Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.

Abstract: A method includes determining a first task requiring one of a plurality of machines to traverse along a first route and determining a second task requiring the one of the plurality of machines to traverse along a second route. The method also includes determining a first route score for the first route, the first route score being at least in part indicative of a difficulty of traversing along the first route, and determining a second route score for the second route, the second route score being at least in part indicative of a difficulty of traversing along the second route. The method may also include receiving sensor data generated by a sensor associated with a first machine of the plurality of machines and determining, based at least in part on the sensor data, an alertness metric associated with an operator of the first machine.

Abstract: A powder quality control system includes a powder container, a piston, and at least one sensor. The powder container is configured to contain a powder sample. The piston is configured to compact the powder sample in the powder container. The at least one sensor is configured to measure at least one parameter when the piston compacts the powder sample to facilitate determining a powder quality measurement for the powder sample.

Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.

Abstract: Pixelated-LED chips and related methods are disclosed. A pixelated-LED chip includes an active layer with independently electrically accessible active layer portions arranged on or over a light-transmissive substrate. The active layer portions are configured to illuminate different light-transmissive substrate portions to form pixels. Various enhancements may beneficially provide increased contrast (i.e., reduced cross-talk between pixels) and/or promote inter-pixel illumination homogeneity, without unduly restricting light utilization efficiency. In some aspects, an underfill material with improved surface coverage is provided between adjacent pixels of a pixelated-LED chip. The underfill material may be arranged to cover all lateral surfaces between the adjacent pixels. In some aspects, discontinuous substrate portions are formed before application of underfill materials. In some aspects, a wetting layer is provided to improve wicking or flow of underfill materials during various fabrication steps.

Abstract: Pixelated-LED chips and related methods are disclosed. A pixelated-LED chip includes an active layer with independently electrically accessible active layer portions arranged on or over a light-transmissive substrate. The active layer portions are configured to illuminate different light-transmissive substrate portions to form pixels. Various enhancements may beneficially provide increased contrast (i.e., reduced cross-talk between pixels) and/or promote inter-pixel illumination homogeneity, without unduly restricting light utilization efficiency. In some aspects, an underfill material with improved surface coverage is provided between adjacent pixels of a pixelated-LED chip. The underfill material may be arranged to cover all lateral surfaces between the adjacent pixels. In some aspects, discontinuous substrate portions are formed before application of underfill materials. In some aspects, a wetting layer is provided to improve wicking or flow of underfill materials during various fabrication steps.

Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.

Abstract: Briefly, methods and/or apparatuses are described for network management via a graphical user interface (GUI).

Abstract: A non-ferromagnetic electronic circulator device and system is described. Such passive electronic circulator devices may include a plurality of ports that include a discrete arrangement of resistors, capacitors and inductors that form a fully connected S parameter matrix. Signals that enter a first port of the circulator only exit from the second port, signals entering the second port only exit from the third port, signals entering the third port only exit the fourth port, and signals entering the fourth port, only exit the first port.

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.

Abstract: Solid-state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs are disclosed. LED packages are disclosed that include an LED chip with multiple discrete active layer portions mounted on a submount. The LED packages may further include wavelength conversion elements and light-altering materials. The multiple discrete active layer portions may be electrically connected in series, parallel, or in individually addressable arrangements. The LED chip with the multiple discrete active layer portions may provide the LED package with improved brightness, improved alignment, simplified manufacturing, and reduced costs.

Abstract: Briefly, methods and/or apparatuses of virtual deployment of network-related features are disclosed.

Abstract: Pixelated-LED chips and related methods are disclosed. A pixelated-LED chip includes an active layer with independently electrically accessible active layer portions arranged on or over a light-transmissive substrate. The active layer portions are configured to illuminate different light-transmissive substrate portions to form pixels. Various enhancements may beneficially provide increased contrast (i.e., reduced cross-talk between pixels) and/or promote inter-pixel illumination homogeneity, without unduly restricting light utilization efficiency. In some aspects, a light extraction surface of each substrate portion includes protruding features and light extraction surface recesses. Lateral borders between different pixels are aligned with selected light extraction surface recesses. In some aspects, selected light extraction surface recesses extend through an entire thickness of the substrate. Other technical benefits may additionally or alternatively be achieved.

Abstract: An embedded magnetic component device includes a magnetic core located in a cavity in an insulating substrate. An electrical winding includes inner and outer conductive connectors. An inner solid bonded joint boundary is located between first and second portions of the insulating substrate and extends between the cavity and the inner conductive connectors. An outer solid bonded joint boundary is located between the first and the second portions of the insulating substrate extends between the cavity and the outer conductive connectors. The minimum distance of the inner solid bonded joint boundary between any of the inner conductive connectors and the inner interior wall of the cavity is defined as D1, and the minimum distance of the outer solid bonded joint boundary between any of the outer conductive connectors and the outer interior wall of the cavity is defined as D2. D1 and D2 are about 0.4 mm or more.

Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.

Abstract: Briefly, methods and apparatuses are described that link two or more logical broadcast domains.

Abstract: A method implemented in a computer based smartphone in communication with one or more appliances via one or more networks. The method comprises monitoring health data concerning an appliance or an appliance part. Determining that the appliance or appliance part exhibits a maintenance issue based upon the health data. Accessing a remote computer system via the computer based smartphone over an Internet. Receiving one or more suggestions on where to order, purchase, or seek repair for the appliance or appliance part from the remote computer system.

Abstract: A method of testing a multi-specimen additive manufacturing build plate includes acquiring and installing the multi-specimen build plate in a test system, aligning one or more force exertion tools with respective selected specimens, imparting a force on the selected specimen(s), collecting test data from each selected specimen, and analyzing the collected data to identify a potential correlation between material behavior for the selected specimen and its applied manufacturing build parameter(s). A system and a non-transitory medium are also disclosed.

Abstract: Methods and systems for fabricating a component include a build platform configured to receive a particulate, a consolidation device configured to consolidate the particulate to form a component, and a gas supply configured to provide a gas flow across the build platform. The additive manufacturing system also includes at least one vane positionable in a plurality of orientations relative to the gas flow. The additive manufacturing system further includes an actuator system coupled to the at least one vane and configured to move the at least one vane between the plurality of orientations. The additive manufacturing system also includes at least one sensor and a control system configured to receive information from the at least one sensor and cause the at least one vane to move between the plurality of orientations based on the information received from the at least one sensor.

Abstract: Pixelated-LED chips and related methods are disclosed. A pixelated-LED chip includes an active layer with independently electrically accessible active layer portions arranged on or over a light-transmissive substrate. The active layer portions are configured to illuminate different light-transmissive substrate portions to form pixels. Various enhancements may beneficially provide increased contrast (i.e., reduced cross-talk between pixels) and/or promote inter-pixel illumination homogeneity, without unduly restricting light utilization efficiency. In some aspects, an underfill material with improved surface coverage is provided between adjacent pixels of a pixelated-LED chip. The underfill material may be arranged to cover all lateral surfaces between the adjacent pixels. In some aspects, discontinuous substrate portions are formed before application of underfill materials. In some aspects, a wetting layer is provided to improve wicking or flow of underfill materials during various fabrication steps.