Patents by Inventor Scott Goodman

Scott Goodman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240035911
    Abstract: Header construction and techniques are disclosed that utilize header layers that provide support for electrical interconnections. A sensor header assembly includes: an upper header layer having upper through holes arranged in a first configuration; a lower header layer having lower through holes arranged in a second configuration axially offset relative to the first configuration; depressions extending from the lower header layer top surface and partially through the lower header layer, each depression defining a footprint corresponding to the first configuration of the corresponding upper through holes of the upper header layer; upper header pins extending through the corresponding upper through holes and at least partially into the corresponding lower level depressions; and lower header pins extending through the corresponding lower through holes and in electrical communication with the corresponding upper header pins.
    Type: Application
    Filed: October 10, 2023
    Publication date: February 1, 2024
    Inventors: Alexander A. Ned, Scott Goodman
  • Patent number: 11802804
    Abstract: Header construction and techniques are disclosed that utilize header layers that provide support for electrical interconnections. A sensor header assembly includes: an upper header layer having upper through holes arranged in a first configuration; a lower header layer having lower through holes arranged in a second configuration axially offset relative to the first configuration; depressions extending from the lower header layer top surface and partially through the lower header layer, each depression defining a footprint corresponding to the first configuration of the corresponding upper through holes of the upper header layer; upper header pins extending through the corresponding upper through holes and at least partially into the corresponding lower level depressions; and lower header pins extending through the corresponding lower through holes and in electrical communication with the corresponding upper header pins.
    Type: Grant
    Filed: August 31, 2022
    Date of Patent: October 31, 2023
    Assignee: KULITE SEMICONDUCTOR PRODUCTS, INC.
    Inventors: Alexander A. Ned, Scott Goodman
  • Publication number: 20220412829
    Abstract: Header construction and techniques are disclosed that utilize header layers that provide support for electrical interconnections. A sensor header assembly includes: an upper header layer having upper through holes arranged in a first configuration; a lower header layer having lower through holes arranged in a second configuration axially offset relative to the first configuration; depressions extending from the lower header layer top surface and partially through the lower header layer, each depression defining a footprint corresponding to the first configuration of the corresponding upper through holes of the upper header layer; upper header pins extending through the corresponding upper through holes and at least partially into the corresponding lower level depressions; and lower header pins extending through the corresponding lower through holes and in electrical communication with the corresponding upper header pins.
    Type: Application
    Filed: August 31, 2022
    Publication date: December 29, 2022
    Inventors: Alexander A. Ned, Scott Goodman
  • Patent number: 11467049
    Abstract: Header construction and techniques are disclosed that utilize header layers that provide support for electrical interconnections. A sensor header assembly includes: an upper header layer having upper through holes arranged in a first configuration; a lower header layer having lower through holes arranged in a second configuration axially offset relative to the first configuration; depressions extending from the lower header layer top surface and partially through the lower header layer, each depression defining a footprint corresponding to the first configuration of the corresponding upper through holes of the upper header layer; upper header pins extending through the corresponding upper through holes and at least partially into the corresponding lower level depressions; and lower header pins extending through the corresponding lower through holes and in electrical communication with the corresponding upper header pins.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: October 11, 2022
    Assignee: KULITE SEMICONDUCTOR PRODUCTS, INC.
    Inventors: Alexander A. Ned, Scott Goodman
  • Patent number: 11359985
    Abstract: The disclosed technology includes an oil-filled pressure transducer assembly and an oil-filled compensating sensing element disposed near one another and attached to a common housing. The oil-filled pressure transducer assembly may receive and measure pressure media via a first oil-filled cavity and a protective diagram in communication with the pressure media. The compensating sensing element may be isolated from the pressure media. In certain example implementations, the compensating sensing element is configured to measure certain common error phenomena that are also measured by the oil-filled pressure transducer assembly, for example, due to acceleration, temperature, and/or vibration. In certain implementations, the signal measured by the compensating sensing element may be subtracted from the signal measured by the oil-filled pressure transducer assembly to provide a compensated output signal.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: June 14, 2022
    Assignee: KULITE SEMICONDUCTOR PRODUCTS, INC.
