Patents by Inventor Scott J. Limb
Scott J. Limb has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11904986Abstract: An apparatus includes a structure comprising a predetermined breakable region and a mechanical actuator disposed at or proximate the predetermined breakable region. The mechanical actuator comprises an impact member coupled to a spring arrangement, and a restraint member operably coupled to the spring arrangement. A trigger source is operably coupled to an electrical power source. The trigger source, in response to receiving current from the electrical power source, is configured to release or break the restraint member so as to allow the spring arrangement to forcibly move the impact member into contact with, and break, the predetermined breakable region.Type: GrantFiled: December 21, 2020Date of Patent: February 20, 2024Assignee: XEROX CORPORATIONInventors: Christopher L. Chua, Norine E. Chang, Julie Ann Bert, Scott J. Limb, Steven Neltner, Eric Cocker
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Patent number: 11459266Abstract: An apparatus comprises a stressed glass member and an actuator mounted on the stressed glass member. A power source is coupled to the actuator. An abrasion structure is disposed between the actuator and the stressed glass member. The abrasion structure comprises abrading features in contact with the stressed glass member. The abrading features have a hardness higher than a hardness of the stressed glass member. When energized by the power source, the actuator is configured to induce movement of the abrasion structure that causes the abrading features to create scratches in the stressed glass member to a depth sufficient to initiate fracture of the stressed glass member.Type: GrantFiled: June 16, 2020Date of Patent: October 4, 2022Assignee: Palo Alto Research Center IncorporatedInventors: Kathryn Murphy, Scott J. Limb, David Mathew Johnson
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Publication number: 20220194524Abstract: An apparatus includes a structure comprising a predetermined breakable region and a mechanical actuator disposed at or proximate the predetermined breakable region. The mechanical actuator comprises an impact member coupled to a spring arrangement, and a restraint member operably coupled to the spring arrangement. A trigger source is operably coupled to an electrical power source. The trigger source, in response to receiving current from the electrical power source, is configured to release or break the restraint member so as to allow the spring arrangement to forcibly move the impact member into contact with, and break, the predetermined breakable region.Type: ApplicationFiled: December 21, 2020Publication date: June 23, 2022Inventors: Christopher L. Chua, Norine E. Chang, Julie Ann Bert, Scott J. Limb, Steven Neltner, Eric Cocker
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Patent number: 11107645Abstract: A device includes at least one stress-engineered portion and at least one second portion. The stress-engineered portion includes at least one tensile stress layer having a residual tensile stress and at least one compressive stress layer having a residual compressive stress. The tensile stress layer and the compressive stress layer are mechanically coupled such that the at least one tensile stress layer and the at least one compressive stress layer are self-equilibrating. The stress-engineered portion is configured to fracture due to propagating cracks generated in response to energy applied to the stress-engineered portion. Fracture of the stress-engineered portion changes functionality of the device from a first function to a second function, different from the first function.Type: GrantFiled: November 29, 2018Date of Patent: August 31, 2021Assignee: Palo Alto Research Center IncorporatedInventors: Scott J. Limb, Christopher Paulson, Erica Ronchetto
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Patent number: 10947150Abstract: A system includes a stress-engineered substrate comprising at least one tensile stress layer having a residual tensile stress and at least one compressive stress layer having a residual compressive stress. The at least one tensile layer and the at least one compressive layer are coupled such that the at least one tensile stress layer and the at least one compressive stress layer are self-equilibrating. At least one functional device is disposed on the stress-engineered substrate. The stress-engineered substrate is configured to fracture in response to energy applied to the substrate. Fracturing the stress-engineered substrate also fractures the functional device. The system includes at least one decoy device. Fragments of the decoy device are configured to obscure one or more physical characteristics of the functional device and/or one or more functional characteristics of the functional device after the functional device is fractured.Type: GrantFiled: December 3, 2018Date of Patent: March 16, 2021Assignee: Palo Alto Research Center IncorporatedInventors: Scott J. Limb, Patrick Murphy
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Patent number: 10950406Abstract: A transient electronic device includes electronic elements (e.g., an SOI- or chip-based IC) and a trigger mechanism disposed on a frangible glass substrate. The trigger mechanism includes a switch that initiates a large trigger current through a self-limiting resistive element in response to a received trigger signal. The self-limiting resistive element includes a resistor portion that generates heat in response to the trigger current, thereby rapidly increasing the temperature of a localized (small) region of the frangible glass substrate, and a current limiting portion (e.g., a fuse) that self-limits (terminates) the trigger current after a predetermined amount of time, causing the localized region to rapidly cool down.Type: GrantFiled: June 6, 2019Date of Patent: March 16, 2021Assignee: Palo Alto Research Center IncorporatedInventors: Gregory Whiting, Scott J. Limb, Christopher L. Chua, Sean Garner, Sylvia J. Smullin, Qian Wang, Rene A. Lujan
