Abstract: Coupling apparatuses, circuits having such coupling apparatuses and corresponding methods are provided that involve a first and a second signal being coupled out from an out-coupling circuit part and being separately coupled into first and second circuit pmts. The use of different coupling mechanisms effects signal separation in this case. In particular, one of the signals can be coupled as a differential signal and the other as a common mode signal.

Abstract: An embodiment method for voltage-controlled oscillator (VCO) control includes detecting a first VCO output signal of a first VCO. The first VCO output signal has a first VCO output frequency. The method also includes determining a first down-scaled signal in accordance with the first VCO output signal. The first down-scaled signal has a first down-scaled frequency that is reduced by a fixed ratio relative to a current value of the first VCO output frequency. The method also includes modifying the first VCO output frequency using a first phase lock loop (PLL) in accordance with the first down-scaled signal and an oscillating reference signal, and detecting a second VCO output signal of a second VCO. The second VCO output signal has a second VCO output frequency. The method also includes modifying the second VCO output frequency in accordance with the second VCO output signal and the first down-scaled signal.

Abstract: A method for operating a radar system includes increasing a frequency of a radar signal during a first time interval and transmitting the radar signal from a first transmit antenna during the first time interval. Moreover, the method includes decreasing the frequency of the radar signal during a second time interval and transmitting the radar signal from a second transmit antenna during the second time interval.

Abstract: An electronic device for gesture recognition comprises at least one transmission antenna port, at least reception antenna port, an analog-to-digital converter connected to the at least one reception antenna port, and first and second buffer memories connected to the analog-to-digital converter. The first and second buffer memories are configured to store data received from the analog-to-digital converter and configured to output the stored data in an alternating manner.

Abstract: A device and method for testing a mixer. For testing, signals having essentially the same frequency are applied to local oscillator (LO) and radio frequency (RF) inputs of the mixer. The signals phase-shifted with respect to each other and an output of the mixer is measured to provide a result.

Abstract: A mixing stage includes a first modulation stage that receives an input signal from a first common node of the mixing stage, a first local oscillator input that receives a local oscillator signal, and a first modulation signal output adapted to provide a first modulated signal. A second modulation stage of the mixing stage includes a second input that receives a phase inverted representation of the input signal from a second common node of the mixing stage, a second local oscillator input that receives the local oscillator signal, and a second modulation signal output adapted to provide a second modulated signal. A current generation circuit provides a supply current to the first common node and to the second common node. A current control circuit is adapted to superimpose an offset current to the current of at least one node of the first common node and the second common node.

Abstract: A mixing stage includes a first modulation stage that receives an input signal from a first common node of the mixing stage, a first local oscillator input that receives a local oscillator signal, and a first modulation signal output adapted to provide a first modulated signal. A second modulation stage of the mixing stage includes a second input that receives a phase inverted representation of the input signal from a second common node of the mixing stage, a second local oscillator input that receives the local oscillator signal, and a second modulation signal output adapted to provide a second modulated signal. A current generation circuit provides a supply current to the first common node and to the second common node. A current control circuit is adapted to superimpose an offset current to the current of at least one node of the first common node and the second common node.

Abstract: A semiconductor device includes a semiconductor chip and a redistribution layer on a first side of the semiconductor chip. The redistribution layer is electrically coupled to the semiconductor chip. The semiconductor device includes a dielectric layer and an antenna on the dielectric layer. The dielectric layer is between the antenna and the semiconductor chip.

Abstract: According to an embodiment, a wearable device includes a frame, a first circuit board within the frame, and a display over and coupled to the first circuit board. The wearable device further includes a second circuit board electrically coupled to the first circuit board, and a mm-wave gesture sensing system mounted on the second circuit board.

Abstract: An embodiment method for signal path measurement includes providing a first signal at a common node coupled to a plurality of signal paths that each include a respective phase rotation circuit. The method also includes providing a second signal, over a first test path, to a first node coupled to a first signal path of the plurality of signal paths, providing the second signal, over a second test path, to a second node coupled to a second signal path of the plurality of signal paths, selecting a signal path from the plurality of signal paths, transmitting, over the selected signal path, one of the first signal and the second signal, and mixing the first signal with the second signal to obtain a measurement signal of the selected signal path. A difference in phase delay between the second test path and the first test path includes a first known phase delay.

Abstract: In accordance with an embodiment, a Radio Frequency (RF) front end system includes a first chip that includes a frequency multiplier coupled to a first input terminal. The frequency multiplier is configured to form an upscaled reference signal by upscaling in frequency an oscillating reference signal received at the first input terminal. The first chip also includes a Voltage-Controlled Oscillator (VCO) configured to provide a first oscillating VCO signal, and an oscillator switch coupled to the VCO and the frequency multiplier. The oscillator switch is configured to select a Local Oscillator (LO) signal from between the first oscillating VCO signal and the upscaled reference signal. The first chip also includes a first phase shifter coupled to an output of the oscillator switch, and a modulator having an input coupled to an output of the first phase shifter.

