Abstract: A microelectromechanical system (MEMS) microphone package including a MEMS microphone die configured to sense acoustic pressure and to generate a signal based on the acoustic pressure. An application specific integrated circuit (ASIC) electrically connects to the MEMS microphone die. The MEMS microphone package includes a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms side walls of the MEMS microphone package and is adapted to route electrical connections from the MEMS microphone die and the ASIC to the substrate.

Abstract: A microelectromechanical system (MEMS) microphone package including a MEMS microphone die configured to sense acoustic pressure and to generate a signal based on the acoustic pressure. An application specific integrated circuit (ASIC) electrically connects to the MEMS microphone die. The MEMS microphone package includes a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms side walls of the MEMS microphone package and is adapted to route electrical connections from the MEMS microphone die and the ASIC to the substrate.

Abstract: A MEMS microphone package and a method of manufacturing a MEMS microphone package having a lid and a substrate cap. The lid includes a wire bonding shelf that provides a surface internal to the MEMS microphone for connection points for internal wire bonds. One or more conductive traces deposited on the bonding shelf are provided to connect internal electronic components via the wire bonds to a substrate cap. The substrate cap is configured to connect to external devices or components. The internal electronic components include a MEMS microphone die and an application specific integrated circuit. The internal electronic components are configured to transmit signals to external electronics indicative of acoustic energy received by the MEMS microphone die by the configurations described herein.

Abstract: A microelectromechanical system (MEMS) microphone package including a MEMS microphone die configured to sense acoustic pressure and to generate a signal based on the acoustic pressure. An application specific integrated circuit (ASIC) electrically connects to the MEMS microphone die. The MEMS microphone package includes a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms side walls of the MEMS microphone package and is adapted to route electrical connections from the MEMS microphone die and the ASIC to the substrate.

Abstract: A MEMS microphone package and a method of manufacturing a MEMS microphone package having a lid and a substrate cap. The lid includes a wire bonding shelf that provides a surface internal to the MEMS microphone for connection points for internal wire bonds. One or more conductive traces deposited on the bonding shelf are provided to connect internal electronic components via the wire bonds to a substrate cap. The substrate cap is configured to connect to external devices or components. The internal electronic components include a MEMS microphone die and an application specific integrated circuit. The internal electronic components are configured to transmit signals to external electronics indicative of acoustic energy received by the MEMS microphone die by the configurations described herein.

Abstract: A semiconductor package. The semiconductor package includes a first side, a second side, a molded substrate, a die, and a lead frame. The second side of the semiconductor package is opposite the first side of the semiconductor package. The die and lead frame are embedded into the molded substrate. The lead frame is also positioned between the first side and the second side of the semiconductor package to provide a first electrical convection between the first side and the second side of the semiconductor package.

Abstract: A MEMS microphone package and a method of manufacturing a MEMS microphone package having a lid and a substrate cap. The lid includes a wire bonding shelf that provides a surface internal to the MEMS microphone for connection points for internal wire bonds. One or more conductive traces deposited on the bonding shelf are provided to connect internal electronic components via the wire bonds to a substrate cap. The substrate cap is configured to connect to external devices or components. The internal electronic components include a MEMS microphone die and an application specific integrated circuit. The internal electronic components are configured to transmit signals to external electronics indicative of acoustic energy received by the MEMS microphone die by the configurations described herein.

Abstract: Systems and methods for lead frame-based chip carriers for use with MEMS transducers. One embodiment provides a method for manufacturing a MEMS microphone package. In one exemplary embodiment, the method includes flip chip bonding a first plurality of I/O pads on an application specific integrated circuit to a plurality of traces on a lead frame. The method further includes removing at least one of the plurality of traces such that at least one of the first plurality of I/O pads is electrically isolated from the lead frame. The method further includes bonding the lead frame to a lid and electrically connecting, via at least one wire bond, a MEMS microphone mounted to the lid to the application specific integrated circuit using a second plurality of I/O pads of the application specific integrated circuit. The method further includes bonding a substrate to the lead frame to form an air tight volume within the lid.

Abstract: A microelectromechanical system (MEMS) microphone package including a MEMS microphone die configured to sense acoustic pressure and to generate a signal based on the acoustic pressure. An application specific integrated circuit (ASIC) electrically connects to the MEMS microphone die. The MEMS microphone package includes a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms side walls of the MEMS microphone package and is adapted to route electrical connections from the MEMS microphone die and the ASIC to the substrate.

Abstract: An air/water valve assembly for use in an endoscope or other medical equipment is provided. The valve assembly includes a spool and a one-piece sealing member that includes a number of sealing rings. The spool can be injection molded, and the sealing member can be overmolded onto the spool. A spring, retainer, and housing are also included to form the valve assembly. As such, an air/water valve assembly may be made that can be used in a single medical procedure and then discarded in a cost-effective manner. Corresponding methods of manufacturing an air/water valve assembly are also provided.

