Patents by Inventor Scott D. Garner

Scott D. Garner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200053955
    Abstract: A product on demand nozzle assembly includes a chamber at least partially defined by an external wall and an array of vertically spaced nozzles. Each nozzle has an air inlet, an air and entrained product outlet extending from the external wall, and an entrainment zone between the air inlet and the air and entrained product outlet to receive a product therein to be distributed.
    Type: Application
    Filed: October 23, 2019
    Publication date: February 20, 2020
    Inventors: Stanley R. Borkgren, William D. Graham, Terry L. Snipes, Elijah B. Garner, Robert T. Casper, Scott C. McCartney, Michael E. Frasier
  • Patent number: 10492359
    Abstract: A product distribution system includes a product on demand pick-up assembly including a hopper. The hopper is configured such that an air stream flowing into the pick-up assembly entrains product therein and conveys product downstream through a plurality of conduits. The product distribution system further includes a container for storing product prior to delivery of product to the pick-up assembly and a meter and conveyor assembly configured to move product from the container to the pick-up assembly hopper such that an amount of product greater than a predetermined quantity is maintained in the pick-up assembly hopper during operation of the system.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: December 3, 2019
    Assignee: DEERE & COMPANY
    Inventors: Stanley R. Borkgren, William D. Graham, Terry L. Snipes, Elijah B. Garner, Robert T. Casper, Scott C. McCartney, Michael E. Frasier
  • Patent number: 10034403
    Abstract: A card retainer device for securing a card module in a channel of a chassis. The card retainer device includes wedge members which have main portions with integrated brackets integrally attached to the main portions, the integrated brackets form first L-shaped brackets which engage walls of the chassis, surfaces of the card module or a combination thereof. The L-shaped brackets provide bearing surfaces which reduces binding and wear when the card retainer device secures the card module in the channel of a chassis and enhances the conductance of heat through the card retainer device. The wedge members provide heat transfer paths between the card module and the chassis. Mating surfaces of mating wedge member interfaces have compound angles that produces an applied force orthogonal to a flange of the conduction card that is greater than the force applied parallel to the flange of the conduction card.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: July 24, 2018
    Assignee: Advanced Cooling Technologies, Inc.
    Inventors: Matt D. Flannery, James E. Schmidt, Jens E. Weyant, Scott D. Garner
  • Patent number: 9466551
    Abstract: The apparatus is a heat transferring clamp with a heat pipe connecting the clamp's stationary base part to each moveable clamping part. A connecting heat pipe section between the heat pipe sections in the base part and each clamping part is flexible enough to permit both the required clamping and unclamping movements of the clamping part. The heat pipes thereby provide a superior heat transfer path between a clamped circuit board or other device and an available heat sink.
    Type: Grant
    Filed: February 9, 2012
    Date of Patent: October 11, 2016
    Assignee: Advanced Cooling Technologies, Inc.
    Inventors: Daniel T. Reist, Scott D. Garner, Jens E. Weyant, E. Michael Ames
  • Publication number: 20080308259
    Abstract: A heat pipe assembly comprises a first heat pipe having a condenser and a working fluid. A reservoir communicates with the condenser of the first heat pipe and contains a non-condensable gas which variably permits access of the working fluid to the condenser of the first heat pipe, depending on a pressure of the working fluid. A second heat pipe has an evaporator. At least a portion of the evaporator of the second heat pipe is contained inside of the condenser of the first heat pipe.
    Type: Application
    Filed: August 25, 2008
    Publication date: December 18, 2008
    Inventors: Scott D. Garner, G. Yale Eastman
  • Patent number: 7159649
    Abstract: An air-to-air heat exchanger, is provided that comprises a folded fin core formed from a continuous sheet of thermally conductive material that has been folded into alternating flat ridges and troughs; an insert overlay having an opening including two sets of uniform fingers, wherein each finger has a portion protruding into and essentially filling each trough on one surface of the folded fin core; an inset region between each finger portion and the end edges of each trough; a sealant within each inset region sealably attaching the insert overlay to the folded fin core; and an air flow divider plate. Heat exchanger components are also provided.
