Patents by Inventor Scott A. Denenberg
Scott A. Denenberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240255323Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.Type: ApplicationFiled: December 11, 2023Publication date: August 1, 2024Applicant: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark Windoloski
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Patent number: 11959880Abstract: System and method for characterizing material condition. The system includes a sensor, impedance instrument and processing unit to collect measurements and assess material properties. A model of the system may be used to enable accurate measurements of multiple material properties. A cylindrical model for an electromagnetic field sensor is disclosed for modeling substantially cylindrically symmetric material systems. Sensor designs and data processing approaches are provided to focus the sensitivity of the sensor to localize material conditions. Improved calibration methods are shown. Sizing algorithms are provided to estimate the size of defects such as cracks and corrosion. Corrective measures are provided where the actual material configuration differs from the data processing assumptions. Methods are provided for use of the system to characterize material condition, and detailed illustration is given for corrosion, stress, weld, heat treat, and mechanical damage assessment.Type: GrantFiled: August 16, 2021Date of Patent: April 16, 2024Assignee: JENTEK Sensors, Inc.Inventors: Scott A Denenberg, Yanko K Sheiretov, Neil J Goldfine, Todd M Dunford, Andrew P Washabaugh, Don Straney, Brian L Manning
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Patent number: 11841245Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.Type: GrantFiled: January 6, 2023Date of Patent: December 12, 2023Assignee: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark Windoloski
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Publication number: 20230160728Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.Type: ApplicationFiled: January 6, 2023Publication date: May 25, 2023Applicant: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark Windoloski
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Patent number: 11549831Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.Type: GrantFiled: September 16, 2019Date of Patent: January 10, 2023Assignee: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark Windoloski
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Publication number: 20220373367Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.Type: ApplicationFiled: September 16, 2019Publication date: November 24, 2022Applicant: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark Windoloski
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Publication number: 20210372968Abstract: System and method for characterizing material condition. The system includes a sensor, impedance instrument and processing unit to collect measurements and assess material properties. A model of the system may be used to enable accurate measurements of multiple material properties. A cylindrical model for an electromagnetic field sensor is disclosed for modeling substantially cylindrically symmetric material systems. Sensor designs and data processing approaches are provided to focus the sensitivity of the sensor to localize material conditions. Improved calibration methods are shown. Sizing algorithms are provided to estimate the size of defects such as cracks and corrosion. Corrective measures are provided where the actual material configuration differs from the data processing assumptions. Methods are provided for use of the system to characterize material condition, and detailed illustration is given for corrosion, stress, weld, heat treat, and mechanical damage assessment.Type: ApplicationFiled: August 16, 2021Publication date: December 2, 2021Applicant: JENTEK Sensors, Inc.Inventors: Scott A. Denenberg, Yanko K. Sheiretov, Neil J. Goldfine, Todd M. Dunford, Andrew P. Washabaugh, Don Straney, Brian L. Manning
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Patent number: 11092571Abstract: System and method for characterizing material condition. The system includes a sensor, impedance instrument and processing unit to collect measurements and assess material properties. A model of the system may be used to enable accurate measurements of multiple material properties. A cylindrical model for an electromagnetic field sensor is disclosed for modeling substantially cylindrically symmetric material systems. Sensor designs and data processing approaches are provided to focus the sensitivity of the sensor to localize material conditions. Improved calibration methods are shown. Sizing algorithms are provided to estimate the size of defects such as cracks and corrosion. Corrective measures are provided where the actual material configuration differs from the data processing assumptions. Methods are provided for use of the system to characterize material condition, and detailed illustration is given for corrosion, stress, weld, heat treat, and mechanical damage assessment.Type: GrantFiled: June 6, 2019Date of Patent: August 17, 2021Assignee: JENTEK Sensors, Inc.Inventors: Scott A Denenberg, Yanko K Sheiretov, Neil J Goldfine, Don Straney
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Publication number: 20210080297Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.Type: ApplicationFiled: September 16, 2019Publication date: March 18, 2021Applicant: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark Windoloski
