole of trans isomers, and an active hydrogen compound component.

Abstract: In this junction element 1, when a forward voltage is applied, a depletion layer is formed in a semiconductor layer 2, prohibiting electrons present in an electrode layer 4 to move into the semiconductor layer 2. For this reason, a majority of holes in a semiconductor layer 3 do not disappear by recombination with conduction electrons in the semiconductor layer 2, but reach the electrode layer 4 while diffusing into the semiconductor layer 2. Accordingly, the junction element 1 can serve as a good conductor for holes, while avoiding the influence of a resistance value, and allows a current to flow therethrough at a level equal to or more than that achieved by a semiconductor element formed of a Si or SiC semiconductor.

Abstract: The present invention provides a diamond semiconductor device which includes: a diamond substrate; a diamond step section disposed over substrate surface of the diamond substrate having a {001} crystal face to rise substantially perpendicularly to substrate surface; an n-type phosphorus-doped diamond region; and a diamond insulation region. In the diamond step section, a first step section having a {110} crystal face over a side surface is integrated with a second step section having a {100} crystal face over a side surface. The phosphorus-doped diamond region is formed by crystal growth started from base angle of the step shape of the first step section over the side surface of the first step section and substrate surface of the diamond substrate as growth base planes. The diamond insulation region is formed by crystal growth over the side surface of the second step section and substrate surface of the diamond substrate as growth base planes.

Abstract: The disclosed electrostatic coating system (1) includes a spray gun (2) for electrostatic coating, a high-voltage generator (5), and an alternating-current source unit (4), and further includes a removable grounding member (7), in a state attached to the main body of the gun, provided to close an open-circuit portion (3c) of the grounded power source line (3a), and a control circuit (8) for controlling the alternating current source unit (4) by detecting the current flowing through the power source line (3) or the voltage of the power source line (3) by a current coil (13) to stop application of the alternating voltage (Vac) to the high-voltage generator (5) when the detected electric current or the detected voltage has dropped or either the current or the voltage is not detected during supply of the alternating voltage (Vac) to the high voltage generator (5) of the spray gun (2). This system enables prevention of charging of the removable grounding member (7) to improve the safety in the coating operation.

Abstract: A polyisocyanate composition is produced by reaction of bis(isocyanatomethyl)cyclohexane with trimethylolpropane, and contains a trimethylolpropane-monomolecular-body obtained by reaction of three molecules of bis(isocyanatomethyl)cyclohexane with one molecule of trimethylolpropane, and a trimethylolpropane-bimolecular-body obtained by reaction of five molecules of bis(isocyanatomethyl)cyclohexane with two molecules of trimethylolpropane; and the molar ratio of trimethylolpropane-monomolecular-body relative to trimethylolpropane-bimolecular-body (trimethylolpropane-monomolecular-body/trimethylolpropane-bimolecular-body) contained in the polyisocyanate composition is 1.5 or more and 4.5 or less.

Abstract: A method for manufacturing a single crystal diamond in which vapor phase synthetic single crystal diamond is additionally deposited on a single crystal diamond seed substrate obtained by vapor phase synthesis, includes a step of measuring flatness of the seed substrate, a step of determining whether or not to flatten the seed substrate based on the measurement result of the flatness, and any one of the following two steps of a step of additionally depositing the vapor phase synthetic single crystal diamond after flattening the seed substrate for which the flattening is necessary based on the determination and a step of additionally depositing the vapor phase synthetic single crystal diamond without flattening the seed substrate for which the flattening is not necessary based on the determination.

Abstract: A thermionic power generator includes an emitter generating thermions and a collector collecting the thermions. The emitter includes an emitter substrate having an electric conductivity, a low resistance layer stacked to the emitter substrate and made of an n-type diamond semiconductor that includes phosphorus as a donor, and an electron emission layer stacked to the low resistance layer and made of an n-type diamond semiconductor that includes nitrogen as a donor. The collector includes a collector substrate having an electric conductivity and is disposed opposite to the emitter via a clearance. The electron emission layer has a thickness equal to or less than 40 nm.

Abstract: Provided are a multilayered heat-recoverable article which can be used for many types of adherend and which is suitable for improving the convenience of the user, and a wire harness and a wire splice, each including the multilayered heat-recoverable article. According to the present invention, a multilayered heat-recoverable article 1 includes a base material layer 10 and an adhesive layer 11 disposed on the inner side of the base material layer 10. The adhesive layer 11 includes [A] a thermoplastic resin having a melt flow rate of 15 g/10 min to 1,000 g/10 min at 190° C. and a load of 2.16 kg, [B] an organically treated layered silicate, and [C] a deterioration inhibitor. The shear viscosity at 150° C. of the adhesive layer 11 is 300 Pa·s or more at a shear rate of 0.1 s?1 and 200 Pa·s or less at a shear rate of 100 s?1.