Abstract: A method includes obtaining patient medical record information from a plurality of providers until a demographic profile of patients associated with the patient medical record information meets a desired demographic profile; querying the patient medical record information using selection criteria to identify a first subset of patients having first characteristics that match first screening requirements for a clinical trial; identifying, using an artificial intelligence engine, ones of the first subset of patients whose medical record information includes second characteristics that match second screening requirements for the clinical trial as clinical trial patient candidates; and communicating identities of the clinical trial patient candidates to ones of the plurality of providers that provide healthcare services to the clinical trial patient candidates, respectively. The plurality of providers are associated with a plurality of different organizational managing entities, respectively.

Abstract: The disclosed technology relates to a method of analyzing DNA from a biological sample. In one aspect, the method comprises obtaining a sample a sample from a subject, the sample comprising DNA that comprises double-stranded DNA (dsDNA) suspected of having one or more thymine lesions formed by deamination of 5-methylcytosines, wherein the thymine lesions form base pair mismatches in the dsDNA, contacting the sample with a nuclease that digests dsDNA at base pair mismatches; harvesting DNA from the nuclease-treated sample; and performing an analysis on undigested DNA harvested from the nuclease-treated sample.

Abstract: The present disclosure relates to a shielded electronic module, which includes a module substrate, an electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a second mold compound over a bottom surface of the module substrate, and a shielding structure. The second mold compound includes a recess extending inwardly from a bottom periphery of the second mold compound. The shielding structure completely covers a top surface of the module and extends over the side surface of the module until reaching the recess. Herein, the shielding structure is electrically grounded.

Abstract: The disclosed technology relates to a method of analyzing a tissue sample. In one aspect, the method comprises obtaining a formalin-fixed paraffin-embedded (FFPE) tissue sample; contacting the tissue sample with Mung Bean Nuclease to cleave mismatched DNA pairs when isolating DNA from the tissue sample; and performing an analysis on the non-digested DNA. In one embodiment, the tissue sample is obtained from a patient having a refractory disease or a cancer during biopsy, and the analysis comprises performing next-generation DNA sequencing to evaluate genomic DNA mutations. In another embodiment, the method further comprises using a computer to screen for one or more therapies according to the cancer diagnosis; and producing a computer-generated report of possible therapies.

Abstract: The disclosure is directed to an electronic device with a solder interconnect and multiple material encapsulant. The electronic device includes a die last assembly with the die assembled to an electronic packaging substrate by a solder interconnect. At least a portion of a first dielectric material and the die are milled or ground, with a second dielectric material applied over an exposed portion of the die. A shield is then positioned over and electrically insulated from the die. Accordingly, such a configuration reduces a thickness or height of an electronic device with shielding and a die last assembly.

Abstract: Electromagnetic shields for sub-modules of electronic modules are disclosed. Electronic modules may include multiple sub-modules arranged on a substrate with an electromagnetic shield arranged to conformally cover the sub-modules as well as portions of the substrate that are uncovered by the sub-modules. Electromagnetic shields are disclosed that are configured to extend between sub-modules to form one or more divider walls. The one or more divider walls may be configured to extend below mounting surfaces of electronic components in the sub-modules to provide improved reduction of electromagnetic interference (EMI) or crosstalk between various sub-modules. Electromagnetic shields are also disclosed that form perimeter sidewalls that extend below mounting surfaces of electronic components of sub-modules to provide improved reduction of EMI from other modules or other external sources.

Abstract: A method includes receiving information associated with health care services provided to a patient; determining for respective ones of the health care services respective probabilities that a first entity will refuse responsibility; associating a first portion of the health care services with the first entity; associating a second portion of the health care services with a second entity, the second portion of the health care services comprising respective ones of the health care services having probabilities that exceed a defined threshold; assigning responsibility for the first portion of the health care services to the first entity; and assigning responsibility for the second portion of the health care services to the second entity.

Abstract: The present disclosure relates to segmented shielding using wirebonds. In an exemplary aspect, a shield is formed from a series of wires (e.g., wirebonds) to create a wall and/or shielded compartment in an integrated circuit (IC) module. The wires can be located in any area within the IC module. The IC module may be overmolded with an insulating mold compound, and a top surface of the insulating mold can be ground or otherwise removed to expose ends of the wires to a shield layer which surrounds the insulating mold. Some examples may further laser ablate or otherwise form cavities around the ends of the wires to create stronger bonding between the wires of the shield and the shield layer.

Abstract: Provided herein are nanoparticles comprising a polyplex core comprising one or more pH-responsive polymers and one or more anionic immune adjuvants, wherein each pH-responsive polymer comprises ionizable amine groups; and a shell of bacterial cell membrane components at least partially coating the polyplex core, wherein the bacterial cell membrane components comprise TLR 2 and/or TLR 4 agonists. Also provided are methods of stimulating an immune response in a mammal using the nanoparticle.

Abstract: Electromagnetic shields for sub-modules of electronic modules are disclosed. Electronic modules may include multiple sub-modules arranged on a substrate with an electromagnetic shield arranged to conformally cover the sub-modules as well as portions of the substrate that are uncovered by the sub-modules. Electromagnetic shields are disclosed that are configured to extend between sub-modules to form one or more divider walls. The one or more divider walls may be configured to extend below mounting surfaces of electronic components in the sub-modules to provide improved reduction of electromagnetic interference (EMI) or crosstalk between various sub-modules. Electromagnetic shields are also disclosed that form perimeter sidewalls that extend below mounting surfaces of electronic components of sub-modules to provide improved reduction of EMI from other modules or other external sources.

