HEAT INSULATING PANEL AND HEAT INSULATING STRUCTURE
A heat insulation panel includes a plate-shaped vacuum heat-insulation material embedded in a board-shaped resin foam. When the heat insulation panel is brought into abutment with another heat insulation panel of same dimensions and structure at proximal edges thereof, the vacuum heat-insulation materials in the respective heat insulation panels are in a relationship that the vacuum heat-insulation materials overlap with each other at their proximal end portions as viewed in a thickness direction of the heat insulation panels. The heat insulation panel is economical and is excellent in heat insulating properties, handling, installation and the like. A heat insulation structure making use of a plurality of such heat insulation panels is also provided.
This application is a U.S. national phase filing under 35 U.S.C. §371 of PCT Application No. PCT/JP2008/071498, filed Nov. 27, 2008, which claims priority to Japanese Patent Application No. 2007-306419 filed on Nov. 27, 2007, the entire disclosures of which being incorporated herein, and to which all priority rights are hereby claimed.
TECHNICAL FIELDThis invention relates to a heat insulation panel and a heat insulation structure, and specifically to a heat insulation panel, which is economical and is excellent in heat insulating properties, handling, installation and the like, and also to a heat insulation structure making use of a plurality of such heat insulation panels.
BACKGROUND ARTDiversified heat insulation materials have been used to date in various walls, ceilings, floors and roofs of a wide range of buildings to heighten air-conditioning effects. As these heat insulation materials, resin foams such as polyethylene foams and polyurethane foams are widely used from the standpoints of moldability and cost. A variety of heat insulation materials are also used in various cool boxes, insulated trucks or vans, refrigerators, vehicles and the like to improve thermal insulation effects or air-conditioning effects. As it is essential for these heat insulation materials to have a small thickness, so-called vacuum heat-insulation materials are used. To further improve heat insulating effects, composite heat insulation materials with vacuum heat-insulation materials encapsulated therein are also used (Patent Document 1).
Patent Document 1: JP-A-2004-278632 DISCLOSURE OF THE INVENTION Problem to be Solved by the InventionAs illustrated in
It may also be contemplated to lap-joint vacuum heat-insulation materials together. It is, however, not easy to manufacture lap-joint vacuum heat-insulation materials. A panel may be assembled by jointing vacuum heat-insulation materials together. However, such a panel may itself be unable to retain sufficient rigidity unless adhesion is sufficient at the joints.
Aspects of the present invention are, therefore, to provide a heat insulation panel, which is economical and is excellent in heat insulating properties, handling, installation and the like, and also a heat insulation structure making use of a plurality of such heat insulation panels.
Means for Solving the ProblemThe above-described aspects can be achieved by the present invention to be described hereinafter. Described specifically, the present invention provides a heat insulation panel with a plate-shaped vacuum heat-insulation material embedded in a board-shaped resin foam, wherein, when the heat insulation panel is brought into abutment with another heat insulation panel of same dimensions and structure at proximal edges thereof, the vacuum heat-insulation materials in the respective heat insulation panels are in a relationship that the vacuum heat-insulation materials overlap with each other at proximal end portions thereof as viewed in a thickness direction of the heat insulation panels.
In the present invention, it is preferred that an overlap width of the vacuum heat-insulation materials themselves, which are in the mutually-overlapping relationship, is from 5 to 80 mm as viewed in a width direction of the heat insulation panels; that the board-shaped resin foam is composed of two rectangular resin foams of same dimensions overlapping one over the other and changed in position relative to each other in a length direction and/or width direction thereof, and the two rectangular resin foams are provided with plate-shaped vacuum heat-insulation materials encapsulated therein, respectively; or that the board-shaped resin foam is composed of two rectangular resin foams of different lengths and/or widths overlapping one over the other with centerlines thereof coincided with each other, and larger one of the two rectangular resin foams is provided with the plate-shaped vacuum heat-insulation material encapsulated therein.
The present invention also provides a heat insulation structure comprising a plurality of heat insulation panels according to the present invention, wherein the heat insulation panels are arranged in abutment with each other at proximal edges thereof such that plate-shaped vacuum heat-insulation materials thereof overlap with each other at proximal end portions thereof as viewed in a thickness direction of the heat insulation panels.
ADVANTAGEOUS EFFECTS OF THE INVENTIONAccording to the present invention, it is possible to provide a heat insulation panel, which is economical and is excellent in heat insulating properties, handling, installation and the like, and also a heat insulation structure making use of a plurality of such heat insulation panels.
BEST MODE FOR CARRYING OUT THE INVENTIONBased on preferred embodiments shown in drawings, the present invention will next be described in further detail.
As shown in
In the heat insulation panel 10 shown in
As illustrated in
In the heat insulation panel 10 illustrated in
When a plurality of such heat insulation panels 10 according to the present invention are installed in abutment with each other on a wall surface or the like for heat insulation purposes as shown in
The above-described resin foams may each be a foam of any resin, with a polyurethane-based foam being preferred from the standpoint of moldability. A polyurethane foam can be obtained in a desired shape by mixing a polyol component, a polyisocyanate component and a foaming agent, pouring the mixture into a mold cavity of the desired shape, and then subjecting the mixture to expansion molding. From the standpoint of a balance between heat insulating properties and strength, the expansion ratio of the foam may preferably be from 5 to 50 times or so.
