Patents by Inventor Scott Salmon

Scott Salmon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12174207
    Abstract: The present disclosure relates to blood sample preparation devices and methods. In some embodiments, a method for preparing a blood sample comprises: receiving at a sample preparation machine a sample container containing the blood sample; scanning an identifier of the sample container, the identifier containing information indicative of a characteristic of at least one of the sample container or the blood sample contained therein, actuating, after the scanning, and based on the information, the sample container to repeatedly change a position of the sample container; determining, based on the information, whether the sample container should be centrifuged; and transporting the sample container to a centrifuge to be centrifuged and then to a storage compartment when the determining indicates that the sample container should be centrifuged, and to the storage compartment without entering the centrifuge when the determining indicates that the sample container should not be centrifuged.
    Type: Grant
    Filed: April 14, 2023
    Date of Patent: December 24, 2024
    Assignee: Babson Diagnostics, Inc.
    Inventors: Eric Olson, Kathryn Wong, Christopher Dipasquale, Scott Salmon, Steven Bellofatto, Steven Madsen, Courtney Nicholls
  • Publication number: 20240396227
    Abstract: An antenna module having an antenna in a mold layer, and related fabrication methods are disclosed. The antenna module includes a substrate that supports one or more semiconductor dies (“dies”). The die(s) can include radio-frequency (RF) circuits. A mold layer is formed over the die(s) and the package substrate to insulate and protect the die(s). The antenna is electrically coupled to the die(s). In exemplary aspects, an antenna (e.g., an antenna patch, waveguide, and/or dipole antenna elements) is provided in the mold layer. For example, the antenna can be formed in the mold layer adjacent to the die(s), wherein the antenna is electrically coupled to the die(s) through the substrate. In this manner, the mold layer can be provided having a desired dielectric constant to achieve better attenuation characteristics for the antenna to meet the performance requirements for supporting higher frequencies as an example.
    Type: Application
    Filed: May 25, 2023
    Publication date: November 28, 2024
    Inventors: Chien-Te Feng, Jay Scott Salmon, Wen Yin
  • Publication number: 20240345113
    Abstract: The present disclosure relates to blood sample preparation devices and methods. In some embodiments, a method for preparing a blood sample comprises: receiving at a sample preparation machine a sample container containing the blood sample; scanning an identifier of the sample container, the identifier containing information indicative of a characteristic of at least one of the sample container or the blood sample contained therein, actuating, after the scanning, and based on the information, the sample container to repeatedly change a position of the sample container; determining, based on the information, whether the sample container should be centrifuged; and transporting the sample container to a centrifuge to be centrifuged and then to a storage compartment when the determining indicates that the sample container should be centrifuged, and to the storage compartment without entering the centrifuge when the determining indicates that the sample container should not be centrifuged.
    Type: Application
    Filed: April 14, 2023
    Publication date: October 17, 2024
    Inventors: Eric OLSON, Kathryn WONG, Christopher DIPASQUALE, Scott SALMON, Steven BELLOFATTO, Steven MADSEN, Courtney NICHOLLS
  • Patent number: 12100649
    Abstract: A device comprising a package and a board. The package includes a substrate comprising a first surface and a second surface, a passive component coupled to the first surface of the substrate, an integrated device coupled to the second surface of the substrate, a back side metal layer coupled to a back side of the integrated device, a first solder interconnect coupled to the back side metal layer, and a plurality of solder interconnects coupled to the second surface of the substrate. The board is coupled to the package through the plurality of solder interconnects. The first solder interconnect is coupled to the board.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: September 24, 2024
    Assignee: QUALCOMM INCORPORATED
    Inventors: Chien-Te Feng, Wen Yin, Jay Scott Salmon
  • Patent number: 12100669
    Abstract: Multi-component modules (MCMs), including configurable electromagnetic interference (EMI) shield structures and related methods, are disclosed. An EMI shield enclosing an IC or another electrical component in an MCM can protect other components within the MCM from EMI generated by the enclosed component. The EMI shield also protects the enclosed component from the EMI generated by other electrical components. An EMI shield with sidewall structures, in which vertical conductors supported by a wall medium electrically couple a lid of the EMI shield to a ground layer in a substrate, provides configurable EMI protection in an MCM. The EMI shield may also be employed to increase heat dissipation. The sidewall structures of the EMI shield are disposed on one or more sides of an electrical component and are configurable to provide a desired level of EMI isolation.