    Type: Grant
    Filed: July 16, 2004
    Date of Patent: January 9, 2007
    Assignee: Thermal Corp.
    Inventors: Geoffrey P. Thyrum, Scott D. Garner
  • Patent number: 7071408
    Abstract: A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first-thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e.g.
    Type: Grant
    Filed: September 2, 2005
    Date of Patent: July 4, 2006
    Assignee: Thermal Corp.
    Inventor: Scott D. Garner
  • Patent number: 7013958
    Abstract: A grooved sintered wick for a heat pipe is provided having a plurality of individual particles which together yield an average particle diameter. The grooved sintered wick further includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands where the particle layer comprises at least one dimension that is no more than about six average particle diameters. A heat pipe is also provided comprising a grooved wick that includes a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands that comprises less than about six average particle diameters. A method for making a heat pipe wick in accordance with the foregoing structures is also provided.
    Type: Grant
    Filed: May 13, 2005
    Date of Patent: March 21, 2006
    Assignee: Thermal Corp.
    Inventors: Scott D. Garner, James E. Lindemuth, Jerome E. Toth, John H. Rosenfeld, Kenneth G. Minnerly
  • Patent number: 6972365
    Abstract: A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e.g.
    Type: Grant
    Filed: September 9, 2003
    Date of Patent: December 6, 2005
    Assignee: Thermal Corp.
    Inventor: Scott D. Garner
  • Patent number: 6945317
    Abstract: A grooved sintered wick for a heat pipe is provided having a plurality of individual particles which together yield an average particle diameter. The grooved sintered wick further includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands where the particle layer comprises at least one dimension that is no more than about six average particle diameters. A heat pipe is also provided comprising a grooved wick that includes a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands that comprises less than about six average particle diameters. A method for making a heat pipe wick in accordance with the foregoing structures is also provided.
    Type: Grant
    Filed: April 24, 2003
    Date of Patent: September 20, 2005
    Assignee: Thermal Corp.
    Inventors: Scott D. Garner, James E. Lindemuth, Jerome E. Toth, John H. Rosenfeld, Kenneth G. Minnerly
  • Patent number: 6938680
    Abstract: A heat pipe is provided having a tubular enclosure with an internal surface, a working fluid disposed within the enclosure, and at least one fin projecting radially outwardly from an outer surface of the tubular enclosure. The tubular enclosure is sealed at one end by a base having a grooved sintered wick disposed on at least a portion of its internally facing surface. The grooved, sintered wick comprises a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between said at least two adjacent lands that comprises less than about six average particle diameters.
    Type: Grant
    Filed: July 14, 2003
    Date of Patent: September 6, 2005
    Assignee: Thermal Corp.
    Inventors: Scott D. Garner, James E. Lindemuth, Jerome E. Toth, John H. Rosenfeld, Kenneth G. Minnerly
  • Patent number: 6830097
    Abstract: A heat sink (10) is provided for use with a fan (16) for cooling an electronic component (12) wherein the heat sink (10) transfers heat from a heat rejecting surface (14) of the electronic component (12) to a cooling airflow provided by the fan (16). The heat sink (10) includes a heat conducting base member (20) having a substantially planar heat receiving surface (22) for overlaying the heat rejecting surface (14) of the electronic component (12) to receive heat therefrom, a heat conducting tower (24) extending from a side of the base member (20) opposite from the heat receiving surface (22) to receive heat therefrom, and a pair of serpentine fins (30) to transfer heat from the tower (24) to the airflow and the environment surrounding the heat sink (10).
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: December 14, 2004
    Assignee: Modine Manufacturing Company
    Inventors: Jonathan P. Wattelet, Scott D. Garner
  • Publication number: 20040211549
    Abstract: A grooved sintered wick for a heat pipe is provided having a plurality of individual particles which together yield an average particle diameter. The grooved sintered wick further includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands where the particle layer comprises at least one dimension that is no more than about six average particle diameters. A heat pipe is also provided comprising a grooved wick that includes a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands that comprises less than about six average particle diameters. A method for making a heat pipe wick in accordance with the foregoing structures is also provided.