    Inventors: Alexander A. Ned, Sorin Stefanescu, Andrew Bemis, Scott Goodman
  • Publication number: 20210048363
    Abstract: The disclosed technology includes an oil-filled pressure transducer assembly and an oil-filled compensating sensing element disposed near one another and attached to a common housing. The oil-filled pressure transducer assembly may receive and measure pressure media via a first oil-filled cavity and a protective diagram in communication with the pressure media. The compensating sensing element may be isolated from the pressure media. In certain example implementations, the compensating sensing element is configured to measure certain common error phenomena that are also measured by the oil-filled pressure transducer assembly, for example, due to acceleration, temperature, and/or vibration. In certain implementations, the signal measured by the compensating sensing element may be subtracted from the signal measured by the oil-filled pressure transducer assembly to provide a compensated output signal.
    Type: Application
    Filed: August 12, 2019
    Publication date: February 18, 2021
    Inventors: Alexander A. Ned, Sorin Stefanescu, Andrew Bemis, Scott Goodman
  • Publication number: 20210010891
    Abstract: Header construction and techniques are disclosed that utilize header layers that provide support for electrical interconnections. A sensor header assembly includes: an upper header layer having upper through holes arranged in a first configuration; a lower header layer having lower through holes arranged in a second configuration axially offset relative to the first configuration; depressions extending from the lower header layer top surface and partially through the lower header layer, each depression defining a footprint corresponding to the first configuration of the corresponding upper through holes of the upper header layer; upper header pins extending through the corresponding upper through holes and at least partially into the corresponding lower level depressions; and lower header pins extending through the corresponding lower through holes and in electrical communication with the corresponding upper header pins.
    Type: Application
    Filed: September 28, 2020
    Publication date: January 14, 2021
    Inventors: Alexander A. Ned, Scott Goodman
  • Patent number: 10788386
    Abstract: Header construction and techniques are disclosed that utilize header layers that provide support for electrical interconnections. A sensor header assembly includes: an upper header layer having upper through holes arranged in a first configuration; a lower header layer having lower through holes arranged in a second configuration axially offset relative to the first configuration; depressions extending from the lower header layer top surface and partially through the lower header layer, each depression defining a footprint corresponding to the first configuration of the corresponding upper through holes of the upper header layer; upper header pins extending through the corresponding upper through holes and at least partially into the corresponding lower level depressions; and lower header pins extending through the corresponding lower through holes and in electrical communication with the corresponding upper header pins.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: September 29, 2020
    Assignee: KULITE SEMICONDUCTOR PRODUCTS, INC.
    Inventors: Alexander A. Ned, Scott Goodman
  • Publication number: 20200173877
    Abstract: Header construction and techniques are disclosed that utilize header layers that provide support for electrical interconnections. A sensor header assembly includes: an upper header layer having upper through holes arranged in a first configuration; a lower header layer having lower through holes arranged in a second configuration axially offset relative to the first configuration; depressions extending from the lower header layer top surface and partially through the lower header layer, each depression defining a footprint corresponding to the first configuration of the corresponding upper through holes of the upper header layer; upper header pins extending through the corresponding upper through holes and at least partially into the corresponding lower level depressions; and lower header pins extending through the corresponding lower through holes and in electrical communication with the corresponding upper header pins.
    Type: Application
    Filed: November 30, 2018
    Publication date: June 4, 2020
    Inventors: Alexander A. Ned, Scott Goodman
  • Patent number: 10605685
    Abstract: Certain implementations of the disclosed technology include systems and methods for providing header assemblies for use with pressure sensors in high-temperature environments. Certain example implementations include a header assembly. The header assembly can include a header portion having a first side and a second side, the header portion including one or more bores extending through the header portion from the first side to the second side. In certain example implementations, one or more platinum header pins are disposed within and extending through the one or more bores of the header portion. In certain example implementations, the header assembly can include one or more brazing portions corresponding to the one or more platinum header pins. In certain example implementations, the platinum header pins are configured for electrical communication with corresponding electrodes of a leadless transducer element.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: March 31, 2020
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Alexander Ned, Sorin Stefanescu, Scott Goodman
  • Publication number: 20190033155
    Abstract: Certain implementations of the disclosed technology include systems and methods for providing header assemblies for use with pressure sensors in high-temperature environments. Certain example implementations include a header assembly. The header assembly can include a header portion having a first side and a second side, the header portion including one or more bores extending through the header portion from the first side to the second side. In certain example implementations, one or more platinum header pins are disposed within and extending through the one or more bores of the header portion. In certain example implementations, the header assembly can include one or more brazing portions corresponding to the one or more platinum header pins. In certain example implementations, the platinum header pins are configured for electrical communication with corresponding electrodes of a leadless transducer element.