Abstract: A handle for removably attaching to a moldable orthosis positions the orthosis in boiling water. The handle includes an arm with an oral orthosis engaging member at one end. The engaging member includes one of a tab or slot which removably engages the oral orthosis. In a preferred embodiment, the arm further includes a hook-like member for supporting the oral orthosis on the rim of a container of boiling water during the molding process. In one embodiment, the handle forms the cover of a storage case for the orthosis.

Abstract: A biological liquid collection vessel is adapted to contain a biological liquid to be centrifuged. The collection vessel has a vessel body having an open upper end and a closed lower end, a continuous wall, a target area at the upper end, and a solids area at the lower end that is connected to the target area. The target area is extended in length. In some embodiments, a volume capacity of both of the target area and the solids area are configured so that a red blood cell portion of the centrifuged biological liquid (e.g., blood) is substantially contained in the solids area, and the serum or plasma portion of the centrifuged biological liquid is substantially contained in the target area. Methods of and systems using the liquid collection vessels are provided, as are other aspects.

Abstract: An air/water valve assembly for use in an endoscope or other medical equipment is provided. The valve assembly includes a spool and a one-piece sealing member that includes a number of sealing rings. The spool can be injection molded, and the sealing member can be overmolded onto the spool. A spring, retainer, and housing are also included to form the valve assembly. As such, an air/water valve assembly may be made that can be used in a single medical procedure and then discarded in a cost-effective manner. Corresponding methods of manufacturing an air/water valve assembly are also provided.

Abstract: Disclosed herein is a system for providing a user with remote real time access to pharmaceuticals, the system comprising a plurality of carts which accept cassettes that contain pharmaceuticals. The carts preferably contain a CPU which can communicate with a database. A remote CPU is also in electrical communication with the database and may be placed at a pharmacy. When a specific pharmaceutical is required for a specific patient, a user can electronically request a one time access code (OTAC) from the remote CPU. If the request is valid, an OTAC can be sent both electronically to the database in addition to being sent to the user. If the user inputs an OTAC that matches the one stored on the database, the cart is unlocked to provide access to the requested pharmaceutical. Pharmaceuticals that are currently found in the cart can be checked remotely by communicating with the database.

Abstract: An oral orthosis includes a holder in the shape of a mouthpiece, including a curved arcuate trough-like upper section which receives a formable material. The formable material does not occupy the entire trough but rather includes voids between the formable material and the inner surfaces of trough of the holder to allow expansion of the formable material into the voids during the molding process when tooth pressure is placed on the formable material. This design results in elimination of the excess formable material which otherwise would require removal by trimming. Additionally, the formable material is placed in the trough in a configuration which includes indexing indentations along the centerline of the material, such that, during the molding process, the mouthpiece containing the formable material is easily centered along the edges of the user's teeth to provide a precise fitting.

Abstract: A handle for removably attaching to a moldable orthosis positions the orthosis in boiling water. The handle includes an arm with an oral orthosis engaging member at one end. The engaging member includes one of a tab or slot which removably engages the oral orthosis. In a preferred embodiment, the arm further includes a hook-like member for supporting the oral orthosis on the rim of a container of boiling water during the molding process. In one embodiment, the handle forms the cover of a storage case for the orthosis.

Abstract: An oral orthosis includes a holder in the shape of a mouthpiece, including a curved arcuate trough-like upper section which receives a formable material. The formable material does not occupy the entire trough but rather includes voids between the formable material and the inner surfaces of trough of the holder to allow expansion of the formable material into the voids during the molding process when tooth pressure is placed on the formable material. This design results in elimination of the excess formable material which otherwise would require removal by trimming. Additionally, the formable material is placed in the trough in a configuration which includes indexing indentations along the centerline of the material, such that, during the molding process, the mouthpiece containing the formable material is easily centered along the edges of the user's teeth to provide a precise fitting.

Abstract: An oral orthosis includes a holder in the shape of a mouthpiece, including a curved arcuate trough-like upper section which receives a formable material. The formable material does not occupy the entire trough but rather includes voids between the formable material and the inner surfaces of trough of the holder to allow expansion of the formable material into the voids during the molding process when tooth pressure is placed on the formable material. This design results in elimination of the excess formable material which otherwise would require removal by trimming. Additionally, the formable material is placed in the trough in a configuration which includes indexing indentations along the centerline of the material, such that, during the molding process, the mouthpiece containing the formable material is easily centered along the edges of the user's teeth to provide a precise fitting.