Abstract: Provided herein is a catheter lock. The catheter lock includes a hub having a first axial extension, a second axial extension, and an intersecting opening with at least one hub feature formed on an inner surface thereof; a button having an outer surface mirroring the inner surface of the intersecting opening and at least one button feature formed thereon, an elongated transverse opening, a cutout section extending along the outer surface of the button, and a hole in a top portion thereof; and a locking article configured to extend through the first axial extension, along the cutout section, and through the hole. The button is arranged and disposed to slide within the intersecting opening of the hub, and the at least one button feature is arranged and disposed to engage one of the at least one hub features. Also provided herein are an axial catheter lock and a locking catheter.

Abstract: Endless belts, such as for use with e-bikes and other personal mobility systems such as standard bicycles, wheelchairs, scooters including electric scooters, and other systems that utilize a belt for transmitting power to impart motion to the system. The belts are particularly suited for inhibiting “tooth jumping” during use, having a curvature coefficient of no more than 0.01%, and in some embodiments less than 0.005%, with a compressibility coefficient of no more than 0.00075. The belts can utilize reinforcing cords, such as carbon cords, which when incorporated into the final belt, some cords have an open porosity of 10 vol-% or less, in some embodiments 5 vol-% or less.

Abstract: Disclosed is a computerized method which receives energy consumption data from all sources used for the operational functioning of a building, converts consumed energy to BTU form, and establishes a historical energy footprint. System compiles these records for storage in a database capable of sorting data by category and/or value and compares energy to that used by structures of similar construction type and climate zone, improved and unimproved. System and method compares cost to yield data, concluding with the most cost effective and energy efficient method of modifying structures to predictably reduce its energy footprint/consumption per the database of energy consumption patterns. The system measures structures after improvements to verify reduced energy consumption.

Abstract: A chip with resistive, metallic strain gauges distributed on surfaces on and buried within the chip. Also, vertically arranged vias and vertical thin film resistive strain gauges are described. The resistive strain gauges can be multiplexed wherein strain can be measured across the topology of the chip in each of the top, bottom and buried layers and any vertical strain. The resistive strain gauges may be in serpentine patterns and may be arranged on via or on vertical edges of grooves that extend from an upper or lower surface of the chip to buried layers. In this fashion, the distributed strain gauges may be used to map the strain throughout the body of a chip. A Kelvin bridge may be used to measure the strain, but other such measuring techniques and devices may be used.

Abstract: Disclosed are semiconductor die packages having overlapping dice, systems that use such packages, and methods of making such packages. An exemplary die package comprises a leadframe, a first semiconductor die, and a second semiconductor die that has a recessed portion in one of its surfaces. The first die is disposed over a first portion of the leadframe, and the second die is disposed over a second portion of the leadframe with its recess portion overlying at least a portion of the first die. Another exemplary die package comprises a leadframe with a recessed area, a first semiconductor die disposed in the recessed area, and a second semiconductor die overlying at least a portion of the first die. Preferably, electrically conductive regions of both dice are electrically coupled to a conductive region of the leadframe to provide an interconnection between dice that has very low parasitic capacitance and inductance.

Abstract: Disclosed are premolded substrates for semiconductor die packages and methods of making such substrates. An exemplary premolded substrate comprises a leadframe having a first surface, a second surface, a central portion disposed between the first and second surfaces, and a plurality of electrically conductive leads disposed about the central portion; a body of electrically insulating material disposed in a portion of the central portion of the leadframe and between the leads of the leadframe; and an aperture disposed in the leadframe's central portion and between the leadframe's first and second surfaces.

Abstract: Disclosed are semiconductor die packages having overlapping dice, systems that use such packages, and methods of making such packages. An exemplary die package comprises a leadframe, a first semiconductor die, and a second semiconductor die that has a recessed portion in one of its surfaces. The first die is disposed over a first portion of the leadframe, and the second die is disposed over a second portion of the leadframe with its recess portion overlying at least a portion of the first die. Another exemplary die package comprises a leadframe with a recessed area, a first semiconductor die disposed in the recessed area, and a second semiconductor die overlying at least a portion of the first die. Preferably, electrically conductive regions of both dice are electrically coupled to a conductive region of the leadframe to provide an interconnection between dice that has very low parasitic capacitance and inductance.

Abstract: A chip with resistive, metallic strain gauges distributed on surfaces on and buried within the chip. Also, vertically arranged vias and vertical thin film resistive strain gauges are described. The resistive strain gauges can be multiplexed wherein strain can be measured across the topology of the chip in each of the top, bottom and buried layers and any vertical strain. The resistive strain gauges may be in serpentine patterns and may be arranged on via or on vertical edges of grooves that extend from an upper or lower surface of the chip to buried layers. In this fashion, the distributed strain gauges may be used to map the strain throughout the body of a chip. A Kelvin bridge may be used to measure the strain, but other such measuring techniques and devices may be used.

Abstract: A wire bonding pad over an active area of a semiconductor die has grooves in two orthogonal sections thereof in the top surface of said wire bonding pad.

Abstract: A gaming machine for conducting a wagering game includes a game display and at least one illumination device. The game display is for displaying the wagering game and the illumination device is for presenting artistic elements such as marquee lettering and candle lighting. One aspect of the illumination device is a formed material with at least one LED embedded within. The formed material contains light dispersion particles and is of a nature that allows the light from the embedded LEDs to emit from the surface in an effectively uniform manner. In a different embodiment, an illumination device, comprised of a colored light source, associated electronic components that are enclosed within the gaming machine's housing, and a transparent object, directs light from the light source through the structure of the transparent object positioned over the source, and displays the color and intended intensity of the light on an altered surface on the transparent object.

Abstract: A gaming machine for conducting a wagering game includes a game display and a top box display. The game display is for displaying the wagering game. The top box display includes a standard substructure for attaching subassemblies. The substructure contains fixed connection points allowing subassemblies to be developed in a fashion consistent with the substructure, thus simplifying the ability to swap components and reducing the dependence on unique internal part designs.