    Type: Application
    Filed: October 3, 2018
    Publication date: January 31, 2019
    Inventors: Alexander Ned, Sorin Stefanescu, Scott Goodman
  • Patent number: 10119877
    Abstract: Certain implementations of the disclosed technology include systems and methods for providing header assemblies for use with pressure sensors in high-temperature environments. Certain example implementations include a header assembly. The header assembly can include a header portion having a first side and a second side, the header portion including one or more bores extending through the header portion from the first side to the second side. In certain example implementations, one or more platinum header pins are disposed within and extending through the one or more bores of the header portion. In certain example implementations, the header assembly can include one or more brazing portions corresponding to the one or more platinum header pins. In certain example implementations, the platinum header pins are configured for electrical communication with corresponding electrodes of a leadless transducer element.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: November 6, 2018
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Alexander Ned, Sorin Stefanescu, Scott Goodman
  • Patent number: 9574960
    Abstract: This disclosure provides example methods, devices, and systems for an ultra-miniature, multi-hole flow angle probe. The construction, packaging of a multitude of absolute and or differential pressure transducers or sensors are invented for the purpose of providing highly accurate measurement of flow properties, flow angle in particular. The unique placement of sensors leads to further miniaturization relative to current state of the art. Further the use of closely coupled, differential transducer or transducers achieves higher accuracy measurement of small pressure variations coupled with large mean or average baseline pressures, as is demanded in modern aerodynamic or turbo-machinery devices. The use and installation of ultra-miniature sensors insider the device invented herein achieves higher frequency response than allowable via previous state of the part.
    Type: Grant
    Filed: July 9, 2014
    Date of Patent: February 21, 2017
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Alexander A. Ned, Tonghuo Shang, Scott Goodman, Steve Carter, Joseph R. VanDeWeert
  • Publication number: 20170016791
    Abstract: Certain implementations of the disclosed technology include systems and methods for providing header assemblies for use with pressure sensors in high-temperature environments. Certain example implementations include a header assembly. The header assembly can include a header portion having a first side and a second side, the header portion including one or more bores extending through the header portion from the first side to the second side. In certain example implementations, one or more platinum header pins are disposed within and extending through the one or more bores of the header portion. In certain example implementations, the header assembly can include one or more brazing portions corresponding to the one or more platinum header pins. In certain example implementations, the platinum header pins are configured for electrical communication with corresponding electrodes of a leadless transducer element.
    Type: Application
    Filed: July 15, 2016
    Publication date: January 19, 2017
    Inventors: Alexander Ned, Sorin Stefanescu, Scott Goodman
  • Patent number: 9500553
    Abstract: A method, device, or system is provided for improving dynamic pressure measurements. In one embodiment, a method comprises receiving, at a filter structure having a restricting tube, an input pressure having a static pressure (PS), a lower-frequency dynamic pressure (PLD) and a higher-frequency dynamic pressure (PHD); filtering, by the restricting tube, the input pressure to substantially pass an output pressure having the static pressure (PS), the lower-frequency dynamic pressure (PLD), and an attenuated higher-frequency dynamic pressure (PHD); and outputting, from the filter structure, the output pressure.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: November 22, 2016
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Adam Hurst, Joseph R. VanDeWeert, Scott Goodman, Boaz Kochman
  • Patent number: 9470325
    Abstract: This disclosure provides example methods, devices, and systems for a single and grouped pressure valve. In one embodiment, a pressure valve may include a housing having a first input port and a plurality of output ports and defining a cavity disposed therein; a flow coupler disposed in the cavity of the housing and having a passage transversely disposed therethrough, wherein the flow coupler is movable within the cavity of the housing; wherein a first alignment position of the flow coupler in the cavity of the housing allows fluid flow from the first input port of the housing through the passage of the flow coupler to all of the plurality of output ports of the housing; and wherein a second alignment position of the flow coupler in the cavity of the housing allows fluid flow from the first input port of the housing through the passage of the flow coupler to one of the plurality of output ports of the housing.
