Abstract: A method, device, or system is provided for improving dynamic pressure measurements. In one embodiment, a method comprises receiving, at a filter structure having a restricting tube, an input pressure having a static pressure (PS), a lower-frequency dynamic pressure (PLD) and a higher-frequency dynamic pressure (PHD); filtering, by the restricting tube, the input pressure to substantially pass an output pressure having the static pressure (PS), the lower-frequency dynamic pressure (PLD), and an attenuated higher-frequency dynamic pressure (PHD); and outputting, from the filter structure, the output pressure.

Abstract: A method for managing business rigor for a financial institution includes receiving business rigor data based on activities to implement a plurality of core products. A performance table, unit cost report, and summary report are created or updated based on the business rigor data. The performance table may include data based on an analysis of the business rigor data; the unit cost report may include a cost report based on the performance table data; and the summary report may include a report based on the unit cost report. The summary report is presented in order to improve the business rigor data.

Abstract: There is disclosed a flat planar pressure transducer which comprises a planar insulative substrate of a rectangular configuration. Disposed on the substrate is an array of conductive areas which extend from a contact terminal area of said substrate to an end of the substrate. There is a leadless sensor module positioned at said contact terminal area, with the contacts of said leadless sensor contacting contact terminals of said contact terminal area. The leadless sensor is enclosed by an enclosure which is coupled to the substrate and surrounds the sensor. The enclosure has a screen positioned on the top surface to prevent particles from entering or damaging the leadless sensor. The above-noted structure forms a very flat, compact pressure transducer which can be utilized in lieu of flex circuit type devices and provides greater mechanical stability as well as a more accurate output.

Abstract: There is disclosed a flat planar pressure transducer which comprises a planar insulative substrate of a rectangular configuration. Disposed on the substrate is an array of conductive areas which extend from a contact terminal area of said substrate to an end of the substrate. There is a leadless sensor module positioned at said contact terminal area, with the contacts of said leadless sensor contacting contact terminals of said contact terminal area. The leadless sensor is enclosed by an enclosure which is coupled to the substrate and surrounds the sensor. The enclosure has a screen positioned on the top surface to prevent particles from entering or damaging the leadless sensor. The above-noted structure forms a very flat, compact pressure transducer which can be utilized in lieu of flex circuit type devices and provides greater mechanical stability as well as a more accurate output.

Abstract: There is disclosed flat planar pressure transducer which comprises a planar insulative substrate of a rectangular configuration. Disposed on the substrate is an array of conductive areas which extend from a contact terminal area of said substrate to an end of the substrate. There is a leadless sensor module positioned at said contact terminal area, with the contacts of said leadless sensor contacting contact terminals of said contact terminal area. The leadless sensor is enclosed by an enclosure which is coupled to the substrate and surrounds the sensor. The enclosure has a screen positioned on the top surface to prevent particles from entering or damaging the leadless sensor. The above-noted structure forms a very flat, compact pressure transducer which can be utilized in lieu of flex circuit type devices and provides greater mechanical stability as well as a more accurate output.

Abstract: There is disclosed a method and apparatus for mounting a leadless semiconductor chip on a header. The semiconductor chip has contacts on a surface and the chip is of a specified geometric shape. The header has a contact surface for receiving the chip with the contact surface of the header containing header contact pins, which pins have to contact the contacts on the semiconductor chip. The header has a guide pin extending from the contact surface and there is a guide plate which has an aperture adapted to be placed over the guide pin, the guide plate further has a chip accommodating aperture of the same geometric shape as the chip. The guide plate, when placed over the guide pin enables the chip to be placed in the chip accommodating aperture so that the contacts of the header pin are properly and accurately aligned with respect to the contacts on the semiconductor chip.

