Abstract: In some examples, an additive manufacturing technique including forming an as-deposited coating on a substrate by depositing a filament via a filament delivery device, wherein the filament includes a sacrificial binder and a powder; removing substantially all the binder from the as-deposited coating; and sintering the as-deposited coating to form a thermal coating; wherein the thermal coating is configured to ablate in response to absorption of energy from an external environment, and wherein the ablation of the thermal coating reduces the energy transferred to the substrate.

Abstract: In some examples, a braze material includes a first set of particles, a second set of particles, and a polymeric binder. The first set of particles includes a braze powder, where the braze powder comprises an Si-containing alloy. The first set of particles defines an average or median particle diameter between about 1 ?m and about 40 ?m. The second set of particles includes at least one of SiC or a transition metal carbide, where the second set of particles has a multimodal particle size distribution.

Abstract: In some examples, a method for forming a ballistic armor article, the method including forming a preform article by depositing a filament via a filament delivery device, wherein the filament includes a sacrificial binder and a powder; removing the binder from the preform article; and sintering the preform article to form the ballistic armor article, wherein the ballistic armor article is configured to absorb energy from an external projectile that impacts the ballistic armor article, and wherein the ballistic armor article is configured to prevent the projectile from penetrating through the ballistic armor article.

Abstract: Systems and methods for providing a soldered interface between a circuit board and a connector pin. The methods comprise: using a jet paste dispenser to apply first solder into a plated contact cavity formed in the circuit board; using a stencil screen printer to apply second solder (a) over the plated contact cavity which was at least partially filled with the first solder by the jet paste dispenser and (b) over at least a portion of a pad surrounding the plated contact cavity; inserting the connector pin in the plated contact cavity such that the connector pin passes through the second solder and extends at least partially through the first solder; and performing a reflow process to heat the first and second solder so as to create a solder joint between the circuit board and the connector pin.

Abstract: A method for additive manufacturing, the method including delivering, via one or more delivery nozzles of a deposition head, a feedstock material to a substrate, wherein the delivered material defines a material distribution volume on and/or adjacent the substrate; and rotating the deposition head about an axis to control the material distribution volume, wherein the rotation of the deposition head adjusts a position of the one or more delivery nozzles of the deposition head relative to the substrate

Abstract: A material deposition head includes a body portion and at least one nozzle. The body portion includes a first end, a second end, and a first exterior surface extending from the first end to the second end. The at least one nozzle is coupled to the body portion at or near the second end. The nozzle defines a second exterior surface and a material delivery channel that is fluidically coupled to a fluidized powder source configured to provide a plurality of particles of a material. At least one of the first exterior surface or the second exterior surface includes a microtextured surface configured to reduce a wettability of molten particles of the plurality of particles thereon.

Abstract: A method of connecting two CMC substrates that includes providing two substrates; placing one substrate approximate to the other substrate, such that at least a portion of the two substrates overlap and define a brazing area; placing a brazing material approximate the brazing area; defining a primary raster pattern that encompasses the brazing area and a portion of the two substrates outside the brazing area; defining a secondary raster pattern that encompasses the brazing area; allowing a laser to scan the primary raster pattern to preheat the brazing area to a temperature below the brazing material's melting point; allowing the laser to scan the secondary raster pattern to heat the brazing area to a temperature that is above the brazing material's melting point; melting and allowing the brazing material to flow within the brazing area; and cooling the brazing area to form a brazed joint connecting the two substrates.

Abstract: Systems and methods for providing a soldered interface between a circuit board and a connector pin. The methods comprise: using a jet paste dispenser to apply first solder into a plated contact cavity formed in the circuit board; using a stencil screen printer to apply second solder (a) over the plated contact cavity which was at least partially filled with the first solder by the jet paste dispenser and (b) over at least a portion of a pad surrounding the plated contact cavity; inserting the connector pin in the plated contact cavity such that the connector pin passes through the second solder and extends at least partially through the first solder; and performing a reflow process to heat the first and second solder so as to create a solder joint between the circuit board and the connector pin.

Abstract: Various example embodiments are directed towards an improved control drum, as well as systems, apparatuses, and/or methods for operating a nuclear reactor with a plurality of improved control drums. The control drum includes an outer shell, an inner shell, a plurality of tubes, the plurality of tubes including at least one neutron absorbing tube and at least one neutron scattering tube, and at least one baffle plate arranged between the outer shell and the inner shell, the at least one baffle plate including a plurality of perforations, and at least one perforation of the plurality of perforations configured to support a tube of the plurality of tubes.