    Type: Application
    Filed: April 24, 2003
    Publication date: October 28, 2004
    Inventors: Scott D. Garner, James E. Lindemuth, Jerome E. Toth, John H. Rosenfeld, Kenneth G. Minnerly
  • Publication number: 20040112583
    Abstract: A heat pipe assembly comprises a first heat pipe having a condenser and a working fluid. A reservoir communicates with the condenser of the first heat pipe and contains a non-condensable gas which variably permits access of the working fluid to the condenser of the first heat pipe, depending on a pressure of the working fluid. A second heat pipe has an evaporator. At least a portion of the evaporator of the second heat pipe is contained inside of the condenser of the first heat pipe.
    Type: Application
    Filed: October 29, 2003
    Publication date: June 17, 2004
    Inventors: Scott D. Garner, G. Yale Eastman
  • Publication number: 20040060690
    Abstract: A heat sink (10) is provided for use with a fan (16) for cooling an electronic component (12) wherein the heat sink (10) transfers heat from a heat rejecting surface (14) of the electronic component (12) to a cooling airflow provided by the fan (16). The heat sink (10) includes a heat conducting base member (20) having a substantially planar heat receiving surface (22) for overlaying the heat rejecting surface (14) of the electronic component (12) to receive heat therefrom, a heat conducting tower (24) extending from a side of the base member (20) opposite from the heat receiving surface (22) to receive heat therefrom, and a pair of serpentine fins (30) to transfer heat from the tower (24) to the airflow and the environment surrounding the heat sink (10).
    Type: Application
    Filed: September 27, 2002
    Publication date: April 1, 2004
    Inventors: Jonathan P. Wattelet, Scott D. Garner
  • Publication number: 20040045730
    Abstract: A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first-thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e.g.
    Type: Application
    Filed: September 9, 2003
    Publication date: March 11, 2004
    Inventor: Scott D. Garner
  • Patent number: 6675887
    Abstract: A heat pipe assembly comprises a first heat pipe having a condenser and a working fluid. A reservoir communicates with the condenser of the first heat pipe and contains a non-condensable gas which variably permits access of the working fluid to the condenser of the first heat pipe, depending on a pressure of the working fluid. A second heat pipe has an evaporator. At least a portion of the evaporator of the second heat pipe is contained inside of the condenser of the first heat pipe.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: January 13, 2004
    Assignee: Thermal Corp.
    Inventors: Scott D. Garner, G. Yale Eastman
  • Patent number: 6657121
    Abstract: A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e.g.
    Type: Grant
    Filed: June 26, 2002
    Date of Patent: December 2, 2003
    Assignee: Thermal Corp.
    Inventor: Scott D. Garner
  • Publication number: 20030183381
    Abstract: A heat pipe assembly comprises a first heat pipe having a condenser and a working fluid. A reservoir communicates with the condenser of the first heat pipe and contains a non-condensable gas which variably permits access of the working fluid to the condenser of the first heat pipe, depending on a pressure of the working fluid. A second heat pipe has an evaporator. At least a portion of the evaporator of the second heat pipe is contained inside of the condenser of the first heat pipe.
    Type: Application
    Filed: March 26, 2002
    Publication date: October 2, 2003
    Inventors: Scott D. Garner, G. Yale Eastman
  • Patent number: 6615912
    Abstract: The present invention provides a loop thermosiphon including an evaporator and a condenser interconnected in flow communication by a vapor conduit and a condensate conduit. A wick is disposed in a portion of the evaporator and a portion of the at least one condensate conduit adjacent to the evaporator to facilitate capillary action to cycle a coolant fluid through the loop thermosiphon. Advantageously, a porous valve is lodged within the condensate conduit so that a first pressure on a condenser side of the porous valve is greater than a second pressure on an evaporator side of the porous valve. In this way, a portion of the liquid coolant fluid disposed within the loop thermosiphon is forced through the porous valve and a remaining portion is forced through the at least one condenser.
    Type: Grant
    Filed: June 20, 2001
    Date of Patent: September 9, 2003
    Assignee: Thermal Corp.
    Inventor: Scott D. Garner