Patents by Inventor Scott Martin

Scott Martin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11626551
    Abstract: Additional “auxiliary” bumps are used to stabilize alignment and reduce slippage of dense arrays of interconnect bumps on opposing die during a bonding process. One example of auxiliary bumps are interdigitated bumps. Interdigitated bumps are more self-aligning and laterally stable because bumps do not meet head-to-head. Rather, the head of a bump on one die falls into the space between bumps on the other die. Another example of auxiliary bumps are nail bumps. In nail bumps, one bump is harder (the nail) and “drives” into the opposing softer bump during bonding. This constrains the lateral movement of the two bumps relative to each other and reduces lateral slippage. In some embodiments, the auxiliary bumps and interconnect bumps are formed in the same process, and also bonded in the same process.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: April 11, 2023
    Assignee: Tectus Corporation
    Inventors: Nachiket Raghunath Raravikar, Arnold Daguio, Kwong-Hin Henry Choy, Tigran Nshanian, Paul Scott Martin
  • Publication number: 20230107361
    Abstract: Electrical connectors for very high speed signals, including signals at frequencies at or above 112 GHz, with high density. Such connectors may be formed with fine features molded into portions of the connector housing to support closely spaced signal conductors. The signal conducts may nonetheless be accurately positioned, which leads to uniform impedance and other electrical characteristics that enable high frequency operation through the use of skeletal members that restrain bowing and twisting of housing components that position, directly or indirectly, the signal conductors. The skeletal members may be simply incorporated into the housing components by stamping a metal skeleton from a metal sheet in conjunction with one or more carrier strips. The housing component may be overmolded around the skeleton and then severed from the carrier strips.
    Type: Application
    Filed: January 27, 2021
    Publication date: April 6, 2023
    Applicant: FCI USA LLC
    Inventors: James J. Muha, Scott Martin, Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Jason John Ellison, Jan De Geest, Charles Copper, Mark R. Gray, William Tanis, Steven E. Minich
  • Publication number: 20230071501
    Abstract: An aspect of the present disclosure is directed to a connector. The connector is suited to connectorizing exactly two conductors. The connector includes a forward connector body, a rear connector body, a metal frame and exactly two electrical contacts. The rear connector body interfaces with the forward connector body. Further, the metal frame, which includes a shielding interface, surrounds at least a portion of both the forward and rear connector bodies. The electrical contacts extend from the rear connector body into the forward connector body. A first of the electrical contacts is electrically coupled to a first conductor of a shielded cable and the second of the electrical contacts is electrically coupled to a second conductor of the shielded cable. The shield interface of the metal frame is electrically coupled to the shield of the shielded cable.
    Type: Application
    Filed: June 13, 2022
    Publication date: March 9, 2023
    Applicant: COMMSCOPE TECHNOLOGIES LLC
    Inventors: Shawn Phillip TOBEY, Paul John PEPE, Scott Martin KEITH, Jeffrey A. OBERSKI
  • Publication number: 20230062661
    Abstract: Electrical connectors for very high speed signals, including signals at or above 112 Gbps. Effectiveness of shielding along the signal paths through the mating electrical connectors may be enhanced through the use of one or more techniques, including enabling two-sided shielding, connections between shield members and between shield members and grounded structures of printed circuit boards to which the connectors are mounted, and selective positioning of lossy material. Such techniques may be simply and reliably implemented in high density connector using one or more techniques. An electrical connector may include core members held by a housing together with leadframe assemblies attached to the core members. The core members may include features that would be difficult to mold in a housing and may include both shields and lossy materials in locations that would be difficult to incorporate in a leadframe assembly.
    Type: Application
    Filed: September 2, 2022
    Publication date: March 2, 2023
    Applicant: FCI USA LLC
    Inventors: Douglas M. Johnescu, Gregory A. Hull, Mark Lauermann, Scott Martin, Jason John Ellison, Jan De Geest, Charles Copper, Mark R. Gray, William Tanis, Steven E. Minich
  • Publication number: 20230069745
    Abstract: A multi-fiber fiber optic connector is provided having features that allow for changeability with respect to gender. A pin retention structure is configured to retain a pair of alignment pins and includes a pin-holder body with a pair of pin openings and a U-shaped spring clip. The spring clip including a base portion and two opposing legs, and is movable between a pin retaining position and a pin release position. When the spring clip is in the pin retaining position, the two opposing legs engage with outer sides of each of the alignment pins, and when the spring clip is in the pin release position, the base portion flexes inwardly and the two opposing legs disengage with the outer sides of each of the alignment pins.
    Type: Application
    Filed: January 15, 2021
    Publication date: March 2, 2023
    Applicant: COMMSCOPE TECHNOLOGIES LLC
    Inventors: Scott Martin KEITH, Bradley Scott BILLMAN
  • Publication number: 20230053449
    Abstract: Provided herein are antibodies to DC-SIGN, conjugates of DC-SiGN antibodies, and DC-SiGN antibody fusion proteins and the use of such antibodies, conjugates, and fusion proteins for the treatment of diseases such as cancer.
