Abstract: A method for controlling hardware resource configuration for a processing system comprises obtaining performance monitoring data indicative of processing performance associated with workloads to be executed on the processing system, providing a trained machine learning model with input data depending on the performance monitoring data; and based on an inference made from the input data by the trained machine learning model, setting control information for configuring the processing system to control an amount of hardware resource allocated for use by at least one processor core. A corresponding method of training the model is provided. This is particularly useful for controlling inter-core borrowing of resource between processor cores in a multi-core processing system, where resource is borrowed between respective cores, e.g. cores on different layers of a 3D integrated circuit.

Abstract: Various implementations described herein are directed to device. The device may include a first tier having a processor and a first cache memory that are coupled together via control logic to operate as a computing architecture. The device may include a second tier having a second cache memory that is coupled to the first cache memory. Also, the first tier and the second tier may be integrated together with the computing architecture to operate as a stackable cache memory architecture.

Abstract: Various implementations described herein are directed to a device with a multi-layered logic structure with multiple layers including a first layer and a second layer arranged vertically in a stacked configuration. The device may have a first cache memory with first interconnect logic disposed in the first layer. The device may have a second cache memory with second interconnect logic disposed in the second layer, wherein the second interconnect logic in the second layer is linked to the first interconnect logic in the first layer.

Abstract: Various implementations described herein refer to a device having a memory structure with a substrate. The device may have a signal wire buried or partially buried within at least one of the substrate and a dielectric for transmitting electrical signals. The device may be manufactured as a memory device having a memory cell structure with the signal wire buried or partially buried in the substrate.

Abstract: Various implementations described herein are directed to a device having a multi-layered logic structure with a first logic layer and a second logic layer arranged vertically in a stacked configuration. The device may have a memory array that provides data, and also, the device may have an inter-layer data bus that vertically couples the memory array to the multi-layered logic structure. The inter-layer data bus may provide multiple data paths to the first logic layer and the second logic layer for reuse of the data provided by the memory array.

Abstract: Various implementations described herein are related to a device having voltage regulation architecture with multiple layers arranged in a multi-layer structure. The device may include one or more layers of the multiple layers with voltage regulation circuitry that may be configured to manage at least one of process variation and temperature variation between the multiple layers of the multi-layer structure.

Abstract: According to one implementation of the present disclosure, a method includes fabricating a memory macro unit; forming a through silicon via (TSV); and bonding the TSV at least partially through the fabricated memory macro unit. According to one implementation of the present disclosure, a computer-readable storage medium comprising instructions that, when executed by a processor, cause the processor to perform operations including: receiving a user input corresponding to dimensions of respective pitches of one or more through silicon vias (TSVs); determining whether dimensions of a memory macro unit is greater than a size threshold, wherein the size threshold corresponds to the received user input; and determining one or more through silicon via (TSV) positionings based on the determined dimensions of the memory macro unit.

Abstract: A method and apparatus for generating a design for a 3D integrated circuit (3DIC) comprises extracting at least one design characteristic from a first data representation of a design for a 2D integrated circuit (2DIC) generated according to the design criteria required for the 3DIC. Components of the 3DIC are partitioned into groups (each representing one tier of the 3DIC) based on the extracted design characteristic. A second data representation of a 2DIC design is generated comprising multiple adjacent partitions each comprising the component groups for one tier of the 3DIC design together with inter-tier via ports representing locations of inter-tier vias. A placement for each partition is determined separately from a placement of corresponding components of the 2DIC represented by the original first data representation. This approach allows a 2DIC EDA tool to be used for designing a 3DIC.

Abstract: Various implementations described herein refer to a device having a multi-layered logic structure with multiple layers including a first layer and a second layer arranged vertically in a stacked configuration. The device may have a first network that links nodes together in the first layer. The device may have a second network that links the nodes in the first layer together by way of the second layer so as to reduce latency related to data transfer between the nodes.

Abstract: Various implementations described herein are directed to a device with a multi-layered logic structure with multiple layers including a first layer and a second layer arranged vertically in a stacked configuration. The device may have a first cache memory with first interconnect logic disposed in the first layer. The device may have a second cache memory with second interconnect logic disposed in the second layer, wherein the second interconnect logic in the second layer is linked to the first interconnect logic in the first layer.

Abstract: According to one implementation of the present disclosure, an integrated circuit includes a memory macro unit, and one or more through silicon vias (TSVs) at least partially coupled through the memory macro unit. According to one implementation of the present disclosure, a computer-readable storage medium comprising instructions that, when executed by a processor, cause the processor to perform operations including: receiving a user input corresponding to dimensions of respective pitches of one or more through silicon vias (TSVs); determining whether dimensions of a memory macro unit is greater than a size threshold, wherein the size threshold corresponds to the received user input; and determining one or more through silicon via (TSV) positionings based on the determined dimensions of the memory macro unit.

