Abstract: A method of operating a radar system includes transmitting a plurality of transmitted radio frequency (RF) signals by a plurality of directional antennas. The plurality of directional antennas is disposed on a planar surface of a substrate. Each of the plurality of antennas is in a fixed orientation and position on the planar surface. A respective individual coverage of each of the plurality of directional antennas is less than 360°. A combined coverage of the plurality of transmitted RF signals completely covers a 360° region surrounding the radar system. The method also includes receiving a reflected RF signal by a directional antenna of the plurality of directional antennas.

Abstract: A semiconductor device includes a semiconductor chip and a redistribution layer on a first side of the semiconductor chip. The redistribution layer is electrically coupled to the semiconductor chip. The semiconductor device includes a dielectric layer and an antenna on the dielectric layer. The dielectric layer is between the antenna and the semiconductor chip.

Abstract: In an embodiment, a method for writing to a set of serial peripheral interface (SPI) slaves coupled to an SPI bus includes: disabling master in slave out (MISO) drivers of the set of SPI slaves using the SPI bus; after disabling the MISO drivers, setting respective slave selection terminals of the set of SPI slaves to an active state; and after setting the respective slave selection terminals of the set of SPI slaves to the active state, simultaneously writing data to the set of SPI slaves using a master out slave in (MOSI) line.

Abstract: A test assembly for testing an antenna-in-package (AiP) device includes a socket over a circuit board, where the socket includes an opening for receiving the AiP device; a plunger configured to move along sidewalls of the opening, where during testing of the AiP device, the plunger is configured to cause the AiP device to be pressed towards the circuit board such that the AiP device is operatively coupled to the circuit board via input/output connections of the AiP device and of the circuit board; and a loadboard disposed within the socket and between the plunger and the AiP device, where the loadboard includes a coupling structure configured to be electromagnetically coupled to a transmit antenna and to a receive antenna of the AiP device, so that testing signals transmitted by the transmit antenna are conveyed to the receive antenna externally relative to the AiP device through the coupling structure.

Abstract: A semiconductor device includes: a dielectric substrate; an integrated circuit (IC) die disposed inside an opening of the dielectric substrate, where the IC die is configured to transmit or receive radio frequency (RF) signals; a dielectric material in the opening of the dielectric substrate and around the IC die; a redistribution structure along a first side of the dielectric substrate, where a first conductive feature of the redistribution structure is electrically coupled to the IC die; a second conductive feature along a second side of the dielectric substrate opposing the first side; a via extending through the dielectric substrate, where the via electrically couples the first conductive feature and the second conductive feature; and an antenna at the second side of the dielectric substrate, where the second conductive feature is electrically or electromagnetically coupled to the antenna.

Abstract: A test assembly for testing an antenna-in-package (AiP) device includes a socket over a circuit board, where the socket includes an opening for receiving the AiP device; a plunger configured to move along sidewalls of the opening, where during testing of the AiP device, the plunger is configured to cause the AiP device to be pressed towards the circuit board such that the AiP device is operatively coupled to the circuit board via input/output connections of the AiP device and of the circuit board; and a loadboard disposed within the socket and between the plunger and the AiP device, where the loadboard includes a coupling structure configured to be electromagnetically coupled to a transmit antenna and to a receive antenna of the AiP device, so that testing signals transmitted by the transmit antenna are conveyed to the receive antenna externally relative to the AiP device through the coupling structure.

Abstract: In an embodiment, a method includes: receiving a global trigger with a first millimeter-wave radar; receiving the global trigger with a second millimeter-wave radar; generating a first internal trigger of the first millimeter-wave radar after a first offset duration from the global trigger; generating a second internal trigger of the second millimeter-wave radar after a second offset duration from the global trigger; start transmitting first millimeter-wave radar signals with the first millimeter-wave radar based on the first internal trigger; and start transmitting second millimeter-wave radar signals with the second millimeter-wave radar based on the second internal trigger, where the second offset duration is different from the first offset duration, and where the first and second millimeter-wave radar signals are transmitted sequentially so as to exhibit no temporal overlap.

Abstract: In an embodiment, a method for writing to a set of serial peripheral interface (SPI) slaves coupled to an SPI bus includes: disabling master in slave out (MISO) drivers of the set of SPI slaves using the SPI bus; after disabling the MISO drivers, setting respective slave selection terminals of the set of SPI slaves to an active state; and after setting the respective slave selection terminals of the set of SPI slaves to the active state, simultaneously writing data to the set of SPI slaves using a master out slave in (MOSI) line.

Abstract: In accordance with an embodiment, a method includes: receiving, by an adjustable frequency doubling circuit, a first clock signal having a first clock frequency; using the adjustable frequency doubling circuit, generating a second clock signal having a second clock frequency that is twice the first clock frequency; measuring a duty cycle parameter of the second clock signal, where the duty cycle parameter is dependent on a duty cycle of the first clock signal or a duty cycle of the second clock signal; and using the adjustable frequency doubling circuit, adjusting the duty cycle of the first clock signal or the second clock signal based on the measuring.