    Type: Application
    Filed: October 30, 2019
    Publication date: February 23, 2023
    Inventors: Lisa BARNETT, Steven BENDER, Alex Cortez, Sarah COX, Jonathan DEANE, Scott Martin GLASER, Ben WEN, Tom Yao-Hsiang WU
  • Patent number: 11573555
    Abstract: Systems and methods are disclosed for inspection, maintenance, debris removal, and cleaning of environments that may be difficult to access and hazardous. The system comprises a mast assembly, an arm assembly, a debris removal system, and a drive system. The mast assembly comprises an inner mast and an outer mast having a central axis about which the arm assembly revolves. The arm assembly provides support for the debris removal system. The debris removal system comprises a bucket tool, a plow tool, and one or more hoses for clearing and removing debris. The drive system comprises a plurality of one or more of cables, pulleys, rollers, and hoists to at least one of control motion of the arm assembly, raise and lower the inner mast, and position and control at least one of the bucket tool and the plow tool. The system is at least one of manually or automatically controlled.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: February 7, 2023
    Assignee: Veolia Nuclear Solutions, Inc.
    Inventors: Jacob Riesenweber, Matthew Denver Cole, Scott Martin
  • Patent number: 11574562
    Abstract: A device for training users in a proper mixing of pharmaceutical components, or for aiding in the mixing, or for performing the mixing, and administration of pharmaceutical components is disclosed. The device comprises a housing for receiving a pharmaceutical delivery device containing the pharmaceutical components. There is also a microcontroller disposed in the housing and a motion/orientation detection device disposed within or on the housing and in communication with the microcontroller. A method for use of the device is also disclosed, along with a substance for use as one of the pharmaceutical components.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: February 7, 2023
    Assignee: Janssen Pharmaceutica NV
    Inventors: Peter A. Krulevitch, Ian Scrimgeour, Scott Martin, James McLusky, James Glencross, Blair Hutton, Nick Foley, Jose Antonio Buron Vidal
  • Patent number: 11571821
    Abstract: A robotic arm control system including a robotic arm configured to deploy one or more tools in an operating space, one or more sensors, and a control system operably configured to: scan the operating space with the one or more sensors, identify a surface of the operating space based at least in part upon information sensed by the one or more sensors, establish a virtual barrier offset from the surface, and limit movement of the robotic arm based at least in part upon the virtual barrier.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: February 7, 2023
    Assignee: Veolia Nuclear Solutions, Inc.
    Inventors: Scott Martin, Paul Linnebur, Marc Rood, Matt Denver Cole
  • Patent number: 11548054
    Abstract: The present application is directed to a double seam modification tooling apparatus for double seam modification and the double seam modification process. More particularly, a tooling apparatus for double seam modification is provided which adds a third modification operation to the first and second double seam operations which form the finished double seam, as well as a process for modifying double seams to include patterns of integral slots, notches or threads, or the like, after the double seams have been previously completely formed by the double seam modification tooling apparatus. Child resistant lids can then be configured with mating tab notches or tab threads to allow for opening or closing the lid when the tabs are properly aligned with the notches and threads on the can rim modified double seams.
    Type: Grant
    Filed: December 2, 2020
    Date of Patent: January 10, 2023
    Assignee: N2 PACKAGING SYSTEMS, LLC
    Inventor: Randy Scott Martin
  • Publication number: 20220407269
    Abstract: A direct mate orthogonal connector for a high density of high speed signals. The connector may include right angle leadframe assemblies with signal conductive elements and ground shields held by a leadframe housing. High frequency performance may be achieved with members on the leadframe that transfer force between a connector housing, holding the leadframe assemblies, and a portion of the leadframe housing holding the signal conductive elements and the shields near their mounting ends. Core members may be inserted into the housing and mating ends of the conductive elements of ground shields may be adjacent the core members, enabling electrical and mechanical performance of the mating interface to be defined by the core members. The core members may incorporate insulative and lossy features that may be complex to form as part of the connector housing but may be readily formed as part of a separate core member.
    Type: Application
    Filed: August 24, 2022
    Publication date: December 22, 2022
    Applicant: FCI USA LLC
    Inventors: Jason John Ellison, Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Scott Martin, Jan De Geest, Scott Carbaugh, Steven E. Minich, Mark R. Gray, Charles Copper, William Tanis
  • Publication number: 20220392395
    Abstract: A display is created using “smart pixels.” A smart pixel is a pixel of a display that integrates the pixel pipeline as part of the pixel, rather than using separate integrated circuits. A smart pixel may be based on an integrated stack that includes light emitting elements, an external data contact for receiving digital data for that pixel, and also the pixel pipeline from the digital data to the light emitting elements.
