Patents by Inventor Scott West
Scott West has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150022088Abstract: A LAM/ICM assembly comprises an integrated control module (ICM) and an LED array member (LAM). In a first aspect, active circuitry is embedded in the ICM. The circuitry monitors LED operation, controls and supplies power to the LEDs, and communicates information into and out of the assembly. A thermal insulator is disposed between the ICM and a heat sink outside the lateral boundary of the LAM. In a second aspect, a lighting system comprises an AC-to-DC converter and a LAM/ICM assembly. The AC-to-DC converter outputs a substantially constant current or voltage. The magnitude of the current or voltage is adjusted by a signal output from the LAM/ICM. In a third aspect, the ICM includes a built-in switching DC-to-DC converter. An AC-to-DC power supply supplies a roughly regulated supply voltage. The switching converter within the LAM/ICM receives the roughly regulated voltage and supplies a regulated LED drive current to its LEDs.Type: ApplicationFiled: January 30, 2014Publication date: January 22, 2015Applicant: Bridgelux, Inc.Inventors: Michael Neal Gershowitz, R. Scott West, Babak Imangholi
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Publication number: 20150002023Abstract: A light-emitting diode (LED) device includes first and second LED dies with the same structure and that are both encapsulated by the same silicone layer. The first LED is supplied with sufficient drive current to illuminate the LED. Control circuitry supplies the second LED with a constant current, determines the voltage across the second LED, and calculates the temperature of the second LED based on the voltage across the second LED. The constant current has a maximum magnitude that never exceeds the maximum magnitude of the drive current. The LED device is able to calculate the temperature of a diode with a gallium-nitride layer (GaN or GaInN) that is receiving a large drive current and emitting blue light by determining the voltage across an adjacent similar diode with a gallium-nitride layer through which a small constant current is flowing. Preferably, the band gap of the LEDs exceeds two electron volts.Type: ApplicationFiled: June 28, 2013Publication date: January 1, 2015Inventors: Babak Imangholi, Michael Neal Gershowitz, R. Scott West
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Patent number: 8803180Abstract: Using compression molding to form lenses over LED arrays on a metal core printed circuit board leaves a flash layer of silicone covering the contact pads that are later required to connect the arrays to power. A method for removing the flash layer involves blasting particles of sodium bicarbonate at the flash layer. A nozzle is positioned within thirty millimeters of the top surface of the flash layer. The stream of air that exits from the nozzle is directed towards the top surface at an angle between five and thirty degrees away from normal to the top surface. The particles of sodium bicarbonate are added to the stream of air and then collide into the top surface of the silicone flash layer until the flash layer laterally above the contact pads is removed. The edge of silicone around the cleaned contact pad thereafter contains a trace amount of sodium bicarbonate.Type: GrantFiled: October 23, 2013Date of Patent: August 12, 2014Assignee: Bridgelux, Inc.Inventors: R. Scott West, Tao Tong, Mike Kwon
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Publication number: 20140223415Abstract: A system and method for modeling code segments that do not have a location is disclosed. Source code may be indexed and modeled in a data graph with nodes representing code elements and edges representing relationships between nodes. However, some code elements may be hidden or implicit and therefore may lack location information. In these cases, code figments are created and represented as nodes in the graph. Figment nodes may be specially designated so that the figment nodes may be easily distinguished from real source code nodes. The graph is then updated to include location information for the code figments in the nodes that interact with the hidden or implicit code. The data graph may then be provided to a user or as a service to be used by coding tools.Type: ApplicationFiled: February 6, 2013Publication date: August 7, 2014Applicant: Google Inc.Inventors: Jeffrey van GOGH, Stephen F. YEGGE, Michael Joseph FROMBERGER, Amin SHALI, Gregory Scott WEST, James Anthony DENNETT, Lasse ESPEHOLT, Ronald Aaron BRAUNSTEIN
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Publication number: 20140197430Abstract: A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.Type: ApplicationFiled: March 14, 2014Publication date: July 17, 2014Applicant: BRIDGELUX, INC.Inventors: Mike Kwon, Gerry Keller, Scott West, Tao Tong, Babak Imangholi
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Patent number: 8748202Abstract: A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.Type: GrantFiled: September 14, 2012Date of Patent: June 10, 2014Assignee: Bridgelux, Inc.Inventors: Mike Kwon, Gerry Keller, Scott West, Tao Tong, Babak Imangholi