Abstract: There is disclosed flat planar pressure transducer which comprises a planar insulative substrate of a rectangular configuration. Disposed on the substrate is an array of conductive areas which extend from a contact terminal area of said substrate to an end of the substrate. There is a leadless sensor module positioned at said contact terminal area, with the contacts of said leadless sensor contacting contact terminals of said contact terminal area. The leadless sensor is enclosed by an enclosure which is coupled to the substrate and surrounds the sensor. The enclosure has a screen positioned on the top surface to prevent particles from entering or damaging the leadless sensor. The above-noted structure forms a very flat, compact pressure transducer which can be utilized in lieu of flex circuit type devices and provides greater mechanical stability as well as a more accurate output.

Abstract: A pressure header assembly has a closed front and back surface. The back surface has an aperture for accommodating a separate dual die pressure header. The dual die pressure header has an absolute and differential pressure sensor positioned thereon. A differential pressure port is located on a side surface of the pressure header assembly and is directed to a bore in the pressure header assembly. The bore contains an elongated tube which is positioned in the pressure header assembly and locked in place by means of a crush nut and locking nut assembly. One end of the tube is coupled to the differential pressure port, while the other end of the tube accommodates a differential pressure tube which is bent in an arcuate position and directed to the underside of the sensor of the differential sensor assembly mounted in the dual die pressure header.

Abstract: There is disclosed a method and apparatus for mounting a leadless semiconductor chip on a header. The semiconductor chip has contacts on a surface and the chip is of a specified geometric shape. The header has a contact surface for receiving the chip with the contact surface of the header containing header contact pins, which pins have to contact the contacts on the semiconductor chip. The header has a guide pin extending from the contact surface and there is a guide plate which has an aperture adapted to be placed over the guide pin, the guide plate further has a chip accommodating aperture of the same geometric shape as the chip. The guide plate, when placed over the guide pin enables the chip to be placed in the chip accommodating aperture so that the contacts of the header pin are properly and accurately aligned with respect to the contacts on the semiconductor chip.

Abstract: An accelerometer includes a cantilever mass with a thin beam element between the mass and the fixed end of the accelerometer. The end of the mass is tapered. A limiting member has an aperture that is tapered corresponding to the taper at the end of the mass and positioned to surround the tapered end of the seismic mass. The beam accelerometer as well as the limiting member is placed in a cylindrical housing whereby the limiting member is moved along the taper of the seismic mass to adjust the spacing between the limiting member and the inner wall of the housing to thereby adjust the amount of movement of the seismic mass. In one embodiment the aperture of the tapered limited member also surrounds the seismic mass but the gap between the inner wall of the tapered limiting member and the outer wall of the seismic mass is adjusted to determine the amount of movement of the beam.

Abstract: A pressure header assembly has a closed front and back surface. The back surface has an aperture for accommodating a separate dual die pressure header. The dual die pressure header has an absolute and differential pressure sensor positioned thereon. A differential pressure port is located on a side surface of the pressure header assembly and is directed to a bore in the pressure header assembly. The bore contains an elongated tube which is positioned in the pressure header assembly and locked in place by means of a crush nut and locking nut assembly. One end of the tube is coupled to the differential pressure port, while the other end of the tube accommodates a differential pressure tube which is bent in an arcuate position and directed to the underside of the sensor of the differential sensor assembly mounted in the dual die pressure header.

Abstract: A pressure header assembly has a closed front and back surface. The back surface has an aperture for accommodating a separate dual die pressure header. The dual die pressure header has an absolute and differential pressure sensor positioned thereon. A differential pressure port is located on a side surface of the pressure header assembly and is directed to a bore in the pressure header assembly. The bore contains an elongated tube which is positioned in the pressure header assembly and locked in place by means of a crush nut and locking nut assembly. One end of the tube is coupled to the differential pressure port, while the other end of the tube accommodates a differential pressure tube which is bent in an arcuate position and directed to the underside of the sensor of the differential sensor assembly mounted in the dual die pressure header.

Abstract: An accelerometer includes a cantilever mass with a thin beam element between the mass and the fixed end of the accelerometer. The end of the mass is tapered. A limiting member has an aperture that is tapered corresponding to the taper at the end of the mass and positioned to surround the tapered end of the seismic mass. The beam accelerometer as well as the limiting member is placed in a cylindrical housing whereby the limiting member is moved along the taper of the seismic mass to adjust the spacing between the limiting member and the inner wall of the housing to thereby adjust the amount of movement of the seismic mass. In one embodiment the aperture of the tapered limited member also surrounds the seismic mass but the gap between the inner wall of the tapered limiting member and the outer wall of the seismic mass is adjusted to determine the amount of movement of the beam.

