Abstract: Methods of continuous fabrication of features in flexible substrates are disclosed. In one embodiment, a method of fabricating features in a substrate web includes providing the substrate web arranged in a first spool on a first spool assembly, advancing the substrate web from the first spool and through a laser processing assembly comprising a laser, and creating a plurality of defects within the substrate web using the laser. The method further includes advancing the substrate web through an etching assembly and etching the substrate web at the etching assembly to remove glass material at the plurality of defects, thereby forming a plurality of features in the substrate web. The method further includes rolling the substrate web into a final spool.

Abstract: The optical-electrical interconnection device comprises a glass support member with front-end and back-end portions that define a plane and an aperture. A cantilever member extends from the back-end portion into the aperture. The cantilever member supports an interconnection optical waveguide. The cantilever member comprises a bend region that causes a front-end section of the cantilever member to extend out of the plane. The front-end section is flexible, which allows for the interconnection optical waveguide to be aligned and optically coupled to a device waveguide of an optical-electrical device. A photonic assembly is formed using the optical-electrical interconnection device and at least one optical-electrical device. Methods of forming optical and electrical interconnections using the optical-electrical interconnection device are also disclosed.

Abstract: Methods and apparatus are provide for an interposer for interconnecting one or more semiconductor chips with an organic substrate in a semiconductor package, the interposer including: a first glass substrate having first and second opposing major surfaces, the first glass substrate having a first coefficient of thermal expansion (CTE1); a second glass substrate having first and second opposing major surfaces, the second glass substrate having a second coefficient of thermal expansion (CTE2); and an interface disposed between the first and second glass substrates and joining the second major surface of the first glass substrate to the first major surface of the second glass substrate, where CTE1 is less than CTE2, the first major surface of the first glass substrate operates to engage the one or more semiconductor chips, and the second major surface of the second glass substrate operates to engage the organic substrate.

Abstract: Methods and apparatus are provide for an interposer for interconnecting one or more semiconductor chips with an organic substrate in a semiconductor package, the interposer including: a first glass substrate having first and second opposing major surfaces, the first glass substrate having a first coefficient of thermal expansion (CTE1); a second glass substrate having first and second opposing major surfaces, the second glass substrate having a second coefficient of thermal expansion (CTE2); and an interface disposed between the first and second glass substrates and joining the second major surface of the first glass substrate to the first major surface of the second glass substrate, where CTE1 is less than CTE2, the first major surface of the first glass substrate operates to engage the one or more semiconductor chips, and the second major surface of the second glass substrate operates to engage the organic substrate.

Abstract: Methods and apparatus are provide for an interposer for interconnecting one or more semiconductor chips with an organic substrate in a semiconductor package, the interposer including: a first glass substrate having first and second opposing major surfaces, the first glass substrate having a first coefficient of thermal expansion (CTE1); a second glass substrate having first and second opposing major surfaces, the second glass substrate having a second coefficient of thermal expansion (CTE2); and an interface disposed between the first and second glass substrates and joining the second major surface of the first glass substrate to the first major surface of the second glass substrate, where CTE1 is less than CTE2, the first major surface of the first glass substrate operates to engage the one or more semiconductor chips, and the second major surface of the second glass substrate operates to engage the organic substrate.

Abstract: Disclosed herein is a bottom-up electrolytic via plating method wherein a first carrier substrate and a second substrate having at least one through-via are temporarily bonded together. The method includes applying a seed layer on a surface of the first substrate, forming a surface modification layer on the seed layer or the second substrate, bonding the second substrate to the first substrate with the surface modification layer to create an assembly wherein the seed layer and the surface modification layer are disposed between the first and second substrates, applying conductive material to the through-via, removing the second substrate having the through-via containing conductive material from the assembly.