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Publication number: 20140135759Abstract: Systems and methods are provided for positioning and stabilizing an external instrument during insertion of the instrument through the oral cavity (e.g., insertion of a catheter through the oral cavity and into the esophagus or cardia for treatment of gastroesophageal reflux disease (GERD)). The systems and methods provide a gripping tool for association with a bite block, capable of selectively moving between an open position in which the instrument may be inserted or removed, and a closed position in which the external instrument is held in a fixed position.Type: ApplicationFiled: January 19, 2014Publication date: May 15, 2014Applicant: Mederi Therapeutics IncInventors: Scott West, David S. Utley, John W. Gaiser
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Packaging Photon Building Blocks Having Only Top Side Connections In A Molded Interconnect Structure
Publication number: 20140131747Abstract: Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.Type: ApplicationFiled: January 16, 2014Publication date: May 15, 2014Applicant: Bridgelux, Inc.Inventors: R. Scott West, Tao Tong, Mike Kwon -
Publication number: 20140107483Abstract: A sphincter tissue region is treated using a support structure sized for advancement into the anal canal. At least one electrode is carried by the structure. A mechanism is coupled to the electrode to move the electrode between a first position retracted in the support structure and a second position extended from the support structure through surface tissue to penetrate a subsurface tissue region at or near a sphincter in the anal canal. A cable is coupled to the electrode to conduct energy for application by the electrode to form a lesion in the subsurface tissue region.Type: ApplicationFiled: October 16, 2013Publication date: April 17, 2014Applicant: MEDERI THERAPEUTICS INCInventors: David S. UTLEY, SCOTT WEST, JOHN GAISER, RACHEL CROFT
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Publication number: 20140077235Abstract: A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.Type: ApplicationFiled: September 14, 2012Publication date: March 20, 2014Applicant: BRIDGELUX, INC.Inventors: Mike Kwon, Gerry Keller, Scott West, Tao Tong, Babak Imangholi
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Publication number: 20140048832Abstract: Using compression molding to form lenses over LED arrays on a metal core printed circuit board leaves a flash layer of silicone covering the contact pads that are later required to connect the arrays to power. A method for removing the flash layer involves blasting particles of sodium bicarbonate at the flash layer. A nozzle is positioned within thirty millimeters of the top surface of the flash layer. The stream of air that exits from the nozzle is directed towards the top surface at an angle between five and thirty degrees away from normal to the top surface. The particles of sodium bicarbonate are added to the stream of air and then collide into the top surface of the silicone flash layer until the flash layer laterally above the contact pads is removed. The edge of silicone around the cleaned contact pad thereafter contains a trace amount of sodium bicarbonate.Type: ApplicationFiled: October 23, 2013Publication date: February 20, 2014Applicant: Bridgelux, Inc.Inventors: R. Scott West, Tao Tong, Mike Kwon
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Packaging photon building blocks having only top side connections in a molded interconnect structure
Patent number: 8652860Abstract: Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.Type: GrantFiled: April 8, 2012Date of Patent: February 18, 2014Assignee: Bridgelux, Inc.Inventors: R. Scott West, Tao Tong, Mike Kwon, Michael Solomensky -
Patent number: 8647298Abstract: A surgical apparatus having an expandable structure including first, second and third spines forming a basket, movable between expanded and contracted positions. Each of the spines has first, second and third lumens, wherein an electrode element is movable within the first lumen of the first, second and third spines through a first opening in the spine. The second lumen of the first and second spines carries a temperature sensing element, the temperature sensing element exposed through a second opening in the spine positioned between the first and second lumens. The second lumen of the third spine is configured to receive a guidewire, and the third lumen of the first, second and third spines is connectable to a tube for carrying cooling fluid therethrough.Type: GrantFiled: October 21, 2012Date of Patent: February 11, 2014Assignee: Mederi Therapeutics Inc.Inventors: Scott West, David S Utley, John W Gaiser
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Publication number: 20140005473Abstract: Integrated systems and associated method for manipulating tissues and anatomical or other structures in medical applications for the purpose of treating diseases or disorders or other purposes. In one aspect, the system includes a delivery device configured to deploy and implant anchor devices for such purposes.Type: ApplicationFiled: September 3, 2013Publication date: January 2, 2014Applicant: Neotract, IncInventors: Joseph Catanese, III, Matthew McLean, Theodore C. Lamson, Amik Nagpurkar, Daniel Merrick, Joshua Makower, Claude Vidal, Russell J. Redmond, Michael Collinson, Mitchell C. Barham, Scott West