    Type: Grant
    Filed: July 21, 2023
    Date of Patent: September 24, 2024
    Assignee: QUALCOMM INCORPORATED
    Inventors: Jay Scott Salmon, Anirudh Bhat
  • Patent number: 11985804
    Abstract: A package that includes a substrate, a first integrated device coupled to the substrate, a first block device coupled to the substrate, a second encapsulation layer encapsulating the first integrated device and the first block device. The first block device includes a first electrical component, a second electrical component, a first encapsulation layer at least partially encapsulating the first electrical component and the second electrical component, and a first metal layer coupled to the first encapsulation layer.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: May 14, 2024
    Assignee: QUALCOMM INCORPORATED
    Inventors: Anirudh Bhat, Jay Scott Salmon
  • Patent number: 11977090
    Abstract: A status visualization method of a diagnostic laboratory system. The status visualization method includes receiving, at a system controller, computer-readable data comprising analyzers included within the diagnostic laboratory system, and test demand for types of tests and number of the tests to be performed on samples by the analyzers, wherein the analyzers each include consumable items and maintenance items. The method further includes determining, via a walk-away time estimation module executing on the system controller, an estimated walk-away time for the analyzers based upon the test demand and status of the consumable items and maintenance items. Diagnostic laboratory systems with walk-away time estimation are disclosed, as are other aspects.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: May 7, 2024
    Assignee: Siemens Healthcare Diagnostics Inc.
    Inventors: Heinrich Helmut Degen, Sara Kendrick, Scott Salmon
  • Publication number: 20240021538
    Abstract: Multi-component modules (MCMs), including configurable electromagnetic interference (EMI) shield structures and related methods, are disclosed. An EMI shield enclosing an IC or another electrical component in an MCM can protect other components within the MCM from EMI generated by the enclosed component. The EMI shield also protects the enclosed component from the EMI generated by other electrical components. An EMI shield with sidewall structures, in which vertical conductors supported by a wall medium electrically couple a lid of the EMI shield to a ground layer in a substrate, provides configurable EMI protection in an MCM. The EMI shield may also be employed to increase heat dissipation. The sidewall structures of the EMI shield are disposed on one or more sides of an electrical component and are configurable to provide a desired level of EMI isolation.
    Type: Application
    Filed: July 21, 2023
    Publication date: January 18, 2024
    Inventors: Jay Scott Salmon, Anirudh Bhat
  • Patent number: 11721639
    Abstract: Multi-component modules (MCMs) including configurable electromagnetic interference (EMI) shield structures, and related methods are disclosed. An EMI shield enclosing an IC or another electrical component in an MCM can protect other components within the MCM from EMI generated by the enclosed component. The EMI shield also protects the enclosed component from the EMI generated by other electrical components. An EMI shield with side-wall structures, in which vertical conductors supported by a wall medium electrically couple a lid of the EMI shield to a ground layer in a substrate, provides configurable EMI protection in an MCM. The EMI shield may also be employed to increase heat dissipation. The side-wall structures of the EMI shield are disposed on one or more sides of an electrical component and are configurable to provide a desired level of EMI isolation.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: August 8, 2023
    Assignee: QUALCOMM INCORPORATED
    Inventors: Jay Scott Salmon, Anirudh Bhat
  • Publication number: 20230091182
    Abstract: A device comprising a package and a board. The package includes a substrate comprising a first surface and a second surface, a passive component coupled to the first surface of the substrate, an integrated device coupled to the second surface of the substrate, a back side metal layer coupled to a back side of the integrated device, a first solder interconnect coupled to the back side metal layer, and a plurality of solder interconnects coupled to the second surface of the substrate. The board is coupled to the package through the plurality of solder interconnects. The first solder interconnect is coupled to the board.
    Type: Application
    Filed: September 22, 2021
    Publication date: March 23, 2023
    Inventors: Chien-Te FENG, Wen YIN, Jay Scott SALMON
  • Publication number: 20230070275
    Abstract: A package that includes a substrate and an integrated device coupled to the substrate. The substrate includes at least one dielectric layer and a plurality of interconnects comprising a first pad interconnect. The first pad interconnect comprises a first portion comprising a first width and a second portion comprising a second width that is different than the first width.
    Type: Application
    Filed: September 9, 2021
    Publication date: March 9, 2023
    Inventors: Anirudh BHAT, Yuling NIU, Jay Scott SALMON
  • Publication number: 20230023868
    Abstract: A package that includes a substrate, a first integrated device coupled to the substrate, a first block device coupled to the substrate, a second encapsulation layer encapsulating the first integrated device and the first block device. The first block device includes a first electrical component, a second electrical component, a first encapsulation layer at least partially encapsulating the first electrical component and the second electrical component, and a first metal layer coupled to the first encapsulation layer.
    Type: Application
    Filed: July 22, 2021
    Publication date: January 26, 2023
    Inventors: Anirudh BHAT, Jay Scott SALMON
  • Publication number: 20220291247
    Abstract: A status visualization method of a diagnostic laboratory system. The status visualization method includes receiving, at a system controller, computer-readable data comprising analyzers included within the diagnostic laboratory system, and test demand for types of tests and number of the tests to be performed on samples by the analyzers, wherein the analyzers each include consumable items and maintenance items. The method further includes determining, via a walk-away time estimation module executing on the system controller, an estimated walk-away time for the analyzers based upon the test demand and status of the consumable items and maintenance items. Diagnostic laboratory systems with walk-away time estimation are disclosed, as are other aspects.
    Type: Application
    Filed: August 3, 2020
    Publication date: September 15, 2022
    Applicant: Siemens Healthcare Diagnostics Inc.
