Abstract: A heat insulation panel includes a plate-shaped vacuum heat-insulation material embedded in a board-shaped resin foam. When the heat insulation panel is brought into abutment with another heat insulation panel of same dimensions and structure at proximal edges thereof, the vacuum heat-insulation materials in the respective heat insulation panels are in a relationship that the vacuum heat-insulation materials overlap with each other at their proximal end portions as viewed in a thickness direction of the heat insulation panels. The heat insulation panel is economical and is excellent in heat insulating properties, handling, installation and the like. A heat insulation structure making use of a plurality of such heat insulation panels is also provided.