Each vacuum heat-insulation material for use in the present invention is a heat insulation material that a core material formed of laminated glass fibers is encapsulated in a barrier envelope and the barrier envelope is depressurized. Such a vacuum heat-insulation material itself is known, and any known vacuum heat-insulation material can be used in the present invention. A preferred vacuum heat insulation material may include, as an envelope, at least one metallized layer as in an aluminum-metallized polyethylene film. The inclusion of such a metallized layer can provide improved heat insulating properties (heat shielding properties) especially in summer. The vacuum heat-insulation material may generally be from 3 to 20 mm or so in thickness and from 190 to 1,300 mm×190 to 1,300 mm or so in size.
No particular limitation is imposed on a process for the formation of the above-described heat insulation panels according to the present invention, each of which is composed of the resin foams and the vacuum heat-insulation material or materials. As a preferred example, however, the following process can be mentioned. In the case of the embodiment shown in
On the other hand, the heat insulation panel 10 illustrated in
A description will next be made about the sizes of the heat insulation panels 10 according to the present invention. In the heat insulation panel 10 shown in
Its thickness (H) may be from 30 to 100 mm or so, and its indentation (a) may be from 10 to 110 mm or so, with from 40 to 90 mm being preferred. The width (b) of the upper or lower half in the whole heat insulation panel may be from 350 to 1,450 mm or so, and the thickness (c) of the upper or lower half may be from 15 to 50 mm or so. Each vacuum heat-insulation material 2 has a length similar to the above-described length (L) of the foam, and its thickness and size are similar to those described above. The distance (d) between an end edge of each vacuum heat-insulation material 2 and a proximal end edge of its corresponding resin foam 1 may be from 3 to 20 mm or so.
In the heat insulation panel illustrated in
The overlap widths α′,α of the upper and lower, vacuum heat-insulation materials 2 may each be 5 mm or greater, preferably from 30 to 80 mm. An overlap width smaller than 5 mm leads not only to difficulty in holding panels in abutment with each other but also to inferior thermal performance. An overlap width greater than 80 mm, on the other hand, results in a reduction in the strength of the edge portion of each panel. The inter-layer spacing (e) between the vacuum heat-insulation materials may preferably be 6 mm or greater for excellent heat insulating properties, with from 20 to 50 mm being more preferred.
Such heat insulation panels according to the present invention as described above are useful as heat insulation materials for various walls, ceilings, floors and roofs in a wide range of buildings and also as heat insulation materials for various cool boxes, insulated trucks or vans, refrigerators, vehicles and the like, and have excellent heat insulating properties and installation convenience.
EXAMPLESBased on examples and comparative examples, the present invention will next be described specifically.
Examples 1-6Heat insulation panels, each of which had the construction of the embodiment shown in
Heat insulation panels, each of which had the construction of the embodiment shown in
As examples of abutment of heat insulation panels, which are similar to that shown in
In each of the above-described examples and comparative examples, two of the heat insulation panels were brought into abutment with each other, the temperature was controlled at a high temperature (20° C.) on one side and at a low temperature (0° C.) on the other side. The heat flow rate was evaluated by heat flowmeters on the low-temperature surfaces of an abutting portion (50×50 mm) and a central portion (50×50 mm) of one of the heat insulation panels to determine the heat transmission coefficients. The evaluation results are presented in Tables 1-1 to 1-3.
According to the present invention as described above, it is possible to provide a heat insulation panel, which is economical and is excellent in heat insulating properties, handling, installation and the like, and also a heat insulation structure making use of a plurality of such heat insulation panels.
BRIEF DESCRIPTION OF THE DRAWINGS
- A(1,1′) Resin foam
- 2,2′ Vacuum heat-insulation material
- 10 Heat insulation panel
- 20 Heat insulation panel member
Claims
1. A heat insulation panel with a plate-shaped vacuum heat-insulation material embedded in a board-shaped resin foam, wherein, when the heat insulation panel is brought into abutment with another heat insulation panel of same dimensions and structure at proximal edges thereof, the vacuum heat-insulation materials in the respective heat insulation panels are in a relationship that the vacuum heat-insulation materials overlap with each other at proximal end portions thereof as viewed in a thickness direction of the heat insulation panels.
2. The heat insulation panel according to claim 1, wherein an overlap width of the vacuum heat-insulation materials themselves, which are in the mutually-overlapping relationship, is from 5 to 80 mm as viewed in a width direction of the heat insulation panels.
3. The heat insulation panel according to claim 1, wherein the board-shaped resin foam is composed of two rectangular resin foams of same dimensions overlapping one over the other and changed in position relative to each other in a length direction and/or width direction thereof, and the two rectangular resin foams are provided with plate-shaped vacuum heat-insulation materials encapsulated therein, respectively.
4. The heat insulation panel according to claim 1, wherein the board-shaped resin foam is composed of two rectangular resin foams of different lengths and/or widths overlapping one over the other with centerlines thereof coincided with each other, and larger one of the two rectangular resin foams is provided with the plate-shaped vacuum heat-insulation material encapsulated therein.
5. A heat insulation structure comprising a plurality of heat insulation panels as defined in claim 1, wherein the heat insulation panels are arranged in abutment with each other at proximal edges thereof such that plate-shaped vacuum heat-insulation materials thereof overlap with each other at proximal end portions thereof as viewed in a thickness direction of the heat insulation panels.
Type: Application
Filed: Nov 27, 2008
Publication Date: Nov 11, 2010
Inventors: Sayaka Takei (Tokyo), Yoji Nunoi (Tokyo)
Application Number: 12/743,235
International Classification: E04C 2/20 (20060101); E04C 2/38 (20060101);