Abstract: A process for molding a back side wafer singulation guide is disclosed. Structures for heat mitigation include an overmold formed over a contact surface of a device layer of a wafer, covering bump structures. The overmold and bump structures are thinned and planarized, and the overmold provides an underfill to increase interconnect reliability of a semiconductor die in a flip chip bonded package. However, visibility of singulation guides on the contact surface is obstructed. A channel is formed extending through the device layer and into the handle layer, and is filled with the overmold. The handle layer is replaced with a thermally-conductive molding layer formed on the back side for dissipating heat generated by semiconductor devices. The thermally-conductive handle is thinned until the overmold in the channel beneath the device layer is exposed. The exposed overmold provides a visible back side singulation guide for singulating the wafer.

Abstract: A method of making an article of footwear is disclosed. The method may include the steps of selecting a family of article types, selecting a customized article type, manufacturing an article of footwear with the customized article type and shipping the article of footwear to a pre-designated shipping address. The customized article type can be configured with a user selected characteristic. The method can also include limiting the number of article types displayed to a user at any time.

Abstract: Electronic substrates, contact pads for electronic substrates, and related methods are disclosed. Electronic substrates may include an electrically conductive layer that forms at least one contact pad and at least one metal trace on a non-conductive layer. The contact pads are arranged with greater thicknesses or heights above the non-conductive layer than the metal traces. Dielectric layers are disclosed that cover the metal traces while leaving top surfaces of the contact pads exposed. Top surfaces of the dielectric layers may be arranged to be coplanar with top surfaces of the contact pads to provide electronic substrates having generally planar top faces. Bottom faces of electronic substrates may include mounting pads that are coplanar with additional dielectric layers. Methods are disclosed that include forming dielectric layers to cover contact pads and metal traces, and removing surface portions of the dielectric layers until the contact pads are accessible through the dielectric layers.

Abstract: Systems and methods are provided for adapting picker yield data collected by pickers (e.g., ear pickers, combines, etc.) to account for errors in calibration of the pickers. One exemplary computer-implemented method includes accessing data for a field harvested by multiple pickers, wherein the accessed data includes yield data for the field received from of the pickers, and determining a mass differential for a crop harvested by the pickers from the field. When the mass differential exceeds a threshold, the method then further includes calculating a normalization factor for at least one pair of the pickers, calculating a scaling factor associated with one of the pickers of the at least one pair of the pickers based on the normalization factor, and applying the scaling factor to the yield data received from the pickers such that the yield data is normalized.

Abstract: A method of making an article of footwear is disclosed. The method may include the steps of selecting a family of article types, selecting a customized article type, manufacturing an article of footwear with the customized article type and shipping the article of footwear to a pre-designated shipping address. The customized article type can be configured with a user selected characteristic. The method can also include limiting the number of article types displayed to a user at any time.

Abstract: Electronic substrates, contact pads for electronic substrates, and related methods are disclosed. Electronic substrates may include an electrically conductive layer that forms at least one contact pad and at least one metal trace on a non-conductive layer. The contact pads are arranged with greater thicknesses or heights above the non-conductive layer than the metal traces. Dielectric layers are disclosed that cover the metal traces while leaving top surfaces of the contact pads exposed. Top surfaces of the dielectric layers may be arranged to be coplanar with top surfaces of the contact pads to provide electronic substrates having generally planar top faces. Bottom faces of electronic substrates may include mounting pads that are coplanar with additional dielectric layers. Methods are disclosed that include forming dielectric layers to cover contact pads and metal traces, and removing surface portions of the dielectric layers until the contact pads are accessible through the dielectric layers.

Abstract: The present disclosure relates to a shielded electronic module, which includes a module substrate, an electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a second mold compound over a bottom surface of the module substrate, and a shielding structure. The second mold compound includes a recess extending inwardly from a bottom periphery of the second mold compound. The shielding structure completely covers a top surface of the module and extends over the side surface of the module until reaching the recess. Herein, the shielding structure is electrically grounded.

Abstract: Electronic substrates, contact pads for electronic substrates, and related methods are disclosed. Electronic substrates may include an electrically conductive layer that forms at least one contact pad and at least one metal trace on a non-conductive layer. The contact pads are arranged with greater thicknesses or heights above the non-conductive layer than the metal traces. Dielectric layers are disclosed that cover the metal traces while leaving top surfaces of the contact pads exposed. Top surfaces of the dielectric layers may be arranged to be coplanar with top surfaces of the contact pads to provide electronic substrates having generally planar top faces. Bottom faces of electronic substrates may include mounting pads that are coplanar with additional dielectric layers. Methods are disclosed that include forming dielectric layers to cover contact pads and metal traces, and removing surface portions of the dielectric layers until the contact pads are accessible through the dielectric layers.

Abstract: The present disclosure relates to a shielded double-sided module, which includes a module substrate with a ground plane, at least one top electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a number of first module contacts attached to a bottom surface of the module substrate, a second mold compound, and a shielding structure. The second mold compound resides over the bottom surface of the module substrate, and each first module contact is exposed through the second mold compound. The shielding structure completely covers a top surface and a side surface of the module, and is electrically coupled to the ground plane within the module substrate.

Abstract: The present disclosure relates to a shielded double-sided module, which includes a module substrate with a ground plane, at least one top electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a number of first module contacts attached to a bottom surface of the module substrate, a second mold compound, and a shielding structure. The second mold compound resides over the bottom surface of the module substrate, and each first module contact is exposed through the second mold compound. The shielding structure completely covers a top surface and a side surface of the module, and is electrically coupled to the ground plane within the module substrate.