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Patent number: 10732096Abstract: Detection of corrosion and other defects in piping is needed to prevent catastrophic pipeline failure. Sensors, systems and methods are provided to enable detection of such defects. These apparatus and methods are configured to characterize pipe protected by insulation and conductive weather protection. The sensors may utilize inductive and/or solid state sensing element arrays operated in a magnetic field generated in part by a drive winding of the sensor. Multiple excitation frequencies are used to generate the magnetic field and record corresponding sensing element responses. Relatively high excitation frequencies may be used to estimate the properties of the weather protection and sensor lift-off while lower frequencies may be used to detect internal and external pipe damage. Linear arrays may be moved to generate damage images of the pipe providing size and location information for defects. Two dimensional sensor arrays may be used to provide imaging without moving the sensor.Type: GrantFiled: November 16, 2017Date of Patent: August 4, 2020Assignee: JENTEK Sensors, Inc.Inventors: Scott A. Denenberg, Todd M. Dunford, Neil J. Goldfine, Yanko K. Sheiretov
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Patent number: 10677756Abstract: A sensor system has an integrated sensor cartridge, and instrument, and an instrument side connector. The integrated sensor cartridge has a mechanical support, a flexible sensor array, and a rigid connector. The mechanical support is shaped to facilitate sensor measurements on a test object. The rigid connector has a mechanical connection and an electrical connection for simultaneous electrical and mechanical mating of the sensor cartridge to the instrument side connector. The flexible array has a connecting portion, a lead portion, and a sensing portion. The sensing portion is attached to the mechanical support, and the connecting portion interfaces with the rigid connector. The connecting portion may form the electrical connection of the rigid connector or may simply mate internally with the electrical connection. The instrument side connector is connected to the instrument which measures the response of the flexible sensor array.Type: GrantFiled: May 31, 2016Date of Patent: June 9, 2020Assignee: JENTEK SENSORS, INC.Inventors: Neil J Goldfine, Yanko K Sheiretov, Scott A Denenberg, Karen Walrath, Todd M Dunford, Kevin P Dixon, Christopher T Martin
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Publication number: 20190323992Abstract: System and method for characterizing material condition. The system includes a sensor, impedance instrument and processing unit to collect measurements and assess material properties. A model of the system may be used to enable accurate measurements of multiple material properties. A cylindrical model for an electromagnetic field sensor is disclosed for modeling substantially cylindrically symmetric material systems. Sensor designs and and data processing approaches are provided to focus the sensitivity of the sensor to localize material conditions. Improved calibration methods are shown. Sizing algorithms are provided to estimate the size of defects such as cracks and corrosion. Corrective measures are provided where the actual material configuration differs from the data processing assumptions. Methods are provided for use of the system to characterize material condition, and detailed illustration is given for corrosion, stress, weld, heat treat, and mechanical damage assessment.Type: ApplicationFiled: June 6, 2019Publication date: October 24, 2019Applicant: JENTEK Sensors, Inc.Inventors: Scott A. Denenberg, Yanko K. Sheiretov, Neil J. Goldfine, Don Straney
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Patent number: 10416118Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.Type: GrantFiled: May 12, 2017Date of Patent: September 17, 2019Assignee: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark D Windoloski
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Patent number: 10324062Abstract: System and method for characterizing material condition. The system includes a sensor, impedance instrument and processing unit to collect measurements and assess material properties. A model of the system may be used to enable accurate measurements of multiple material properties. A cylindrical model for an electromagnetic field sensor is disclosed for modeling substantially cylindrically symmetric material systems. Sensor designs and data processing approaches are provided to focus the sensitivity of the sensor to localize material conditions. Improved calibration methods are shown. Sizing algorithms are provided to estimate the size of defects such as cracks and corrosion. Corrective measures are provided where the actual material configuration differs from the data processing assumptions. Methods are provided for use of the system to characterize material condition, and detailed illustration is given for corrosion, stress, weld, heat treat, and mechanical damage assessment.Type: GrantFiled: October 22, 2014Date of Patent: June 18, 2019Assignee: JENTEK Sensors, Inc.Inventors: Scott A Denenberg, Yanko K Sheiretov, Neil J Goldfine, Don Straney, Leon B Kristal