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Publication number: 20130337592Abstract: Using compression molding to form lenses over LED arrays on a metal core printed circuit board leaves a flash layer of silicone covering the contact pads that are later required to connect the arrays to power. A method for removing the flash layer involves blasting particles of sodium bicarbonate at the flash layer. A nozzle is positioned within thirty millimeters of the top surface of the flash layer. The stream of air that exits from the nozzle is directed towards the top surface at an angle between five and thirty degrees away from normal to the top surface. The particles of sodium bicarbonate are added to the stream of air and then collide into the top surface of the silicone flash layer until the flash layer laterally above the contact pads is removed. The edge of silicone around the cleaned contact pad thereafter contains a trace amount of sodium bicarbonate.Type: ApplicationFiled: August 21, 2013Publication date: December 19, 2013Applicant: Bridgelux, Inc.Inventors: R. Scott West, Tao Tong, Mike Kwon
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Patent number: 8610153Abstract: Using compression molding to form lenses over LED arrays on a metal core printed circuit board leaves a flash layer of silicone covering the contact pads that are later required to connect the arrays to power. A method for removing the flash layer involves blasting particles of sodium bicarbonate at the flash layer. A nozzle is positioned within thirty millimeters of the top surface of the flash layer. The stream of air that exits from the nozzle is directed towards the top surface at an angle between five and thirty degrees away from normal to the top surface. The particles of sodium bicarbonate are added to the stream of air and then collide into the top surface of the silicone flash layer until the flash layer laterally above the contact pads is removed. The edge of silicone around the cleaned contact pad thereafter contains a trace amount of sodium bicarbonate.Type: GrantFiled: August 21, 2013Date of Patent: December 17, 2013Assignee: Bridgelux, Inc.Inventors: R. Scott West, Tao Tong, Mike Kwon
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Patent number: 8603106Abstract: Integrated systems and associated method for manipulating tissues and anatomical or other structures in medical applications for the purpose of treating diseases or disorders or other purposes. In one aspect, the system includes a delivery device configured to deploy and implant anchor devices for such purposes.Type: GrantFiled: June 1, 2010Date of Patent: December 10, 2013Assignee: NeoTract, Inc.Inventors: Joseph Catanese, III, Matthew McLean, Theodore C. Lamson, Amik Nagpurkar, Daniel Merrick, Joshua Makower, Claude Vidal, Russell J. Redmond, Michael Collinson, Mitchell C. Barham, Scott West
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Patent number: 8597290Abstract: A sphincter tissue region is treated using a support structure sized for advancement into the anal canal. At least one electrode is carried by the structure. A mechanism is coupled to the electrode to move the electrode between a first position retracted in the support structure and a second position extended from the support structure through surface tissue to penetrate a subsurface tissue region at or near a sphincter in the anal canal. A cable is coupled to the electrode to conduct energy for application by the electrode to form a lesion in the subsurface tissue region.Type: GrantFiled: April 20, 2010Date of Patent: December 3, 2013Assignee: Mederi TherapeuticsInventors: David Utley, Scott West, John Gaiser, Rachel Croft
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Publication number: 20130292709Abstract: An LED device with improved angular color performance has a silicone lens shaped as a portion of a sphere. The lens is molded over an array of LED dies disposed on the upper surface of a substrate. Phosphor particles are disbursed throughout the material used to mold the lens. The distance between farthest apart edges of the LED dies is more than half of the length that the lens extends over the surface of the substrate. The distance from the top of the lens dome to the surface of the substrate is between 57% and 73% of the radius of the sphere. Shaping the lens as the top two thirds of a hemisphere reduces the non-uniformity in the emitted color such that neither of the CIE color coordinates x or y of the color changes more than 0.004 over all emission angles relative to the surface of the substrate.Type: ApplicationFiled: April 19, 2013Publication date: November 7, 2013Inventors: Tao Tong, Wenhui Zhang, R. Scott West
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Patent number: 8536605Abstract: Using compression molding to form lenses over LED arrays on a metal core printed circuit board leaves a flash layer of silicone covering the contact pads that are later required to connect the arrays to power. A method for removing the flash layer involves blasting particles of sodium bicarbonate at the flash layer. A nozzle is positioned within thirty millimeters of the top surface of the flash layer. The stream of air that exits from the nozzle is directed towards the top surface at an angle between five and thirty degrees away from normal to the top surface. The particles of sodium bicarbonate are added to the stream of air and then collide into the top surface of the silicone flash layer until the flash layer laterally above the contact pads is removed. The edge of silicone around the cleaned contact pad thereafter contains a trace amount of sodium bicarbonate.Type: GrantFiled: November 28, 2011Date of Patent: September 17, 2013Assignee: Bridgelux, Inc.Inventors: R. Scott West, Tao Tong, Mike Kwon