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Patent number: 10903176Abstract: A self-destructing device includes a stressed substrate with a heater thermally coupled to the stressed substrate. The device includes a power source and trigger circuitry comprising a sensor and a switch. The sensor generates a trigger signal when exposed to a trigger stimulus. The switch couples the power source to the heater in response to the trigger signal When energized by the power source, the heater generates heat sufficient to initiate self-destruction of the stressed substrate.Type: GrantFiled: January 25, 2019Date of Patent: January 26, 2021Assignee: Palo Alto Research Center IncorporatedInventors: Christopher L. Chua, JengPing Lu, Gregory Whiting, Scott J. Limb, Rene A. Lujan, Qian Wang
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Publication number: 20200308041Abstract: An apparatus comprises a stressed glass member and an actuator mounted on the stressed glass member. A power source is coupled to the actuator. An abrasion structure is disposed between the actuator and the stressed glass member. The abrasion structure comprises abrading features in contact with the stressed glass member. The abrading features have a hardness higher than a hardness of the stressed glass member. When energized by the power source, the actuator is configured to induce movement of the abrasion structure that causes the abrading features to create scratches in the stressed glass member to a depth sufficient to initiate fracture of the stressed glass member.Type: ApplicationFiled: June 16, 2020Publication date: October 1, 2020Inventors: Kathryn Murphy, Scott J. Limb, David Mathew Johnson
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Patent number: 10717669Abstract: An apparatus comprises a stressed glass member and an actuator mounted on the stressed glass member. A power source is coupled to the actuator. An abrasion structure is disposed between the actuator and the stressed glass member. The abrasion structure comprises abrading features in contact with the stressed glass member. The abrading features have a hardness higher than a hardness of the stressed glass member. When energized by the power source, the actuator is configured to induce movement of the abrasion structure that causes the abrading features to create scratches in the stressed glass member to a depth sufficient to initiate fracture of the stressed glass member.Type: GrantFiled: May 16, 2018Date of Patent: July 21, 2020Assignee: Palo Alto Research Center IncorporatedInventors: Kathryn Murphy, Scott J. Limb, David Mathew Johnson
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Publication number: 20200176200Abstract: A device includes at least one stress-engineered portion and at least one second portion. The stress-engineered portion includes at least one tensile stress layer having a residual tensile stress and at least one compressive stress layer having a residual compressive stress. The tensile stress layer and the compressive stress layer are mechanically coupled such that the at least one tensile stress layer and the at least one compressive stress layer are self-equilibrating. The stress-engineered portion is configured to fracture due to propagating cracks generated in response to energy applied to the stress-engineered portion. Fracture of the stress-engineered portion changes functionality of the device from a first function to a second function, different from the first function.Type: ApplicationFiled: November 29, 2018Publication date: June 4, 2020Inventors: Scott J. Limb, Christopher Paulson, Erica Ronchetto
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Publication number: 20200172430Abstract: A system includes a stress-engineered substrate comprising at least one tensile stress layer having a residual tensile stress and at least one compressive stress layer having a residual compressive stress. The at least one tensile layer and the at least one compressive layer are coupled such that the at least one tensile stress layer and the at least one compressive stress layer are self-equilibrating. At least one functional device is disposed on the stress-engineered substrate. The stress-engineered substrate is configured to fracture in response to energy applied to the substrate. Fracturing the stress-engineered substrate also fractures the functional device. The system includes at least one decoy device. Fragments of the decoy device are configured to obscure one or more physical characteristics of the functional device and/or one or more functional characteristics of the functional device after the functional device is fractured.Type: ApplicationFiled: December 3, 2018Publication date: June 4, 2020Inventors: Scott J. Limb, Patrick Murphy
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Publication number: 20190352216Abstract: An apparatus comprises a stressed glass member and an actuator mounted on the stressed glass member. A power source is coupled to the actuator. An abrasion structure is disposed between the actuator and the stressed glass member. The abrasion structure comprises abrading features in contact with the stressed glass member. The abrading features have a hardness higher than a hardness of the stressed glass member. When energized by the power source, the actuator is configured to induce movement of the abrasion structure that causes the abrading features to create scratches in the stressed glass member to a depth sufficient to initiate fracture of the stressed glass member.Type: ApplicationFiled: May 16, 2018Publication date: November 21, 2019Inventors: Kathryn Murphy, Scott J. Limb, David Mathew Johnson
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Publication number: 20190311872Abstract: A transient electronic device includes electronic elements (e.g., an SOI- or chip-based IC) and a trigger mechanism disposed on a frangible glass substrate. The trigger mechanism includes a switch that initiates a large trigger current through a self-limiting resistive element in response to a received trigger signal. The self-limiting resistive element includes a resistor portion that generates heat in response to the trigger current, thereby rapidly increasing the temperature of a localized (small) region of the frangible glass substrate, and a current limiting portion (e.g., a fuse) that self-limits (terminates) the trigger current after a predetermined amount of time, causing the localized region to rapidly cool down.Type: ApplicationFiled: June 6, 2019Publication date: October 10, 2019Inventors: Gregory Whiting, Scott J. Limb, Christopher L. Chua, Sean Garner, Sylvia J. Smullin, Qian Wang, Rene A. Lujan
