Abstract: Apparatus, systems, and methods for controlling activities on a drilling rig are described. The methods include installing a control system operably coupled to the drilling rig and having a user interface, receiving operational guidelines from the user interface that include a plurality of control limits associated with operational parameters of the rig, monitoring current values of the operational parameters, and automatically applying the control limits to the operational parameters during operation of the rig.

Abstract: An apparatus and method of automatically altering proposed sliding instructions to comply with operating parameters is described.

Abstract: A rig control system according to which an automated sequence engine includes a sequence template module configured to provide a template that includes a plurality of data fields outlining operational steps and associated parameters to perform a drilling process, and a recipe learning module configured to generate a recipe for entry into the data fields. The recipe learning module is configured to retrieve a data set related to a drilling rig's performance of the drilling process to drill a wellbore segment, and to score the data set based on a result of the drilling rig's performance of the drilling process and/or a characteristic of the wellbore segment. In some embodiments, the recipe learning module is further configured to categorize the data set based on a characteristic of the drilling rig and/or the wellbore segment. The recipe is based on the data set, the scoring, the categorizing, or any combination thereof.

Abstract: Apparatus, systems, and methods for controlling activities on a drilling rig are described. The methods include installing a control system operably coupled to the drilling rig and having a user interface, receiving operational guidelines from the user interface that include a plurality of control limits associated with operational parameters of the rig, monitoring current values of the operational parameters, and automatically applying the control limits to the operational parameters during operation of the rig.

Abstract: A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR) and as such may be designated critical to function (CTF), whereby the larger solder balls in high stress regions carry input/output signals between a circuit board and a package mounted thereon. The larger solder balls are accommodated by recessing each ball in the package substrate, the circuit board, or both the package substrate and the circuit board. Additionally, a ball attach method for mounting a plurality of solder balls having different average diameters is disclosed.

Abstract: A rig control system according to which an automated sequence engine includes a sequence template module configured to provide a template that includes a plurality of data fields outlining operational steps and associated parameters to perform a drilling process, and a recipe learning module configured to generate a recipe for entry into the data fields. The recipe learning module is configured to retrieve a data set related to a drilling rig's performance of the drilling process to drill a wellbore segment, and to score the data set based on a result of the drilling rig's performance of the drilling process and/or a characteristic of the wellbore segment. In some embodiments, the recipe learning module is further configured to categorize the data set based on a characteristic of the drilling rig and/or the wellbore segment. The recipe is based on the data set, the scoring, the categorizing, or any combination thereof.

Abstract: A rig control apparatus, system, and method according to which a mud pump is ramped up toward a full-operational pumping pressure to circulate drilling mud via a drill string between a surface location and a downhole tool, the downhole tool being connected to the drill string and positioned within a wellbore, the flow of the drilling mud between the surface location and the downhole tool is stabilized prior to the mud pump reaching the full-operational pumping pressure, data is transmitted via mud-pulse telemetry from the downhole tool to the surface location when the flow of the drilling mud between the surface location and the downhole tool is stabilized, and the mud pumps are ramped up further to the full-operational pumping pressure.

Abstract: A package structure including a capacitor mounted within a cavity in the package substrate is disclosed. The package structure may additionally include a die mounted to a die side surface of the package substrate, and the opposing land side surface of the package substrate may be mounted to a printed circuit board (PCB). The capacitor may be mounted within a cavity formed in the die side surface of the package substrate or the land side surface of the package substrate. Mounting a capacitor within a cavity may reduce the form factor of the package. The die may be mounted within a cavity formed in the die side surface of the package substrate. Solder balls connecting the package to the PCB may be mounted within one or more cavities formed in one or both of the package substrate and the PCB.

Abstract: A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR) and as such may be designated critical to function (CTF), whereby the larger solder balls in high stress regions carry input/output signals between a circuit board and a package mounted thereon. The larger solder balls are accommodated by recessing each ball in the package substrate, the circuit board, or both the package substrate and the circuit board. Additionally, a ball attach method for mounting a plurality of solder balls having different average diameters is disclosed.

Abstract: The subject matter described herein includes a gun holster transport system. The gun holster transport system comprises a wrapping member for wrapping at least partially around itself to form an aperture for receiving a barrel holding portion of a gun holster. The wrapping member forms first and second arms extending axially from the barrel holding portion and which are positionable on opposite sides of a butt of a gun. The first and second arms each form lock-receiving apertures for receiving a lock positionable behind the butt of the gun to prevent withdraw of the gun from the gun holster.

Abstract: A package structure including a capacitor mounted within a cavity in the package substrate is disclosed. The package structure may additionally include a die mounted to a die side surface of the package substrate, and the opposing land side surface of the package substrate may be mounted to a printed circuit board (PCB). The capacitor may be mounted within a cavity formed in the die side surface of the package substrate or the land side surface of the package substrate. Mounting a capacitor within a cavity may reduce the form factor of the package. The die may be mounted within a cavity formed in the die side surface of the package substrate. Solder balls connecting the package to the PCB may be mounted within one or more cavities formed in one or both of the package substrate and the PCB.