Abstract: A low cost sensor assembly for measuring oxygen pressures contains a transistor header. The transistor header has terminal pins extending therefrom. The transistor header co-acts with a first circuit insulator board. The first circuit board has deposited thereon four hand mirror shaped contact areas each one associated with one of the terminal pins of the transistor header. The top portion of each contact areas has an aperture with the extending arm of the area directed towards the center of the board. The board is epoxied to the transistor header with the terminal pins of the header extending into the apertures of the contact board. A second contact board is then epoxied to the first contact board. The second contact board has a series of four apertures located at the center. Each of the apertures of the second board contacts the handle portion of the mirror patterns of the first board.

Abstract: A low cost sensor assembly for measuring oxygen pressures contains a transistor header. The transistor header has terminal pins extending therefrom. The transistor header co-acts with a first circuit insulator board. The first circuit board has deposited thereon four hand mirror shaped contact areas each one associated with one of the terminal pins of the transistor header. The top portion of each contact areas has an aperture with the extending arm of the area directed towards the center of the board. The board is epoxied to the transistor header with the terminal pins of the header extending into the apertures of the contact board. A second contact board is then epoxied to the first contact board. The second contact board has a series of four apertures located at the center. Each of the apertures of the second board contacts the handle portion of the mirror patterns of the first board.

Abstract: A pressure header assembly has a closed front and back surface. The back surface has an aperture for accommodating a separate dual die pressure header. The dual die pressure header has an absolute and differential pressure sensor positioned thereon. A differential pressure port is located on a side surface of the pressure header assembly and is directed to a bore in the pressure header assembly. The bore contains an elongated tube which is positioned in the pressure header assembly and locked in place by means of a crush nut and locking nut assembly. One end of the tube is coupled to the differential pressure port, while the other end of the tube accommodates a differential pressure tube which is bent in an arcuate position and directed to the underside of the sensor of the differential sensor assembly mounted in the dual die pressure header.

Abstract: A pressure header assembly has a closed front and back surface. The back surface has an aperture for accommodating a separate dual die pressure header. The dual die pressure header has an absolute and differential pressure sensor positioned thereon. A differential pressure port is located on a side surface of the pressure header assembly and is directed to a bore in the pressure header assembly. The bore contains an elongated tube which is positioned in the pressure header assembly and locked in place by means of a crush nut and locking nut assembly. One end of the tube is coupled to the differential pressure port, while the other end of the tube accommodates a differential pressure tube which is bent in an arcuate position and directed to the underside of the sensor of the differential sensor assembly mounted in the dual die pressure header.

Abstract: Methods, systems, and data structures are provided for assigning categories to electronic mail (email). An email includes a category identification field, a sender category identification field, and a receiver category identification field. When the email is transmitted any sender assigned category identification being made by the sender is placed in the sender category identification field, and any previous value contained in the sender category identification field is moved to the category identification field and the receiver category identification field. In some embodiments, the sender category identification field and the receiver category identification field can include distribution lists associated with multiple senders and multiple receivers of the email. When the email is received any value included in the category identification field is presented with the email.

Abstract: A silicon wafer is fabricated utilizing two or more semiconductor wafers. The wafers are processed using conventional wafer processing techniques and the wafer contains a plurality of output terminals which essentially are platinum titanium metallization or high temperature contacts. A glass cover member is provided which has a plurality of through holes. Each through hole is associated with a contact on the semiconductor wafer. A high temperature lead is directed through the through hole or aperture in the glass cover and is bonded directly to the appropriate contact. The lead is of a sufficient length to extend into a second non through aperture in the contact glass. The non through aperture is located on the side of the contact glass not in contact with the silicon sensor. The non through aperture is then filled with a high temperature conductive glass frit. A plurality of slots are provided.