Patents by Inventor Scott Gilbert

Scott Gilbert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11538753
    Abstract: An electronic chip, system, and method includes a power block including a power source configured to provide power to components of the electronic chip and a relay circuit coupled to the power source and a ground plane. The electronic chip further includes chip package having a first major side and a second major side, the power block secured to the second major side, the chip package comprising electrical connections, disposed on the second major side, to be secured with respect to a circuit board, and interconnect circuitry, electrically coupling the power block to ground, comprising a plurality of conductive layers, a conductive through hole, electrically connecting a first pair of the plurality of conductive layers, having a first width, and a via, electrically connecting a second pair of the plurality of conductive layers, having a second width less than the first width.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: December 27, 2022
    Assignee: Intel Corporation
    Inventors: MD Altaf Hossain, Ankireddy Nalamalpu, Scott Gilbert, Jin Zhao
  • Patent number: 10950537
    Abstract: A package structure including a capacitor mounted within a cavity in the package substrate is disclosed. The package structure may additionally include a die mounted to a die side surface of the package substrate, and the opposing land side surface of the package substrate may be mounted to a printed circuit board (PCB). The capacitor may be mounted within a cavity formed in the die side surface of the package substrate or the land side surface of the package substrate. Mounting a capacitor within a cavity may reduce the form factor of the package. The die may be mounted within a cavity formed in the die side surface of the package substrate. Solder balls connecting the package to the PCB may be mounted within one or more cavities formed in one or both of the package substrate and the PCB.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: March 16, 2021
    Assignee: Intel Corporation
    Inventors: Md Altaf Hossain, Scott Gilbert
  • Publication number: 20200051901
    Abstract: A package structure including a capacitor mounted within a cavity in the package substrate is disclosed. The package structure may additionally include a die mounted to a die side surface of the package substrate, and the opposing land side surface of the package substrate may be mounted to a printed circuit board (PCB). The capacitor may be mounted within a cavity formed in the die side surface of the package substrate or the land side surface of the package substrate. Mounting a capacitor within a cavity may reduce the form factor of the package. The die may be mounted within a cavity formed in the die side surface of the package substrate. Solder balls connecting the package to the PCB may be mounted within one or more cavities formed in one or both of the package substrate and the PCB.
    Type: Application
    Filed: May 20, 2019
    Publication date: February 13, 2020
    Inventors: MD Altaf Hossain, Scott Gilbert
  • Publication number: 20190333854
    Abstract: An electronic chip, system, and method includes a power block including a power source configured to provide power to components of the electronic chip and a relay circuit coupled to the power source and a ground plane. The electronic chip further includes chip package having a first major side and a second major side, the power block secured to the second major side, the chip package comprising electrical connections, disposed on the second major side, to be secured with respect to a circuit board, and interconnect circuitry, electrically coupling the power block to ground, comprising a plurality of conductive layers, a conductive through hole, electrically connecting a first pair of the plurality of conductive layers, having a first width, and a via, electrically connecting a second pair of the plurality of conductive layers, having a second width less than the first width.
    Type: Application
    Filed: December 30, 2016
    Publication date: October 31, 2019
    Inventors: MD Altaf Hossain, Ankireddy Nalamalpu, Scott Gilbert, Jin Zhao
  • Publication number: 20180108605
    Abstract: A package structure including a capacitor mounted within a cavity in the package substrate is disclosed. The package structure may additionally include a die mounted to a die side surface of the package substrate, and the opposing land side surface of the package substrate may be mounted to a printed circuit board (PCB). The capacitor may be mounted within a cavity formed in the die side surface of the package substrate or the land side surface of the package substrate. Mounting a capacitor within a cavity may reduce the form factor of the package. The die may be mounted within a cavity formed in the die side surface of the package substrate. Solder balls connecting the package to the PCB may be mounted within one or more cavities formed in one or both of the package substrate and the PCB.
    Type: Application
    Filed: July 31, 2017
    Publication date: April 19, 2018
    Inventors: MD Altaf Hossain, Scott Gilbert
  • Publication number: 20170141024
    Abstract: A package structure including a capacitor mounted within a cavity in the package substrate is disclosed. The package structure may additionally include a die mounted to a die side surface of the package substrate, and the opposing land side surface of the package substrate may be mounted to a printed circuit board (PCB). The capacitor may be mounted within a cavity formed in the die side surface of the package substrate or the land side surface of the package substrate. Mounting a capacitor within a cavity may reduce the form factor of the package. The die may be mounted within a cavity formed in the die side surface of the package substrate. Solder balls connecting the package to the PCB may be mounted within one or more cavities formed in one or both of the package substrate and the PCB.