Abstract: Methods and apparatus are provide for an interposer for interconnecting one or more semiconductor chips with an organic substrate in a semiconductor package, the interposer including: a first glass substrate having first and second opposing major surfaces, the first glass substrate having a first coefficient of thermal expansion (CTE1); a second glass substrate having first and second opposing major surfaces, the second glass substrate having a second coefficient of thermal expansion (CTE2); and an interface disposed between the first and second glass substrates and joining the second major surface of the first glass substrate to the first major surface of the second glass substrate, where CTE1 is less than CTE2, the first major surface of the first glass substrate operates to engage the one or more semiconductor chips, and the second major surface of the second glass substrate operates to engage the organic substrate.

Abstract: A solid oxide fuel cell comprising a thin ceramic electrolyte sheet having an increased street width is disclosed. Also disclosed are solid oxide fuel cells comprising: a substantially flat ceramic electrolyte sheet, a substantially flat ceramic electrolyte sheet having a seal area of greater thickness than the active area of the electrolyte sheet, a ceramic electrolyte sheet that overhangs the seal area, a ceramic electrolyte sheet and at least one substantially flat border material, and a border material having a non-linear edge. Methods of making a solid oxide fuel cell in accordance with the disclosed embodiments are also disclosed. Also disclosed are methods of making a solid oxide fuel cell wherein the seal has a uniform thickness, wherein the seal is heated to remove a volatile component prior to sealing, and wherein the distance between the frame and the ceramic electrolyte sheet of the device is constant.

Abstract: According to one embodiment of the invention a fuel cell device array monolith comprises at least three planar electrolyte sheets having two sides. The electrolyte sheets are situated adjacent to one another. At least one of the electrolyte sheets is supporting a plurality of anodes situated on one side of the electrolyte sheet; and plurality of cathodes situated on the other side of the electrolyte sheet. The electrolyte sheets are arranged such that the electrolyte sheets with a plurality of cathodes and anodes is situated between the other electrolyte sheets. The at least three electrolyte sheets are joined together by sintered fit, with no metal frames or bipolar plates situated therebetween.

Abstract: The present invention provides structures and methods that utilize fuel reformation to assist in thermal management of a channel-less SOFC at the device cell and/or stack assembly level. At the device level, passive and/or active control of unreformed fuel, or a mixture of reformed and unreformed fuel, is used to inject fuel in a distributed manner along the anode chamber of the channel-less SOFC. The injected fuel can be controlled in its composition, pressure, velocities, and/or flow rates. Additionally, present invention provides thermal management across a plurality of fuel cells in a stack assembly by actively controlling fuel composition, pressure, velocities, and/or flow rates provided to fuel inlets of the fuel cells.

Abstract: A photoacoustic gas detector and photoacoustic gas detection method are disclosed. The detector includes a laser source, an acoustic resonator, and at least one tuning fork positioned along a longitudinal length of the resonator. The detector is capable of performing fast measurements of the concentration of one or more target gases over a broad temperature range.

Abstract: A stress reducing mounting for an electrolyte sheet assembly in a solid electrolyte fuel cell is provided that includes a support frame or manifold having an inner edge portion that supports a peripheral portion of the sheet assembly, a seal that affixes an edge of the peripheral portion to the frame or manifold, and a stress reducer disposed around the peripheral portion of the electrolyte sheet and the frame or manifold that reduces tensile stress in the peripheral portion of the electrolyte sheet when the peripheral portion is bent by pressure differentials or thermal differential expansion. The stress reducer is at least one of a convex curved surface on the inner edge portion of the frame or manifold that makes area contact with the peripheral portion when it bends in response to a pressure differential or thermal differential expansion, and a stiffening structure on the sheet peripheral portion that renders the ceramic sheet material forming the peripheral portion more resistant to bending.

Abstract: An exemplary fuel cell device assembly includes: (i) an electrolyte sheet; (ii) a plurality of cathodes disposed on one side of the electrolyte sheet; (iii) a plurality of anodes disposed on another side of the electrolyte sheet; and (iv) a frame supporting the electrolyte sheet, the frame having a plurality of channels. Preferably the cross-sectional area of the frame has channel density of at least 20/in2 and channel wall thickness of 50 mils or less.