    Type: Grant
    Filed: May 6, 2014
    Date of Patent: October 18, 2016
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Lou DeRosa, Robert Gardner, Joseph R. VanDeWeert, Scott Goodman
  • Publication number: 20160209289
    Abstract: A method, device, or system is provided for improving dynamic pressure measurements. In one embodiment, a method comprises receiving, at a filter structure having a restricting tube, an input pressure having a static pressure (PS), a lower-frequency dynamic pressure (PLD) and a higher-frequency dynamic pressure (PHD); filtering, by the restricting tube, the input pressure to substantially pass an output pressure having the static pressure (PS), the lower-frequency dynamic pressure (PLD), and an attenuated higher-frequency dynamic pressure (PHD); and outputting, from the filter structure, the output pressure.
    Type: Application
    Filed: March 14, 2013
    Publication date: July 21, 2016
    Applicant: KULITE SEMICONDUCTOR PRODUCTS, INC.
    Inventors: Adam Hurst, Joseph R. VanDeWeert, Scott Goodman, Boaz Kochman
  • Publication number: 20160011065
    Abstract: This disclosure provides example methods, devices, and systems for an ultra-miniature, multi-hole flow angle probe. The construction, packaging of a multitude of absolute and or differential pressure transducers or sensors are invented for the purpose of providing highly accurate measurement of flow properties, flow angle in particular. The unique placement of sensors leads to further miniaturization relative to current state of the art. Further the use of closely coupled, differential transducer or transducers achieves higher accuracy measurement of small pressure variations coupled with large mean or average baseline pressures, as is demanded in modern aerodynamic or turbo-machinery devices. The use and installation of ultra-miniature sensors insider the device invented herein achieves higher frequency response than allowable via previous state of the part.
    Type: Application
    Filed: July 9, 2014
    Publication date: January 14, 2016
    Inventors: Alexander A. Ned, Tonghuo Shang, Scott Goodman, Steve Carter, Joseph R. VanDeWeert
  • Publication number: 20150323086
    Abstract: This disclosure provides example methods, devices, and systems for a single and grouped pressure valve. In one embodiment, a pressure valve may include a housing having a first input port and a plurality of output ports and defining a cavity disposed therein; a flow coupler disposed in the cavity of the housing and having a passage transversely disposed therethrough, wherein the flow coupler is movable within the cavity of the housing; wherein a first alignment position of the flow coupler in the cavity of the housing allows fluid flow from the first input port of the housing through the passage of the flow coupler to all of the plurality of output ports of the housing; and wherein a second alignment position of the flow coupler in the cavity of the housing allows fluid flow from the first input port of the housing through the passage of the flow coupler to one of the plurality of output ports of the housing.
    Type: Application
    Filed: May 6, 2014
    Publication date: November 12, 2015
    Applicant: Kulite Semiconductor Products, Inc.
    Inventors: Lou DeRosa, Robert Gardner, Joseph R. VanDeWeert, Scott Goodman
  • Publication number: 20140260645
    Abstract: An example embodiment of the present invention provides a differential piezoresistive sensor assembly and method of manufacturing and using the same, such that a first and second pressure are applied from a single side there enabling easier installation in many pressure assemblies.
    Type: Application
    Filed: June 25, 2013
    Publication date: September 18, 2014
    Applicant: Kulite Semiconductor Products, Inc.
    Inventors: Scott Goodman, Joseph R. VandeWeert, Alexander A. Ned