    Type: Application
    Filed: January 30, 2017
    Publication date: May 18, 2017
    Inventors: MD Altaf Hossain, Scott Gilbert
  • Patent number: 7620909
    Abstract: An interactive computer program for seaming a number of images into a panorama. Various parameters which affect how the images are seamed can be changed interactively. Parameters such as position, orientation, focal length, which image will be visible where images overlap, and the opacity curve can be changed. The result of any change is immediately visible. A user can move the control points, thereby “morphing” or distorting the contribution to the panorama of an image. Each pixel is assigned an “alpha” value which indicates the opacity value of that pixel in an area where images overlap. Alpha values can be changed according to a pre-established curve. The original images are not changed. Instead, only the transform between the original images and the final panorama is changed.
    Type: Grant
    Filed: February 26, 2004
    Date of Patent: November 17, 2009
    Assignee: iMove Inc.
    Inventors: Michael C. Park, Scott Gilbert
  • Patent number: 7381201
    Abstract: The present invention provides a reusable spring driven autoinjector. The drive mechanism of the autoinjector of the present invention includes one or more drive springs formed of a shape memory alloy. Therefore, by alternating the shape memory alloy forming the one or more drive springs between austenite phase before an injection and a martensite phase after injection, the reusable autoinjector of the present invention is capable of providing an injection force that is higher than the compressive force required to cock the drive mechanism in preparation for a subsequent injection operation.
    Type: Grant
    Filed: June 24, 2003
    Date of Patent: June 3, 2008
    Assignee: Alza Corporation
    Inventors: Scott Gilbert, Pedro de la Sema
  • Patent number: 7289793
    Abstract: A method and apparatus for displaying real-time information objects between a wireless mobile user station and multiple information sources based upon event driven parameters and user modifiable object manifest, wherein the multiple real-time information sources and real-time event occurrences are collected, tagged and analyzed for context relevance and transmitted to a wireless mobile computer user based on personal preference and request of the wireless mobile computer user, thus providing a highly personalized experience.
    Type: Grant
    Filed: December 3, 2002
    Date of Patent: October 30, 2007
    Inventors: David Norwood, Scott Gilbert
  • Patent number: 7253523
    Abstract: A process of making a reworkable thermal interface material is described. The reworkable thermal interface material is bonded to a die and a heat sink. The reworkable thermal interface material includes a phase-change polymer matrix material. Other materials in the reworkable thermal interface material can include heat transfer particles and low melting-point metal particles. The phase-change polymer matrix material includes a melting temperature below a selected temperature and the heat transfer particles have a melting temperature substantially above the selected temperature. The heat transfer particles act as a spacer limit, which holds the thermal interface material to a given bond-line thickness during use.
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: August 7, 2007
    Assignee: Intel Corporation
    Inventors: Ashay A. Dani, Scott Gilbert, Ajit V. Sathe, Ravi Prasher
  • Publication number: 20070087058
    Abstract: An osmotic delivery system for controlled delivery of a beneficial agent includes an implantable capsule containing a beneficial agent and an osmotic engine that swells on contact with water, thereby causing the release of the beneficial agent over time. The osmotic delivery system has a membrane material that allows a controlled amount of fluid to enter from an exterior of the capsule, while preventing the compositions within the capsule from passing out of the capsule. The osmotic delivery system is designed to meet at least the operating pressures of 1000 psi. The membrane material is cast, calendered or extruded followed by machining (i.e., die-cutting, stamping or otherwise cutting to shape) to provide a uniform nonribbed membrane material. The capsule also includes a membrane material-retaining means that is positioned at a fluid uptake end to retain the membrane material within the capsule, even under periods of high pressure.
    Type: Application
    Filed: December 11, 2006
    Publication date: April 19, 2007
    Inventors: John Peery, Scott Gilbert, James Brown
  • Publication number: 20070055214
    Abstract: A method for delivering a drug into tissue includes the steps of: providing a drug delivery device having at least one nozzle and a drug contained in a portion of the device; identifying a site for delivery of the drug in or on tissue; placing a portion of the device on or near the site; and delivering the drug into the tissue at the site through at least one nozzle of the device under microjet propulsion.
    Type: Application
    Filed: August 10, 2005
    Publication date: March 8, 2007
    Inventor: Scott Gilbert
  • Publication number: 20070055200
    Abstract: A device for delivering a drug includes a housing; at least one nozzle at a portion of the housing; a source of drug in the housing; and an energy source for providing a pressure of up to about 2,000 psi for driving the drug through the at least one nozzle and out of the housing. The drug is delivered to tissue under microjet propulsion. The device is particularly useful for drug delivery applications such as transdermal and ocular by way of example.