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Publication number: 20180209894Abstract: Detection of corrosion and other defects in piping is needed to prevent catastrophic pipeline failure. Sensors, systems and methods are provided to enable detection of such defects. These apparatus and methods are configured to characterize pipe protected by insulation and conductive weather protection. The sensors may utilize inductive and/or solid state sensing element arrays operated in a magnetic field generated in part by a drive winding of the sensor. Multiple excitation frequencies are used to generate the magnetic field and record corresponding sensing element responses. Relatively high excitation frequencies may be used to estimate the properties of the weather protection and sensor lift-off while lower frequencies may be used to detect internal and external pipe damage. Linear arrays may be moved to generate damage images of the pipe providing size and location information for defects. Two dimensional sensor arrays may be used to provide imaging without moving the sensor.Type: ApplicationFiled: November 16, 2017Publication date: July 26, 2018Inventors: Scott A. Denenberg, Todd M. Dunford, Neil J. Goldfine, Yanko K. Sheiretov
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Patent number: 9823179Abstract: Detection of corrosion and other defects in piping is needed to prevent catastrophic pipeline failure. Sensors, systems and methods are provided to enable detection of such defects. These apparatus and methods are configured to characterize pipe protected by insulation and conductive weather protection. The sensors may utilize inductive and/or solid state sensing element arrays operated in a magnetic field generated in part by a drive winding of the sensor. Multiple excitation frequencies are used to generate the magnetic field and record corresponding sensing element responses. Relatively high excitation frequencies may be used to estimate the properties of the weather protection and sensor lift-off while lower frequencies may be used to detect internal and external pipe damage. Linear arrays may be moved to generate damage images of the pipe providing size and location information for defects. Two dimensional sensor arrays may be used to provide imaging without moving the sensor.Type: GrantFiled: January 21, 2016Date of Patent: November 21, 2017Assignee: Jentek Sensors, Inc.Inventors: Scott A. Denenberg, Todd M. Dunford, Neil J. Goldfine, Yanko K. Sheiretov
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Publication number: 20160349214Abstract: A sensor system has an integrated sensor cartridge, and instrument, and an instrument side connector. The integrated sensor cartridge has a mechanical support, a flexible sensor array, and a rigid connector. The mechanical support is shaped to facilitate sensor measurements on a test object. The rigid connector has a mechanical connection and an electrical connection for simultaneous electrical and mechanical mating of the sensor cartridge to the instrument side connector. The flexible array has a connecting portion, a lead portion, and a sensing portion. The sensing portion is attached to the mechanical support, and the connecting portion interfaces with the rigid connector. The connecting portion may form the electrical connection of the rigid connector or may simply mate internally with the electrical connection. The instrument side connector is connected to the instrument which measures the response of the flexible sensor array.Type: ApplicationFiled: May 31, 2016Publication date: December 1, 2016Inventors: Neil J. Goldfine, Yanko K. Sheiretov, Scott A. Denenberg, Karen Walrath, Todd M. Dunford, Kevin P. Dixon, Christopher T. Martin
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Publication number: 20160274060Abstract: System and method for characterizing material condition. The system includes a sensor, impedance instrument and processing unit to collect measurements and assess material properties. A model of the system may be used to enable accurate measurements of multiple material properties. A cylindrical model for an electromagnetic field sensor is disclosed for modeling substantially cylindrically symmetric material systems. Sensor designs and data processing approaches are provided to focus the sensitivity of the sensor to localize material conditions. Improved calibration methods are shown. Sizing algorithms are provided to estimate the size of defects such as cracks and corrosion. Corrective measures are provided where the actual material configuration differs from the data processing assumptions. Methods are provided for use of the system to characterize material condition, and detailed illustration is given for corrosion, stress, weld, heat treat, and mechanical damage assessment.Type: ApplicationFiled: October 22, 2014Publication date: September 22, 2016Applicant: JENTEK Sensors, Inc.Inventors: Scott A Denenberg, Yanko K Sheiretov, Neil J Goldfine, Todd M Dunford, Andrew P Washabaugh, Don Straney, Brian L Manning
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Patent number: D830863Type: GrantFiled: May 11, 2017Date of Patent: October 16, 2018Inventors: Todd M Dunford, Neil J Goldfine, Stuart D Chaplan, Yanko K Sheiretov, Scott A Denenberg
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Patent number: D857534Type: GrantFiled: October 15, 2018Date of Patent: August 27, 2019Assignee: JENTEK Sensors, Inc.Inventors: Todd M Dunford, Neil J Goldfine, Stuart D Chaplan, Yanko K Sheiretov, Scott A Denenberg