Patent number: 9511585
Abstract: The present disclosure is drawn to a thermal inkjet printhead stack with an amorphous thin metal protective layer, comprising an insulated substrate, a resistor applied to the insulated substrate, a resistor passivation layer applied to the resistor, and an amorphous thin metal protective layer applied to the resistor passivation layer. The amorphous thin metal protective layer can comprise from 5 atomic % to 90 atomic % of a metalloid of carbon, silicon, or boron. The film can also include a first and second metal, each comprising from 5 atomic % to 90 atomic % of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum. The second metal is different than the first metal, and the metalloid, the first metal, and the second metal account for at least 70 atomic % of the amorphous thin metal protective layer.
Type:
Grant
Filed:
July 12, 2013
Date of Patent:
December 6, 2016
Assignee:
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventors:
James Elmer Abbott, Jr., Arun K. Agarwal, Roberto A. Pugliese, Greg Scott Long, Stephen Horvath, Douglas A. Keszler, John Wager, Kristopher Olsen, John McGlone