Abstract: A system and method for calculating a path during drilling of a BHA between first and second survey points. The method includes calculating an amount of first incremental progress made by the BHA since the first survey point; calculating a first estimate of a first current location based on the first survey point and the amount of first incremental progress; causing at least one drilling parameter to be modified in order to alter a drilling direction of the BHA based on the first estimate; calculating an amount of second incremental progress made by the BHA; calculating a second estimate of the second current location based on the amount of second incremental progress and an aggregation of data received from the BHA, including data associated with the first survey point; and causing at least one drilling parameter to be modified in order to alter the drilling direction of the BHA.

Abstract: A package structure including a capacitor mounted within a cavity in the package substrate is disclosed. The package structure may additionally include a die mounted to a die side surface of the package substrate, and the opposing land side surface of the package substrate may be mounted to a printed circuit board (PCB). The capacitor may be mounted within a cavity formed in the die side surface of the package substrate or the land side surface of the package substrate. Mounting a capacitor within a cavity may reduce the form factor of the package. The die may be mounted within a cavity formed in the die side surface of the package substrate. Solder balls connecting the package to the PCB may be mounted within one or more cavities formed in one or both of the package substrate and the PCB.

Abstract: Methods and systems for drilling to a target location include a control system that receives an input comprising a planned drilling path to a target location and determines a projected location of a bottom hole assembly of a drilling system. The projected location of the bottom hole assembly is compared to the planned drilling path to determine a deviation amount. A modified drilling path is created to the target location as selected based on the amount of deviation from the planned drilling path, and drilling rig control signals that steer the bottom hole assembly of the drilling system to the target location along the modified drilling path are generated to intersect the planned drilling path if the amount of deviation from the planned path exceeds a first threshold amount of deviation.

Abstract: Systems, devices, and methods for producing a three-dimensional visualization of a drill plan and drilling motor with a toolface are provided for drill steering purposes. A drilling motor with a toolface in communication with a sensor system is provided. A controller in communication with the sensor system is operable to generate a depiction of the drill plan and a depiction of the drilling motor, and to combine these depictions in a three-dimensional visualization of the downhole environment. This visualization is used by a user to steer the drill.

Abstract: The subject matter described herein includes a gun holster transport system. The gun holster transport system comprises a wrapping member for wrapping at least partially around itself to form an aperture for receiving a barrel holding portion of a gun holster. The wrapping member forms first and second arms extending axially from the barrel holding portion and which are positionable on opposite sides of a butt of a gun. The first and second arms each form lock-receiving apertures for receiving a lock positionable behind the butt of the gun to prevent withdraw of the gun from the gun holster.

Abstract: A package structure including a capacitor mounted within a cavity in the package substrate is disclosed. The package structure may additionally include a die mounted to a die side surface of the package substrate, and the opposing land side surface of the package substrate may be mounted to a printed circuit board (PCB). The capacitor may be mounted within a cavity formed in the die side surface of the package substrate or the land side surface of the package substrate. Mounting a capacitor within a cavity may reduce the form factor of the package. The die may be mounted within a cavity formed in the die side surface of the package substrate. Solder balls connecting the package to the PCB may be mounted within one or more cavities formed in one or both of the package substrate and the PCB.

Abstract: A package structure including a capacitor mounted within a cavity in the package substrate is disclosed. The package structure may additionally include a die mounted to a die side surface of the package substrate, and the opposing land side surface of the package substrate may be mounted to a printed circuit board (PCB). The capacitor may be mounted within a cavity formed in the die side surface of the package substrate or the land side surface of the package substrate. Mounting a capacitor within a cavity may reduce the form factor of the package. The die may be mounted within a cavity formed in the die side surface of the package substrate. Solder balls connecting the package to the PCB may be mounted within one or more cavities formed in one or both of the package substrate and the PCB.

Abstract: A package structure including a capacitor mounted within a cavity in the package substrate is disclosed. The package structure may additionally include a die mounted to a die side surface of the package substrate, and the opposing land side surface of the package substrate may be mounted to a printed circuit board (PCB). The capacitor may be mounted within a cavity formed in the die side surface of the package substrate or the land side surface of the package substrate. Mounting a capacitor within a cavity may reduce the form factor of the package. The die may be mounted within a cavity formed in the die side surface of the package substrate. Solder balls connecting the package to the PCB may be mounted within one or more cavities formed in one or both of the package substrate and the PCB.

Abstract: A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR) and as such may be designated critical to function (CTF), whereby the larger solder balls in high stress regions carry input/output signals between a circuit board and a package mounted thereon. The larger solder balls are accommodated by recessing each ball in the package substrate, the circuit board, or both the package substrate and the circuit board. Additionally, a ball attach method for mounting a plurality of solder balls having different average diameters is disclosed.