    Type: Application
    Filed: August 10, 2005
    Publication date: March 8, 2007
    Inventor: Scott Gilbert
  • Publication number: 20070052139
    Abstract: A method for making a jet injection drug delivery device wherein the drug delivery device has at least one drug reservoir and at least one injection nozzle includes the steps of: identifying a drug desired to be delivered; identifying a volume of the drug desired to be delivered; establishing a reservoir diameter for the at least one drug reservoir; establishing a nozzle diameter for the at least one injection nozzle; identifying a tissue model for delivery of the drug; identifying a penetration depth in the tissue model for the delivery of the drug; and injecting the drug into the tissue model under variable pressure until the desired penetration depth is achieved. The method also includes identifying an optimal pressure range for the drug delivery device that achieves the desired penetration depth.
    Type: Application
    Filed: August 10, 2005
    Publication date: March 8, 2007
    Inventor: Scott Gilbert
  • Publication number: 20070055199
    Abstract: A device for delivering a drug includes a delivery tube wherein the delivery tube has a pressure chamber therein and at least one nozzle at a distal end of the delivery tube and in fluid communication with the pressure chamber. A source of drug is adjacent the at least one nozzle and a handle is located at a proximal end of the delivery tube. An energy source is located in the handle for providing a driving pressure of up to about 2,000 psi within the delivery tube for driving the drug through the at least one nozzle and out of the delivery tube. The delivery device is particularly useful for delivering drug under microjet propulsion to the mouth, ear and other areas of the body that are difficult to access.
    Type: Application
    Filed: August 10, 2005
    Publication date: March 8, 2007
    Inventor: Scott Gilbert
  • Publication number: 20060288567
    Abstract: A device includes a substrate. The substrate further includes a first major surface including a plurality of lands, and a second major surface. At least one component is attached to at least some of the plurality of pads on the first major surface. At least one sacrificial component is attached to the first major surface. The at least one component has a first height with respect to the first major surface, and the at least one sacrificial component has a second height with respect to the first major surface. The second height is greater than the first height. The sacrificial component includes a fuse.
    Type: Application
    Filed: August 29, 2006
    Publication date: December 28, 2006
    Inventors: Shawn Lloyd, John Oldendorf, Michael Kochanowski, Scott Gilbert
  • Patent number: 7098534
    Abstract: A device includes a substrate. The substrate further includes a first major surface including a plurality of lands, and a second major surface. At least one component is attached to at least some of the plurality of pads on the first major surface. At least one sacrificial component is attached to the first major surface. The at least one component has a first height with respect to the first major surface, and the at least one sacrificial component has a second height with respect to the first major surface. The second height is greater than the first height. The sacrificial component includes a fuse.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: August 29, 2006
    Assignee: Intel Corporation
    Inventors: Shawn L. Lloyd, John G. Oldendorf, Michael Kochanowski, Scott Gilbert
  • Patent number: 7097634
    Abstract: The present invention includes an automatic injection device that reliably provides automatic needle retraction even when manufactured with part and assembly tolerances typical of low-cost and high-volume manufacturing processes. The injector of the present invention includes a body, a syringe cartridge, a drive mechanism, and a bias mechanism. The drive mechanism includes an energy source, a drive member, and a compound plunger with a releasable coupling. Significantly, the compound plunger included in the drive mechanism is designed to ensure needle retraction occurs after the automatic injection device has delivered the desired dose of medicament. Moreover, the design of the compound plunger included in the injector of the present invention can compensate for part and assembly tolerances typical of low-cost, high volume manufacturing processes, enabling the fabrication of a low cost automatic injection device providing reliable automatic needle retraction.
    Type: Grant
    Filed: July 31, 2003
    Date of Patent: August 29, 2006
    Assignee: Alza Corporation
    Inventor: Scott Gilbert
  • Publication number: 20060116665
    Abstract: An implantable osmotically driven delivery system having a dynamic, two-way valve and a self-adjusting, variable geometry fluid flow channel. As pressure within the agent delivery system increases, the fluid channel narrows, thereby restricting flow. At exceptionally high pressures, the valve can be designed to close altogether at the orifice or delivery end, or it can provide a minimal leak path so that a maximum fluid flow is never exceeded. At zero or very low pressures, the valve will close completely at the beneficial agent reservoir end, isolating the beneficial agent formulation from external fluid infiltration and thereby eliminating diffusion of external fluid into the beneficial agent formulation.
    Type: Application
    Filed: September 27, 2005
    Publication date: June 1, 2006
    Inventor: Scott Gilbert
  • Publication number: 20050287214
    Abstract: A controlled release dosage form includes an active agent composition and a squeeze layer circumscribing at least a portion of the active agent composition. The squeeze layer includes a material that changes shape in a selected fluid environment of use. The material when it changes shape applies a squeeze force to the active agent composition.
    Type: Application
    Filed: June 8, 2005
    Publication date: December 29, 2005
    Inventors: Atul Ayer, Christine Loehrlein, Scott Gilbert, Liang Dong