    Inventors: Heinrich Helmut Degen, Sara Kendrick, Scott Salmon
  • Publication number: 20210407927
    Abstract: Multi-component modules (MCMs) including configurable electromagnetic interference (EMI) shield structures, and related methods are disclosed. An EMI shield enclosing an IC or another electrical component in an MCM can protect other components within the MCM from EMI generated by the enclosed component. The EMI shield also protects the enclosed component from the EMI generated by other electrical components. An EMI shield with side-wall structures, in which vertical conductors supported by a wall medium electrically couple a lid of the EMI shield to a ground layer in a substrate, provides configurable EMI protection in an MCM. The EMI shield may also be employed to increase heat dissipation. The side-wall structures of the EMI shield are disposed on one or more sides of an electrical component and are configurable to provide a desired level of EMI isolation.
    Type: Application
    Filed: June 2, 2021
    Publication date: December 30, 2021
    Inventors: Jay Scott Salmon, Anirudh Bhat
  • Patent number: 10871427
    Abstract: A biological liquid collection vessel is adapted to contain a biological liquid to be centrifuged. The collection vessel has a vessel body having an open upper end and a closed lower end, a continuous wall, a target area at the upper end, and a solids area at the lower end that is connected to the target area. The target area is extended in length. In some embodiments, a volume capacity of both of the target area and the solids area are configured so that a red blood cell portion of the centrifuged biological liquid (e.g., blood) is substantially contained in the solids area, and the serum or plasma portion of the centrifuged biological liquid is substantially contained in the target area. Methods of and systems using the liquid collection vessels are provided, as are other aspects.
    Type: Grant
    Filed: August 1, 2013
    Date of Patent: December 22, 2020
    Assignee: Siemens Healthcare Diagnostics Inc.
    Inventors: Alex Hsu, Scott Salmon, Radu Saftoiu
  • Patent number: 10838454
    Abstract: A monitor-mounted status indicator light assembly is disclosed, including at least one status indicator light and a mounting bracket adapted for mounting on a monitor. In some embodiments, standard VESA mounting configurations are employed, and the assembly's mounting bracket does not interfere with, or prevent, mounting of the monitor to a monitor mounting arm via the same VESA mounts.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: November 17, 2020
    Assignee: Siemens Healthcare Diagnostics Inc.
    Inventors: Scott Salmon, Daniel LiCalzi, Daniel J. McDermott
  • Patent number: 10781086
    Abstract: Winches with dual mode remote controls, and associated systems and methods are disclosed. A representative winch can include a frame, a cable drum rotatably supported by the frame, a drive motor operatively connected to the cable drum, and a winch control module. The winch control module can include an enable/disable circuit having a normally open ground path connection and a controller having wireless capability connected to the enable/disable circuit. The controller can include instructions to disable the wireless capability of the controller when the normally open ground path connection is completed.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: September 22, 2020
    Assignee: Westin Automotive Products, Inc.
    Inventors: Jacob August, Ron Dennis, Timothy Frazier, Jon Mason, Scott Salmon, Ty Hargroder, David Scuito, David Burns, Brent Nasset
  • Patent number: 10726099
    Abstract: Disclosed herein is a system for providing a user with remote real time access to pharmaceuticals, the system comprising a plurality of carts which accept cassettes that contain pharmaceuticals. The carts preferably contain a CPU which can communicate with a database. A remote CPU is also in electrical communication with the database and may be placed at a pharmacy. When a specific pharmaceutical is required for a specific patient, a user can electronically request a one time access code (OTAC) from the remote CPU. If the request is valid, an OTAC can be sent both electronically to the database in addition to being sent to the user. If the user inputs an OTAC that matches the one stored on the database, the cart is unlocked to provide access to the requested pharmaceutical. Pharmaceuticals that are currently found in the cart can be checked remotely by communicating with the database.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: July 28, 2020
    Assignee: CAPSA SOLUTIONS LLC
    Inventors: Rody Hardy, Eric Webb, Andrew Sherrill, Scott Salmon, Dave Burns
  • Patent number: 10633229
    Abstract: Winches with integrated lighting, and associated systems and methods are disclosed. A representative winch with integrated lighting can include a frame, a cable drum rotatably supported by the frame, a drive motor operatively connected to the cable drum, and an electrical module. The electrical module can include a housing with first and second end caps coupled to the housing. An elongate light guide can be mounted to the housing between the housing and the cable drum with one or more drum light sources connected to the elongate light guide.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: April 28, 2020
    Assignee: Westin Automotive Products, Inc.
    Inventors: Jacob August, Ron Dennis, Timothy Frazier, Jon Mason, Scott Salmon, Ty Hargroder, David Scuito, David Burns, Brent Nasset
  • Patent number: D868282
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: November 26, 2019
    Assignee: Siemens Healthcare Diagnostics Inc.
    Inventors: Daniel LiCalzi, Youngsang Lee, Mark Lloyd, Gregory Bange, Richard Warwick, Robert Faranda, Richard Watson, Justin Cumming, Scott Salmon, Josh Hartl