Abstract: Photobiomodulation therapy systems provide a highly effective way to treat many common ailments to the human body. Many embodiments described herein enable two or more light therapy devices to be coupled together in various ways. In some embodiments, the light therapy system includes a first light device and a second light device arranged and configured to be mechanically and/or electrically coupled to the first light device. Each of the light devices may include a housing and a plurality of lights arranged and configured to emit at least one of red light and near infrared light. The first light device and the second light device can be coupled in a side-by-side orientation or a top-to-bottom orientation. The light therapy system can also be coupled to a mobile stand or a door stand.

Abstract: The disclosure describes techniques for joining a first part including a ceramic or a CMC and a second part including a ceramic or a CMC using brazing. A technique may include positioning a filler material in a joint region between the first and second parts and a metal or alloy on a bulk surface of the filler material. The metal or alloy may be locally heated to melt the metal or alloy, which may infiltrate the filler material. A constituent of the molten metal or alloy may react with a constituent of the filler material to join the first and second parts. Another technique may include depositing a powder that includes the filler material and the metal or alloy in the joint region. Substantially simultaneously with depositing the powder, the powder may be locally heated. A constituent of the molten metal or alloy may react with a constituent of the filler material to join the first and second parts.

Abstract: An example article may include a component, a substrate including a first ceramic, a joining layer between the component and the substrate, and a joint surface coating between the substrate and the joining layer. The joint surface coating may include a diffusion barrier layer including a second ceramic material, and a compliance layer including at least one of a metal or a metalloid. An example technique may include holding a first joining surface of a coated component adjacent a second joining surface of a second component. The example technique may further include heating at least one of the coated component, the second component, and a braze material, and brazing the coated component by allowing the braze material to flow in a region between the first joining surface and the second joining surface.

Abstract: Various implementations of automatic test equipment are disclosed having a number of innovative features. In one implementation, the equipment includes a test head having a probe card support apparatus that provides stiffening support and/or planarization to the device under test (DUT) area of a probe card. In another implementation, the test head can include a planar surface and the wafer prober can include a corresponding planar surface. The planar surfaces can be brought into contact with each other to planarize the DUT area of the probe card and the wafer chuck in the wafer prober relative to each other.

Abstract: A method may include cold isostatic pressing a fused filament fabricated component comprising a plurality of roads and channels between at least some roads of the plurality of roads. The plurality of roads may include a sacrificial binder and a powder including a metal or alloy. The cold isostatic pressing reduces a presence of the channels between the at least some roads to form a compacted fused filament fabricated component. The method also may include removing substantially all the sacrificial binder from the compacted fused filament fabricated component and leave a powder component; and sintering the powder component to form a sintered component.

Abstract: A method may include fused filament fabricating a fused filament fabricated component by delivering a softened filament to selected locations at or adjacent to a build surface. The softened filament may include a sacrificial binder and a powder including a shape memory alloy (SMA). The method also may include removing substantially all the sacrificial binder from the fused filament fabricated component to leave an unsintered component; and sintering the unsintered component to join particles of the SMA and form an SMA component.

Abstract: An additively manufactured component that includes a tool with a region having a plurality of overlying metal layers each derived from a metal powder filament. The region has a predetermined yield point selected based on an operation to be performed with the tool.

Abstract: A method may include fused filament fabricating a fused filament fabricated component by delivering a softened filament to selected locations at or adjacent to a build surface. The softened filament may include a binder and a primary material. The binder is configured to release a secondary material upon heating at or above a conversion temperature. The method also may include heating the fused filament fabricated component to a temperature at or above the conversion temperature to sinter the primary material to form a sintered part and cause the binder to release the secondary material within the sintered part.

Abstract: In some examples, an additive manufacturing technique for forming a vacuum insulator. For example, a method including forming an article including a first layer, a second layer, and at least one support member extending between the first and second layer by depositing a filament via a filament delivery device, wherein the filament includes a sacrificial binder and a powder, and wherein the first layer, second layer, and at least one support member define an open cavity within the article; removing the binder; and sintering the article to form the vacuum insulator, wherein the vacuum insulator defines a vacuum environment in the cavity.

Abstract: In some examples, a method for additively manufacturing a heat pipe, the method including depositing, via a filament delivery device, a filament to form a heat pipe preform, wherein the filament includes a binder and a metal or alloy powder; and sintering the heat pipe preform to form the heat pipe, the heat pipe including an outer shell, a wicking region, and a vapor transport region defined by the metal or alloy.

Abstract: An additive manufacturing technique may include depositing, via a filament delivery device, a filament onto a surface of a substrate. The filament includes a binder and a powder including at least one metal or alloy and at least one braze alloy. The technique also includes sacrificing the binder to form a preform. The technique also includes sintering the preform to form a component including the at least one metal or alloy and the at least one braze alloy.