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Patent number: 10332717Abstract: A transient electronic device includes electronic elements (e.g., an SOI- or chip-based IC) and a trigger mechanism disposed on a frangible glass substrate. The trigger mechanism includes a switch that initiates a large trigger current through a self-limiting resistive element in response to a received trigger signal. The self-limiting resistive element includes a resistor portion that generates heat in response to the trigger current, thereby rapidly increasing the temperature of a localized (small) region of the frangible glass substrate, and a current limiting portion (e.g., a fuse) that self-limits (terminates) the trigger current after a predetermined amount of time, causing the localized region to rapidly cool down.Type: GrantFiled: July 12, 2018Date of Patent: June 25, 2019Assignee: Palo Alto Research Center IncorporatedInventors: Gregory Whiting, Scott J. Limb, Christopher L. Chua, Sean Garner, Sylvia J. Smullin, Qian Wang, Rene A. Lujan
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Publication number: 20190172800Abstract: A self-destructing device includes a stressed substrate with a heater thermally coupled to the stressed substrate. The device includes a power source and trigger circuitry comprising a sensor and a switch. The sensor generates a trigger signal when exposed to a trigger stimulus. The switch couples the power source to the heater in response to the trigger signal When energized by the power source, the heater generates heat sufficient to initiate self-destruction of the stressed substrate.Type: ApplicationFiled: January 25, 2019Publication date: June 6, 2019Inventors: Christopher L. Chua, JengPing Lu, Gregory Whiting, Scott J. Limb, Rene A. Lujan, Qian Wang
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Patent number: 10224297Abstract: A self-destructing device includes a stressed substrate with a heater thermally coupled to the stressed substrate. The device includes a power source and trigger circuitry comprising a sensor and a switch. The sensor generates a trigger signal when exposed to a trigger stimulus. The switch couples the power source to the heater in response to the trigger signal When energized by the power source, the heater generates heat sufficient to initiate self-destruction of the stressed substrate.Type: GrantFiled: July 26, 2016Date of Patent: March 5, 2019Assignee: Palo Alto Research Center IncorporatedInventors: Christopher L. Chua, Jeng Ping Lu, Gregory Whiting, Scott J. Limb, Rene A. Lujan, Qian Wang
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Publication number: 20180330907Abstract: A transient electronic device includes electronic elements (e.g., an SOI- or chip-based IC) and a trigger mechanism disposed on a frangible glass substrate. The trigger mechanism includes a switch that initiates a large trigger current through a self-limiting resistive element in response to a received trigger signal. The self-limiting resistive element includes a resistor portion that generates heat in response to the trigger current, thereby rapidly increasing the temperature of a localized (small) region of the frangible glass substrate, and a current limiting portion (e.g., a fuse) that self-limits (terminates) the trigger current after a predetermined amount of time, causing the localized region to rapidly cool down.Type: ApplicationFiled: July 12, 2018Publication date: November 15, 2018Inventors: Gregory Whiting, Scott J. Limb, Christopher L. Chua, Sean Garner, Sylvia J. Smullin, Qian Wang, Rene A. Lujan
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Patent number: 10038267Abstract: A circuit interconnect generally comprises an electrical connection pad, a shape memory material, and a flowable conductor. The electrical connection pad has an upper surface, a portion of which is covered by the shape memory material. The flowable conductor extends through the shape memory material and is electrically coupled to the electrical connection pad. The shape memory material has a first configuration at a first temperature and a second configuration at a second temperature. In the instance of the second temperature being greater than the first, the shape memory material has a first configuration that is substantially planar and a second configuration that is cupped.Type: GrantFiled: June 12, 2014Date of Patent: July 31, 2018Assignee: Palo Alto Research Center IncorporatedInventor: Scott J. Limb
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Patent number: 10026651Abstract: A method of making a substrate involves patterning the substrate into active areas and dicing lanes. After the substrate is patterned one or more stress layers are formed the substrate. A change in stress along a thickness of the substrate in the active areas is larger than a change in stress along the thickness of the substrate in the dicing lanes. The substrate is subsequently diced along the dicing lanes.Type: GrantFiled: June 21, 2017Date of Patent: July 17, 2018Assignee: Palo Alto Research Center IncorporatedInventor: Scott J. Limb
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Patent number: 10026579Abstract: A transient electronic device includes electronic elements (e.g., an SOI- or chip-based IC) and a trigger mechanism disposed on a frangible glass substrate. The trigger mechanism includes a switch that initiates a large trigger current through a self-limiting resistive element in response to a received trigger signal. The self-limiting resistive element includes a resistor portion that generates heat in response to the trigger current, thereby rapidly increasing the temperature of a localized (small) region of the frangible glass substrate, and a current limiting portion (e.g., a fuse) that self-limits (terminates) the trigger current after a predetermined amount of time, causing the localized region to rapidly cool down.Type: GrantFiled: July 26, 2016Date of Patent: July 17, 2018Assignee: Palo Alto Research Center IncorporatedInventors: Gregory Whiting, Scott J. Limb, Christopher L. Chua, Sean Garner, Sylvia J. Smullin, Qian Wang, Rene A. Lujan