Abstract: A method of forming a radar system includes forming a first receive antenna and a first ground plane region by patterning a first conductive layer on a first surface of a first laminate layer of a radar package, forming a transmit antenna and a second ground plane region by patterning a second conductive layer on a second surface of the first laminate layer, forming a second laminate layer of the radar package over the second conductive layer, forming a third conductive layer over the second laminate layer, forming a second receive antenna by patterning the third conductive layer, and attaching a radio frequency integrated circuit chip to the radar package. The radio frequency integrated circuit chip is coupled to the transmit antenna, the first receive antenna, and the second receive antenna. The second surface is opposite the first surface.

Abstract: A semiconductor device includes a substrate comprising an antenna and a conductive feature; an integrated circuit (IC) die attached to the substrate and comprising a radio frequency (RF) circuit; and a flexible circuit integrated with the substrate, where the flexible circuit is electrically coupled to the IC die and the substrate, a first portion of the flexible circuit being disposed between opposing sidewalls of the substrate, a second portion of the flexible circuit extending beyond the opposing sidewalls of the substrate, the second portion of the flexible circuit comprising an electrical connector at a distal end.

Abstract: In accordance with some embodiments, a method is provided. The method includes accessing a predefined numeric sequence at an application processor. The method further includes receiving, from a sensor of the sensor system, a verification sequence having a predetermined quantity of repetitions of the predefined numeric sequence. The method further includes correlating the verification sequence with the predefined numeric sequence. The method further includes counting a quantity of correlations between the predefined numeric sequence and the verification sequence. The method further includes adjusting a parameter of the sensor or the application processor in response to the predetermined quantity of repetitions not equaling the quantity of correlations.

Abstract: A radar system includes a substrate that includes a first surface and a second surface. The first surface is opposite the second surface. The radar system further includes transmitter front-end circuitry attached to the substrate and configured to transmit a transmitted radio frequency (RF) signal in a first direction away from the first surface and in a second direction away from the second surface. The radar system also includes a first receive antenna and a second receive antenna. The first receive antenna is disposed at the first surface and is configured to receive a first reflected RF signal propagating in the second direction and generated by the transmitted RF signal. The second receive antenna is disposed at the second surface and is configured to receive a second reflect RF signal propagating in the first direction and generated by the transmitted RF signal.

Abstract: A test assembly for testing an antenna-in-package (AiP) device includes a socket over a circuit board, where the socket includes an opening for receiving the AiP device; a plunger configured to move along sidewalls of the opening, where during testing of the AiP device, the plunger is configured to cause the AiP device to be pressed towards the circuit board such that the AiP device is operatively coupled to the circuit board via input/output connections of the AiP device and of the circuit board; and a loadboard disposed within the socket and between the plunger and the AiP device, where the loadboard includes a coupling structure configured to be electromagnetically coupled to a transmit antenna and to a receive antenna of the AiP device, so that testing signals transmitted by the transmit antenna are conveyed to the receive antenna externally relative to the AiP device through the coupling structure.

Abstract: In accordance with an embodiment, a method includes: receiving, by an adjustable frequency doubling circuit, a first clock signal having a first clock frequency; using the adjustable frequency doubling circuit, generating a second clock signal having a second clock frequency that is twice the first clock frequency; measuring a duty cycle parameter of the second clock signal, where the duty cycle parameter is dependent on a duty cycle of the first clock signal or a duty cycle of the second clock signal; and using the adjustable frequency doubling circuit, adjusting the duty cycle of the first clock signal or the second clock signal based on the measuring.

Abstract: A method for operating a mobile device includes detecting a gesture by the mobile device. Detecting the gesture includes receiving a reflected millimeter wave signal by the mobile device, generating a first message in accordance with the detected gesture, and transmitting the first message from the mobile device to an external remote device. The detected gesture is associated with an operation of the remote device.

Abstract: A device includes a frame, a first circuit board within the frame, and a display over and coupled to the first circuit board. The device further includes a second circuit board electrically coupled to the first circuit board, and a mm-wave gesture sensing system mounted on the second circuit board.

Abstract: A radio frequency (RF) device includes a display screen and a flexible substrate. The display screen is configured to transmit visible light at a first side of the display screen. The flexible substrate includes a first portion overlapping the first side, and a second portion overlapping an opposite second side of the display screen. The RF device further includes a plurality of antennas disposed over the first portion of the flexible substrate and the first side, and a transmission line disposed on a bent region of the flexible substrate between the first and second portions. The plurality of antennas is configured to transmit/receive RF signals on the first side of the display screen. The display screen is opaque to the RF signals. The transmission line is configured to propagate the RF signals between the first portion and the second portion on the opposite second side of the display screen.

Abstract: In accordance with an embodiment, a method of operating a radar system includes receiving radar configuration data from a host, and receiving a start command from the host after receiving the radar configuration data. The radar configuration data includes chirp parameters and frame sequence settings. After receiving the start command, configuring a frequency generation circuit is configured with the chirp parameters and radar frames are triggered at a preselected rate.

Abstract: A device includes a frame, a first circuit board within the frame, and a display over and coupled to the first circuit board. The device further includes a second circuit board electrically coupled to the first circuit board, and a mm-wave gesture sensing system mounted on the second circuit board.