Abstract: According to one implementation of the present disclosure, a method includes performing a spatial alignment of at least one of first or second data tiers of a circuit; and performing a computation based on the spatial alignment of the at least one of the first and second data tiers. According to another implementation of the present disclosure, a circuit includes: a compute circuitry; and at least first and second data tiers of two or more data tiers positioned at least partially overlapping one another. In an example, each of the at least first and second data tiers is coupled to the compute circuitry. In certain implementations, the positioning of the first and second data tiers at least partially overlapping one another corresponds to a spatial alignment.

Abstract: Various implementations described herein are directed to a device having a multi-layered logic structure with a first logic layer and a second logic layer arranged vertically in a stacked configuration. The device may have a memory array that provides data, and also, the device may have an inter-layer data bus that vertically couples the memory array to the multi-layered logic structure. The inter-layer data bus may provide multiple data paths to the first logic layer and the second logic layer for reuse of the data provided by the memory array.

Abstract: According to one implementation of the present disclosure, a method includes: generating a three-dimensional (3D) circuit design of an integrated circuit; and providing respective inter-tier connections coupling for first and second networks concurrently on the generated 3D circuit design. The first networks may include power or ground networks, while the second networks may include signal networks. In another implementation, a method includes: generating a three-dimensional (3D) circuit design of an integrated circuit; and providing inter-tier connections on the generated 3D circuit design during one of a placement stage, a partitioning stage, a clock tree synthesis (CTS) stage, or a routing stage of a physical circuit design procedure.

Abstract: Various implementations described herein are related to a device having voltage regulation architecture with multiple layers arranged in a multi-layer structure. The device may include one or more layers of the multiple layers with voltage regulation circuitry that may be configured to manage at least one of process variation and temperature variation between the multiple layers of the multi-layer structure.

Abstract: According to one implementation of the present disclosure, a method includes: generating a three-dimensional (3D) circuit design of an integrated circuit; and providing respective inter-tier connections coupling for first and second networks concurrently on the generated 3D circuit design. The first networks may include power or ground networks, while the second networks may include signal networks. In another implementation, a method includes: generating a three-dimensional (3D) circuit design of an integrated circuit; and providing inter-tier connections on the generated 3D circuit design during one of a placement stage, a partitioning stage, a clock tree synthesis (CTS) stage, or a routing stage of a physical circuit design procedure.

Abstract: According to one implementation of the present disclosure, an integrated circuit includes a memory macro unit, and one or more through silicon vias (TSVs) at least partially coupled through the memory macro unit. According to one implementation of the present disclosure, a computer-readable storage medium comprising instructions that, when executed by a processor, cause the processor to perform operations including: receiving a user input corresponding to dimensions of respective pitches of one or more through silicon vias (TSVs); determining whether dimensions of a memory macro unit is greater than a size threshold, wherein the size threshold corresponds to the received user input; and determining one or more through silicon via (TSV) positionings based on the determined dimensions of the memory macro unit.

Abstract: Various implementations described herein are directed to an integrated circuit (IC) having a design that is severable into multiple sub-circuits having input-output (IO) ports. The integrated circuit (IC) may include multiple physical electrical connections that are adapted to electrically interconnect the IO ports of the multiple sub-circuits to operate as the IC, and the IO ports have three-dimensional (3D) geometric position information associated therewith.

Abstract: A method for controlling hardware resource configuration for a processing system comprises obtaining performance monitoring data indicative of processing performance associated with workloads to be executed on the processing system, providing a trained machine learning model with input data depending on the performance monitoring data; and based on an inference made from the input data by the trained machine learning model, setting control information for configuring the processing system to control an amount of hardware resource allocated for use by at least one processor core. A corresponding method of training the model is provided. This is particularly useful for controlling inter-core borrowing of resource between processor cores in a multi-core processing system, where resource is borrowed between respective cores, e.g. cores on different layers of a 3D integrated circuit.

Abstract: Disclosed are methods, systems and devices for distribution of a timing signal among operational nodes of a circuit device comprising one or more circuit dies. In one implementation, a timing signal distribution network may transmit a timing signal to one or more operational circuit nodes formed on a circuit die and a clock circuit may generate a first clock signal for transmission as the timing signal to the one or more operational circuit nodes. A switch circuit may apply a second clock signal for transmission as the timing signal in lieu of the first clock signal if the circuit die is integrated at least one of the one or more other circuit dies. In another implementation, timing signals received at timing signal terminals of at least two of two or more of operational circuit nodes may be synchronized independently of the timing signal distribution network.