    Type: Application
    Filed: June 9, 2022
    Publication date: December 8, 2022
    Inventors: Paul Scott Martin, Naamah Argaman, Michael West Wiemer
  • Patent number: 11511467
    Abstract: The present invention relates to the field of automotive lamps, particularly a method for manufacturing a light emitting device (10) for use in automotive lamps. The method comprises: providing a base substrate (11) with a LED die (12) and one or more electrical components (13) attached thereon into a first mold; melting and injecting an optical transparent material over the LED die (12) to form an optical structure (14); removing the base substrate (11) from the first mold once the optical transparent material is partially solidified; providing the base substrate (11) into a second mold different from the first mold; and melting and injecting a thermally conductive material into the second mold while the optical transparent material is not fully solidified, such that an intimate connection is formed between the thermally conductive material and the optical transparent material. The present invention further discloses the light emitting device (10) per se.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: November 29, 2022
    Assignee: Lumileds LLC
    Inventors: Nan Chen, Paul Scott Martin, Chao Ding, Luke Cheng
  • Patent number: 11513483
    Abstract: A method of motor control device emulation includes receiving, via a network-enabled motor control device, a communication request corresponding to an emulated motor control device. The method further includes modifying the communication request to match an expected communication request. Additionally, the method includes providing a modified communication request to an associated hardware module within the network-enabled motor control device. Further, the expected communication request is based on the network-enabled motor control device.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: November 29, 2022
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: William Howell Martin, Jeffrey Scott Martin, John Patrick Caspers, Eric Allen Norrod
  • Patent number: 11498278
    Abstract: A three dimensional printing system, the system including: a printhead; and a removable tray comprising a reservoir, the tray located in a print bed of the three dimensional printing system such that liquid purged from the printhead is deposited in the reservoir, wherein prior to the system purging liquid from the printhead, the system confirms that the tray is in place using a sensor.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: November 15, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Miguel Alvarez, Warren Scott Martin, Joshua Schmale
  • Publication number: 20220348651
    Abstract: Provided herein are methods of treating cancer using an antibody or antigen-binding fragments thereof that specifically bind to human ENTPD2 protein, and compositions comprising these antibodies or antigen-binding fragments for use in the treatment of cancer. The present invention also relates to combination therapies comprising an anti-human ENTPD2 antibody or antigen binding fragment and at least one additional therapeutic agent, and methods of using these combination therapies.
    Type: Application
    Filed: September 17, 2020
    Publication date: November 3, 2022
    Inventors: Michael DiDonato, Mirek Dostalek, Christoph Erkel, Javier Estrada Diez, Anna Galkin, Scott Martin Glaser, Klaus Felix Hartlepp, Yong Jia, Deborah A. Knee, Alexandra Kraus, Christian Cho-Hua Lee, Luigi Manenti, Sarah Michelle Rue, Jian Shi, Xenia Karola Wezler, Gabrielle Wong
  • Publication number: 20220340685
    Abstract: Provided herein are combinations comprising an antibody or antigen-binding fragment thereof, e.g., a monoclonal antibody or antigen binding fragment thereof, that specifically binds to ENTPD2 (e.g., human ENTPD2 protein), and an antibody or antigen-binding fragment thereof, e.g., a monoclonal antibody or antigen binding fragment thereof, that specifically binds to CD73 (e.g., human CD73 protein), and methods of using these combinations.
    Type: Application
    Filed: September 17, 2020
    Publication date: October 27, 2022
    Inventors: Michael DiDonato, Mirek Dostalek, Christoph Erkel, Javier Estrada Diez, Anna Galkin, Scott Martin Glaser, Klaus Felix Hartlepp, Yong Jia, Deborah A. Knee, Alexandra Kraus, Christian Cho-Hua Lee, Luigi Manenti, Sarah Michelle Rue, Jian Shi, Xenia Karola Wezler, Gabrielle Wong
  • Publication number: 20220336704
    Abstract: Two, standard dimension, Si wafers, one <111>-oriented and the other <100>-oriented for example, are bonded together to form a two-ply substrate. Such an Si double-wafer substrate is stiffer than either a double-thickness <111>-oriented or <100>-oriented wafer. C-beveling on the two constituent wafers results in a B-bevel edge of the two-ply substrate that does not create stress risers. Also, standard thickness wafers are commercially available. GaN epitaxial layer is then grown on this two-ply substrate.
    Type: Application
    Filed: April 21, 2022
    Publication date: October 20, 2022
    Inventor: Paul Scott Martin
  • Publication number: 20220335865
    Abstract: Advanced display devices are integrated into glasses so that they look and feel more like normal glasses. They are based on pupil replication using multiple, small projectors. A number of projectors are embedded in the eyeglasses, for example embedded in the rim of the eyeglasses or in a periphery of the lens. The projectors generate (partial) images based on a common image to be displayed to the user. These images are optically coupled through the lens, for example using waveguide coupling, to different display windows in the lens. The display windows couple the images out of the lens and towards the user's eye.
    Type: Application
    Filed: January 13, 2022
    Publication date: October 20, 2022
    Inventors: Paul Scott Martin, Brian Elliot Lemoff
  • Patent number: D977502
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: February 7, 2023
    Assignee: INSULET CORPORATION
    Inventors: Virginia Lu, Gonzalo Castro, Graeme Nelson, Joshua Siva, Megan Zwerling, Scott Martin