Abstract: An exemplary method of making a fuel cell device assemblies includes the steps of: (i) providing a ceramic batch; (ii) extruding the ceramic batch through a die and a mask to form green extrudate that, in cross-section, has at least 10 cells/in2 and wall thickness of 50 mils or less; (iii) cutting the green extrudate to an appropriate length to form a green frame blank; (iv) sintering the green frame blank at a temperature of at least 1200° C., preferably at a temperature of between 1400° C. and 1600° C. for at least one hour to form a ceramic frame with a plurality of parallel channels; (v) inserting at least one fuel cell array into its designated position within the ceramic frame; and (vi) sealing the at least one fuel cell array to the frame.

Abstract: A solid oxide fuel cell comprising a thin ceramic electrolyte sheet having an increased street width is disclosed. Also disclosed are solid oxide fuel cells comprising: a substantially flat ceramic electrolyte sheet, a substantially flat ceramic electrolyte sheet having a seal area of greater thickness than the active area of the electrolyte sheet, a ceramic electrolyte sheet that overhangs the seal area, a ceramic electrolyte sheet and at least one substantially flat border material, and a border material having a non-linear edge. Methods of making a solid oxide fuel cell in accordance with the disclosed embodiments are also disclosed. Also disclosed are methods of making a solid oxide fuel cell wherein the seal has a uniform thickness, wherein the seal is heated to remove a volatile component prior to sealing, and wherein the distance between the frame and the ceramic electrolyte sheet of the device is constant.

Abstract: A solid oxide fuel cell device comprises: an electrolyte sheet; at least one electrode pair sandwiching the electrolyte sheet; wherein the sealed area of said electrolyte sheet is elongated, has arcuate geometry and has a length to width aspect ratio of more than 1.0.

Abstract: An exemplary fuel cell device assembly is a fuel cell stack assembly comprising: (i) a plurality of fuel cell packets, each of the packets comprising (a) a frame and (b) two planar electrolyte-supported fuel cell arrays, the fuel cell arrays arranged such that anode side of one fuel cell array faces the anode side of another fuel cell array, and the frame in combination with the fuel cell arrays defines a fuel chamber; (ii) a main enclosure enclosing the plurality of fuel cell packets, such that the plurality of packets form a plurality of oxidant channels; (iii) a restrictor plate forming, in conjunction with the fuel cell pockets, a plurality of oxidant channels; (iv) an inlet oxidant plenum manifold connected to one side of the oxidant channels; (v) an outlet oxidant plenum manifold connected to the other side of the oxidant channels; (vi) an inlet fuel manifold connected to one side of each of the fuel chambers; and (vii) an outlet fuel manifold connected to the other side of each of the fuel chambers.

Abstract: An electrolyte sheet comprises a substantially non-porous body and has at least one stress-relief area on at least a portion of the electrolyte sheet. The stress-relief area has a surface with a plurality of folds. The plurality of folds are arranged around and directed longitudinally toward a common central area.

Abstract: A stress reducing mounting for an electrolyte sheet assembly in a solid electrolyte fuel cell is provided that includes a support frame or manifold having an inner edge portion that supports a peripheral portion of the sheet assembly, a seal that affixes an edge of the peripheral portion to the frame or manifold, and a stress reducer disposed around the peripheral portion of the electrolyte sheet and the frame or manifold that reduces tensile stress in the peripheral portion of the electrolyte sheet when the peripheral portion is bent by pressure differentials or thermal differential expansion. The stress reducer is at least one of a convex curved surface on the inner edge portion of the frame or manifold that makes area contact with the peripheral portion when it bends in response to a pressure differential or thermal differential expansion, and a stiffening structure on the sheet peripheral portion that renders the ceramic sheet material forming the peripheral portion more resistant to bending.