Abstract: A mixing stage includes a first modulation stage that receives an input signal from a first common node of the mixing stage, a first local oscillator input that receives a local oscillator signal, and a first modulation signal output adapted to provide a first modulated signal. A second modulation stage of the mixing stage includes a second input that receives a phase inverted representation of the input signal from a second common node of the mixing stage, a second local oscillator input that receives the local oscillator signal, and a second modulation signal output adapted to provide a second modulated signal. A current generation circuit provides a supply current to the first common node and to the second common node. A current control circuit is adapted to superimpose an offset current to the current of at least one node of the first common node and the second common node.

Abstract: An electronic system includes a carrier including at least one waveguide feeding, a semiconductor chip including a first surface and a second surface, and an integrated RF circuit, and a cooling element including a backshort. The semiconductor chip is mounted to the carrier such that the first surface faces the carrier. The integrated RF circuit is connected to the at least one waveguide feeding. The cooling element is mounted to the carrier such that the backshort is adjacent one end of the at least one waveguide feeding, and the cooling element at least partially covers the semiconductor chip such that the second surface of the semiconductor chip faces the cooling element.

Abstract: A semiconductor package includes a semiconductor die, an antenna embedded in insulating material contacting a first main side of the semiconductor die and electrically connected to a first pad of the semiconductor die and a coupling structure embedded in the insulating material, electrically connected to a second pad of the semiconductor die and spaced from the antenna. The coupling structure is configured to sense energy radiated from the antenna or a feedline connected to the antenna. The semiconductor die includes a transmitter circuit operable to drive a signal onto the antenna through the feedline. The semiconductor die also includes a transmit path verification circuit operable to indicate if the antenna is electrically connected to the first pad of the semiconductor die based on a signal from the coupling structure that corresponds to the energy sensed by the coupling structure.

Abstract: In accordance with an embodiment, a voltage controlled oscillator (VCO) includes a VCO core having a plurality of transistors and a varactor circuit that has a first end coupled to emitter terminals of the VCO core and a second end coupled to a tuning terminal. The varactor circuit includes a capacitance that increases with increasing voltage applied to the tuning terminal with respect to the emitter terminals of the VCO core.

Abstract: In accordance with an embodiment, a voltage controlled oscillator (VCO) includes a VCO core having a plurality of transistors, a bias resistor coupled between collector terminals of the VCO core and a first supply node, and a varactor circuit coupled to emitter terminals of the VCO core. The bias resistor is configured to limit a self-bias condition of the VCO core.

Abstract: In accordance with an embodiment, a Radio Frequency (RF) front end system includes a first chip that includes a frequency multiplier coupled to a first input terminal. The frequency multiplier is configured to form an upscaled reference signal by upscaling in frequency an oscillating reference signal received at the first input terminal. The first chip also includes a Voltage-Controlled Oscillator (VCO) configured to provide a first oscillating VCO signal, and an oscillator switch coupled to the VCO and the frequency multiplier. The oscillator switch is configured to select a Local Oscillator (LO) signal from between the first oscillating VCO signal and the upscaled reference signal. The first chip also includes a first phase shifter coupled to an output of the oscillator switch, and a modulator having an input coupled to an output of the first phase shifter.

Abstract: A receiver circuit, comprises an input balun circuit comprising a balanced balun output and being capable of receiving RF signals, an input amplification circuit comprising a balanced amplifier input and a balanced amplifier output, a single balanced in-phase mixing circuit comprising a first unbalanced RF mixer input and a balanced in-phase mixing frequency input, and a single balanced quadrature mixing circuit comprising a second unbalanced RF mixer input and a balanced quadrature mixing frequency input. The balanced amplifier input is connected to the balanced balun output, a first terminal of the balanced amplifier output is connected to provide an amplified RF signal to the first unbalanced RF mixer input and a second terminal of the balanced amplifier output is connected to provide a phase-shifted amplified RF signal to the second unbalanced RF mixer input.

Abstract: A mixing stage includes a first modulation stage that receives an input signal from a first common node of the mixing stage, a first local oscillator input that receives a local oscillator signal, and a first modulation signal output adapted to provide a first modulated signal. A second modulation stage of the mixing stage includes a second input that receives a phase inverted representation of the input signal from a second common node of the mixing stage, a second local oscillator input that receives the local oscillator signal, and a second modulation signal output adapted to provide a second modulated signal. A current generation circuit provides a supply current to the first common node and to the second common node. A current control circuit is adapted to superimpose an offset current to the current of at least one node of the first common node and the second common node.

Abstract: In accordance with an embodiment, a packaged radio frequency (RF) circuit includes a radio frequency integrated circuit (RFIC) disposed on a substrate that has plurality of receiver circuits coupled to receive ports at a first edge of the RFIC, and a first transmit circuit coupled to a first transmit port at a second edge of the RFIC. The packaged RF circuit also includes a receive antenna system disposed on the package substrate adjacent to the first edge of the RFIC and a first transmit antenna disposed on the package substrate adjacent to the second edge of the RFIC and electrically coupled to the first transmit port of the RFIC. The receive antenna system includes a plurality of receive antenna elements that are each electrically coupled to a corresponding receive port.